Abstract:
There is disclosed a method of manufacturing a flash memory device by which an insulating film spacer is formed on both sidewalls of a gate electrode and a drain region is then formed. Thus, the present invention can improve coverage during a deposition process for forming a select gate and reduce the overlapping area of a floating gate and a drain region. Therefore, as the resistance of the select gate itself is reduced depending on the coverage, the present invention can increase the operating speed of a device and can improve the erase characteristic by F-N tunneling due to reduced overlapping area.
Abstract:
A method of erasing a semiconductor memory device comprises grouping a plurality of word lines of each memory block into at least two groups based on intensity of disturbance between neighboring word lines; performing an erase operation by applying a ground voltage to all word lines of a selected memory block and by applying an erase voltage to a well of the selected memory block; and first increasing the ground voltage of one group of the groups to a positive voltage during the erase operation.
Abstract:
A method of manufacturing a nonvolatile memory device wherein first gate lines and second gate lines are formed over a semiconductor substrate. The first gate lines are spaced-from each other at a first width, the second gate lines are spaced-from each other at a second width, and the first width is wider than the second width. A first ion implantation process of forming first junction regions in the semiconductor substrate between the first gate lines and the second gate lines is performed. A second ion implantation process of forming second junction regions in the respective first junction regions between the first gate lines is then performed.
Abstract:
A semiconductor memory device includes cell gate lines arranged in parallel over a semiconductor substrate, gate lines for select transistors disposed over the semiconductor substrate adjacent to the gate lines of the outermost memory cells, from among the gate lines for the memory cells, and metal lines coupled to the select transistors through contacts.
Abstract:
A flash memory device includes a memory cell array on which data is stored, and page buffers that are connected to the memory cells through the bit lines and apply one of the first voltage, second voltage or third voltage between the first and second voltage, to the respective bit line when performing the program.
Abstract:
In a method of programming a nonvolatile memory device, when a program is performed, a program voltage is applied to a first word line selected for the program. A first pass voltage is applied to three second word lines neighboring the first word line toward a source select line. First and second voltages are applied to third and fourth word lines neighboring the first word line toward the source select line. A second pass voltage is applied to the remaining word lines other than the first to fourth word lines.
Abstract:
In a program method of a flash memory device where memory cells within a string are turned on to electrically connect channel regions, all of the channel regions within a second string are precharged uniformly by applying a ground voltage to a first bit line connected to a first string including to-be-programmed cells and a program-inhibited voltage to a second bit line connected to the second string including program-inhibited cells. If a program operation is executed, channel boosting occurs in the channel regions within the second string including the program-inhibited cells. Accordingly, a channel boosting potential can be increased and a program disturbance phenomenon, in which the threshold voltage of program-inhibited cells is changed, can be prevented.
Abstract:
A method of programming a nonvolatile memory device includes inputting program data to page buffers; performing a program operation and a program verification operation until threshold voltages of memory cells included in a selected page reach a target level according to the program data; when the threshold voltages of the memory cells reach the target level, performing an over-program verification operation to determine over-programmed memory cells in the memory cells; and making a determination of whether error checking and correction (ECC) processing for the over-programmed memory cells is feasible.
Abstract:
The present invention relates to a method of operating a non-volatile memory device. In an aspect of the present invention, the method includes performing a first program operation on the entire memory cells, measuring a first program speed of a reference memory cell, storing the first program speed in a program speed storage unit, repeatedly performing a program/erase operation until before a number of the program/erase operation corresponds to a specific reference value, when the number of the program/erase operation corresponds to the specific reference value, measuring a second program speed of the reference memory cell, calculating a difference between the first program speed and the second program speed, resetting a program start voltage according to the calculated program speed difference, and performing the program/erase operation based on the reset program start voltage.
Abstract:
The present invention relates to a method of operating a non-volatile memory device. In an aspect of the present invention, the method includes performing a first program operation on the entire memory cells, measuring a first program speed of a reference memory cell, storing the first program speed in a program speed storage unit, repeatedly performing a program/erase operation until before a number of the program/erase operation corresponds to a specific reference value, when the number of the program/erase operation corresponds to the specific reference value, measuring a second program speed of the reference memory cell, calculating a difference between the first program speed and the second program speed, resetting a program start voltage according to the calculated program speed difference, and performing the program/erase operation based on the reset program start voltage.