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公开(公告)号：US20200334446A1
公开(公告)日：2020-10-22
申请号：US16959415
申请日：2018-12-19
Applicant: ASML Netherlands B.V.
Inventor： Wei FANG
IPC: G06K9/00 , G01R31/307
Abstract: Systems and methods for detecting defects are disclosed. According to certain embodiments, a method of performing image processing includes acquiring one or more images of a sample, performing first image analysis on the one or more images, identifying a plurality of first features in the one or more images, determining pattern data corresponding to the plurality of first features, selecting at least one of the plurality of first features based on the pattern data, and performing second image analysis of the at least one of the plurality of first features. Methods may also include determining defect probability of the plurality of first features based on the pattern data. Selecting the at least one of the plurality of first features may be based on the defect probability.
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公开(公告)号：US10809193B2
公开(公告)日：2020-10-20
申请号：US16362922
申请日：2019-03-25
Applicant: ASML Netherlands B.V. , ASML Holding N.V.
Inventor： Marinus Johannes Maria Van Dam , Richard Carl Zimmerman
Abstract: An inspection apparatus or lithographic apparatus includes an optical system and a detector. The optical system includes a non-linear prismatic optic. The optical system is configured to receive zeroth and first diffraction order beams reflected from a diffraction target and separate first and second polarizations of each diffraction order beam. The detector is configured to simultaneously detect first and second polarizations of each of the zeroth and first diffraction order beams. Based on the detected first and second polarizations of one or more diffraction orders, an operational parameter of a lithographic apparatus can be adjusted to improve accuracy or precision in the lithographic apparatus. The optical system can include a plurality of non-linear prismatic optics. For example, the optical system can include a plurality of Wollaston prisms.
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公开(公告)号：US20200326637A1
公开(公告)日：2020-10-15
申请号：US15779758
申请日：2016-11-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Bram VAN HOOF , Jeroen COTTAAR
Abstract: Combination of a stage and a level sensor configured to sense a height level at a target location on an object is described, the stage comprising an object table configured to hold the object and a positioning device for displacing the object table relative to the level sensor in a first direction, the level sensor comprising a projection system configured to project a measurement beam onto a measurement area of the object, the measurement area having a measurement area length in the first direction, a detector system configured to receive different portions of the measurement beam after being reflected off different sub-areas within the measurement area, the different sub-areas being arranged in the first direction, and to supply output signals representative of the different portions received, a signal processing system configured to process the output signals from the detector system.
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公开(公告)号：US20200319563A1
公开(公告)日：2020-10-08
申请号：US16753441
申请日：2018-08-23
Applicant: ASML NETHERLANDS B.V.
Inventor： Beniamino SCIACCA , Sanjaysingh LALBAHADOERSING , Jia WANG
Abstract: A resonant amplitude grating mark has a periodic structure configured to scatter radiation incident on a surface plane of the alignment mark. The scattering is mainly by excitation of a resonant mode in the periodic structure parallel to the surface plane. The effective refractive indexes and lengths of portions of the periodic structure are configured to provide an optical path length of the unit cell in the direction of periodicity that equals an integer multiple of a wavelength present in the spectrum of the radiation. The effective refractive indexes and lengths of the portions are also configured to provide an optical path length of the second portion in the direction of periodicity that is equal to half of the wavelength present in the spectrum of the radiation.
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公开(公告)号：US20200317504A1
公开(公告)日：2020-10-08
申请号：US16841044
申请日：2020-04-06
Applicant: ASML Netherlands B.V.
Inventor： Yongxin WANG , Rui-Ling LAI , Qian ZHANG
Abstract: The present disclosure describes an image forming element having a semiconductor chip with micro-electro-mechanical-system (MEMS) devices and voltage generators, each voltage generator being configured to generate a voltage used by one or more of the MEMS devices. A floating ground may be used to add a voltage to the voltage generated by the voltage generators. The semiconductor chip may include electrical connections, where each voltage generator is configured to provide the voltage to the one or more MEMS devices through the electrical connections. The MEMS devices may define a boundary in the semiconductor chip within which the MEMS devices, the voltage generators, and the electrical connections are located. Each MEMS device may generate an electrostatic field to manipulate an electron beamlet of a multi-beam charged particle microscope. The MEMS devices may be organized into groups based on a distance to a reference location (e.g., optical axis) in the semiconductor chip.
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Patent Agency Ranking
公开(公告)号：US10795266B2
公开(公告)日：2020-10-06
申请号：US15893305
申请日：2018-02-09
Applicant: ASML NETHERLANDS B.V.
