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公开(公告)号：US20210136357A1
公开(公告)日：2021-05-06
申请号：US17129754
申请日：2020-12-21
发明人： Mingzhu WANG , Baozhong ZHANG , Chunmei LIU
IPC分类号： H04N17/00
摘要： A 3D test chart, an adjusting arrangement, a forming method, and an adjusting method thereof are disclosed. The 3D test chart provides a plurality of test patterns arranged at different depths. When testing a photographic arrangement, the photographic arrangement is only required to move for one time or even does not need to be moved, so as to obtain an image containing information of different depths, so that the testing and adjusting process of the photographic arrangement can be easily achieved.
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公开(公告)号：US10996422B2
公开(公告)日：2021-05-04
申请号：US16127682
申请日：2018-09-11
发明人： Mingzhu Wang , Hailong Liao , Yiqi Wang , Chunmei Liu , Shuijia Chu
摘要： A method for assembling a camera module includes arranging a first sub-lens assembly and a photosensitive assembly on an optical axis of a second sub-lens assembly to form an optical system capable of imaging. The method includes increasing an actual measured resolution of imaging of the optical system to a first threshold by adjusting a relative position of the first sub-lens assembly with respect to the second sub-lens assembly. The method includes decreasing an actual measured image plane inclination of imaging of the optical system, obtained by using the photosensitive element, to a second threshold by adjusting an angle of an axis of the photosensitive assembly with respect to a central axis of the second sub-lens assembly. The method includes connecting the first sub-lens assembly, the second sub-lens assembly, and the photosensitive assembly. A corresponding camera module is also included.
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公开(公告)号：US10986258B2
公开(公告)日：2021-04-20
申请号：US16569601
申请日：2019-09-12
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , H05K1/02 , H05K1/18 , H05K3/28 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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公开(公告)号：US10827103B2
公开(公告)日：2020-11-03
申请号：US16311894
申请日：2017-06-23
发明人： Zhenyu Chen , Mingzhu Wang , Xiaojuan Su , Bojie Zhao
摘要： The present invention provides a fixed-focus camera module and a manufacturing method therefor. The fixed-focus camera module comprises a light-sensitive chip, an optical lens assembly, and a lens base. The optical lens assembly is directed packaged in the lens base, and the optical lens assembly is kept in a light-sensitive path of the light-sensitive chip. In this manner, the size and the manufacturing costs of the fixed-focus camera module can be effectively reduced, so as to improve the product competitiveness of the fixed-focus camera module.
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公开(公告)号：US20200319423A1
公开(公告)日：2020-10-08
申请号：US16908399
申请日：2020-06-22
发明人： Chunmei LIU , Yiqi WANG , Liang DING , Mingzhu WANG , Hailong LIAO , Nan GUO
摘要： A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.
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公开(公告)号：US10735637B2
公开(公告)日：2020-08-04
申请号：US16436934
申请日：2019-06-11
发明人： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC分类号： H04N5/225 , H04N13/239 , H01L27/146
摘要： A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US10708480B2
公开(公告)日：2020-07-07
申请号：US16028367
申请日：2018-07-05
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Takehiko Tanaka , Bojie Zhao , Zilong Deng
IPC分类号： H04N5/225 , B29C45/14 , B29C33/44 , G02B19/00 , G02B7/10 , B29C70/72 , B29C70/88 , G02B13/00 , H05K1/02 , H05K1/18 , H05K3/28 , B29C43/18 , B29C43/36 , B29C43/52 , G02B7/02 , B29L31/34 , B29C45/40 , B29C45/00 , B29D11/00 , B29L31/00 , B29K101/12
摘要： A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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48.发明授权公开(公告)号：US10678016B2
公开(公告)日：2020-06-09
申请号：US16427369
申请日：2019-05-31
发明人： Mingzhu Wang , Heng Jiang , Feifan Chen , Chunmei Liu , Bojie Zhao , Nan Guo , Liang Ding
摘要： A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
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公开(公告)号：US20200158980A1
公开(公告)日：2020-05-21
申请号：US16496192
申请日：2018-03-23
发明人： Mingzhu Wang , Chunmei LIU , Shoujie WANG , Nan GUO , Lifeng YAO , Liang DING
摘要： Disclosed are a split lens assembly and a camera module. The split lens assembly comprises a first lens module and a second lens module. The first lens module is assembled to the second lens module. The first lens module and the second lens module are calibrated and assembled. A spacing that facilitates calibration is located between the first lens module and the second lens module.
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50.发明授权公开(公告)号：US10353167B2
公开(公告)日：2019-07-16
申请号：US15784166
申请日：2017-10-15
发明人： Mingzhu Wang , Heng Jiang , Feifan Chen , Chunmei Liu , Bojie Zhao , Nan Guo , Liang Ding
摘要： A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.
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