IPC: G03F7/20
Abstract: A model-based tuning method for tuning a first lithography system utilizing a reference lithography system, each of which has tunable parameters for controlling imaging performance. The method includes the steps of defining a test pattern and an imaging model; imaging the test pattern utilizing the reference lithography system and measuring the imaging results; imaging the test pattern utilizing the first lithography system and measuring the imaging results; calibrating the imaging model utilizing the imaging results corresponding to the reference lithography system, where the calibrated imaging model has a first set of parameter values; tuning the calibrated imaging model utilizing the imaging results corresponding to the first lithography system, where the tuned calibrated model has a second set of parameter values; and adjusting the parameters of the first lithography system based on a difference between the first set of parameter values and the second set of parameter values.
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公开(公告)号：US10788766B2
公开(公告)日：2020-09-29
申请号：US16611500
申请日：2018-03-06
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus Goorden , Simon Reinald Huisman , Duygu Akbulut , Alessandro Polo , Simon Gijsbert Josephus Mathijssen
Abstract: Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarization state and an optical collection system configured to collect scattered radiation, following scattering of the illumination radiation by the metrology mark. The metrology mark comprises a main structure and changes, relative to the first polarization state, at least one of a polarization state of a first portion of the scattered radiation predominately resultant from scattering by the main structure and a polarization state of a second portion of radiation predominately resultant from scattering by one or more features other than the main structure, such that the polarization state of the first portion of the scattered radiation is different to the polarization state of the second portion of the scattered radiation. The metrology sensor apparatus further comprises an optical filtering system which filters out the second portion of the scattered radiation based on its polarization state.
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公开(公告)号：US10788765B2
公开(公告)日：2020-09-29
申请号：US16478068
申请日：2018-01-10
Applicant: ASML NETHERLANDS B.V.
Inventor： Stefan Michiel Witte , Alessandro Antoncecchi , Stephen Edward , Hao Zhang , Paulus Clemens Maria Planken , Kjeld Sijbrand Eduard Eikema , Sebastianus Adrianus Goorden , Simon Reinald Huisman , Irwan Dani Setija
Abstract: As increasing numbers of layers, using increasing numbers of specific materials, are deposited on substrates, it becomes increasingly difficult to detect alignment marks accurately for, for example, applying a desired pattern onto a substrate using a lithographic apparatus, in part due to one or more of the materials used in one or more of the layers being wholly or partially opaque to the radiation used to detect alignment marks. In a first step, the substrate is illuminated with excitation radiation. In a second step, at least one effect associated with a reflected material effect scattered by a buried structure is measured. The effect may, for example, include a physical displacement of the surface of the substrate. In a third step, at least one characteristic of the structure based on the measured effect is derived.
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公开(公告)号：US10788761B2
公开(公告)日：2020-09-29
申请号：US16344831
申请日：2017-10-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Leon Paul Van Dijk , Victor Emanuel Calado , Xing Lan Liu , Richard Johannes Franciscus Van Haren
Abstract: A method of determining an optimal operational parameter setting of a metrology system is described. Free-form substrate shape measurements are performed. A model is applied, transforming the measured warp to modeled warp scaling values. Substrates are clamped to a chuck, causing substrate deformation. Alignment marks of the substrates are measured using an alignment system with four alignment measurement colors. Scaling values thus obtained are corrected with the modeled warp scaling values to determine corrected scaling values. An optimal alignment measurement color is determined, based on the corrected scaling values. Optionally, scaling values are selected that were measured using the optimal alignment measurement color and a substrate grid is determined using the selected scaling values. A substrate may be exposed using the determined substrate grid to correct exposure of the substrate.
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公开(公告)号：US20200303155A1
公开(公告)日：2020-09-24
申请号：US16753285
申请日：2018-10-02
Applicant: ASML Netherlands B.V.
Inventor： Xuerang HU , Xuedong LIU , Weiming REN , Zhong-wei CHEN
IPC: H01J37/09 , H01J37/147 , H01J37/153 , H01J37/28 , H01J37/12
Abstract: A multi-beam apparatus for multi-beam inspection with an improved source conversion unit providing more beamlets with high electric safety, mechanical availability and mechanical stabilization has been disclosed. The source-conversion unit comprises an image-forming element array having a plurality of image-forming elements, an aberration compensator array having a plurality of micro-compensators, and a pre-bending element array with a plurality of pre-bending micro-deflectors. In each of the arrays, adjacent elements are placed in different layers, and one element may comprise two or more sub-elements placed in different layers. The sub-elements of a micro-compensator may have different functions such as micro-lens and micro-stigmators.
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