公开(公告)号：US20080242198A1

公开(公告)日：2008-10-02

申请号：US11691190

申请日：2007-03-26

Applicant: Lee-Lee Lau ,  Chin-Kun Lin ,  Boon-Tiong Neo ,  Ching-Wen Teng

Inventor： Lee-Lee Lau ,  Chin-Kun Lin ,  Boon-Tiong Neo ,  Ching-Wen Teng

IPC: B24C1/00

CPC classification number: B24B1/00 ,  B24B37/013 ,  B24B37/04

Abstract: A multi-step planarizing and polishing method includes performing a first and a second polishing steps, wherein one of the two polishing steps is performed using a silica abrasive based slurry, while the other one of the two polishing steps is performed using a CeO2 abrasive based slurry. A third polishing step is further performed using a fixed abrasive pad. Further, the thickness deviation of wafers entering the third polishing step is controlled.

Abstract translation: 多步平面化和抛光方法包括进行第一和第二抛光步骤，其中两个抛光步骤之一使用二氧化硅研磨剂浆料进行，而两个抛光步骤中的另一个是使用CeO _{2 磨料基浆料。 使用固定的研磨垫进一步进行第三研磨步骤。 此外，控制进入第三研磨步骤的晶片的厚度偏差。}

公开(公告)号：US20080229001A1

公开(公告)日：2008-09-18

申请号：US11800133

申请日：2007-05-04

Applicant: Li Hui Lu ,  Kun Lin Liu

Inventor： Li Hui Lu ,  Kun Lin Liu

IPC: G06F12/02 ,  G06F13/12

CPC classification number: G06F3/0661 ,  G06F3/0607 ,  G06F3/0688

Abstract: A solid memory module with extensible capacity includes at least a non-volatile memory module, each of which has at least a memory chip and a first connector, and at least a second connector, which electrically connects the first connector of the volatile memory module, at least a control unit and as a system interface. This control unit obtains external signals by this system interface and then transmits to this non-volatile memory module by the control unit to store or use the memory content.

Abstract translation: 具有可扩展容量的固体存储器模块包括至少一个非易失性存储器模块，每个非易失性存储器模块至少具有存储器芯片和第一连接器，以及至少第二连接器，其将易失性存储器模块的第一连接器电连接， 至少一个控制单元和一个系统接口。 该控制单元通过该系统接口获得外部信号，然后由控制单元向该非易失性存储器模块发送存储或使用存储器内容。

公开(公告)号：US20080186191A1

公开(公告)日：2008-08-07

申请号：US12081014

申请日：2008-04-09

Applicant: Chang Shen-Kuen ,  Lu Chung-Hsien ,  Chao Hao-Ting ,  Chang Shih-Hua ,  Hsu Yu-Ren ,  Huang Kun-Lin ,  Wang Cheng-Wei

Inventor： Chang Shen-Kuen ,  Lu Chung-Hsien ,  Chao Hao-Ting ,  Chang Shih-Hua ,  Hsu Yu-Ren ,  Huang Kun-Lin ,  Wang Cheng-Wei

IPC: G08B17/10 ,  G06K9/00

CPC classification number: G06K9/00771 ,  G08B17/125

Abstract: A smoke detecting method and device are provided. The smoke detecting method and device capture a plurality of images; determine one of the plurality of images as an analyzable image when the one of the plurality of images is identified to have a moving object; analyze a chrominance variation of the analyzable image; analyze at least one of an edge blur and a flickering frequency of the analyzable image; compare at least one of analyzed results from the analyzing steps with a corresponding predetermined feature; and determine the moving object is a smoke when at least one of the analyzed results conforms to the corresponding predetermined feature.

Abstract translation: 提供烟雾检测方法和装置。 烟雾检测方法和装置捕获多个图像; 当多个图像中的一个被识别为具有移动对象时，将多个图像中的一个确定为可分析图像; 分析可分析图像的色度变化; 分析可分析图像的边缘模糊和闪烁频率中的至少一个; 将来自分析步骤的分析结果中的至少一个与相应的预定特征进行比较; 并且当分析结果中的至少一个符合相应的预定特征时，确定移动物体是烟。

公开(公告)号：US20080083134A1

公开(公告)日：2008-04-10

申请号：US11543167

申请日：2006-10-05

Applicant: Ping-Kun Lin

Inventor： Ping-Kun Lin

IPC: A43C11/00 ,  A43C7/00

CPC classification number: A43C7/00 ,  Y10T24/3703

Abstract: A rope retainer comprises a body has a top surface, a bottom surface and a lateral surface; at least one main hole passed through the body; at least one wing extending from the body; the wing having at least one sub-hole. The rope retainer may have a long shape, a star like shape or a heart like shape. Furthermore the rope retainer can be used with a shoe for tying a shoelace.

Abstract translation: 绳保持器包括主体，其具有顶表面，底表面和侧表面; 至少一个主孔穿过身体; 至少一个从身体延伸的翼; 翼具有至少一个子孔。 绳保持器可以具有长形状，星形形状或心形状。 此外，绳子保持器可以与用于绑扎鞋带的鞋一起使用。

公开(公告)号：US07327568B2

公开(公告)日：2008-02-05

申请号：US11105353

申请日：2005-04-14

Applicant: Yung Kun Lin

Inventor： Yung Kun Lin

IPC: H05K5/00 ,  H05K7/20 ,  F28F7/00

CPC classification number: G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink assembly having rotatable fins includes a housing, a first heat dissipating device, a rod, an elastic member and a lever. The housing includes a first sidewall having a first hole, a first sliding hole and a stop portion, and a second sidewall having a second hole and a second sliding hole. The first heat dissipating device is in the housing and has a third hole, a first protrusion sliding in the first sliding hole, and a second protrusion sliding in the second sliding hole. The rod passes through the first, second and third holes. The first heat dissipating device rotates between a first position and a second position with the rod of being a rotating center. A first end of the elastic member connects with the stop portion, and a second end thereof connects with the first protrusion. The lever moves with the second protrusion.

Abstract translation: 具有可旋转翅片的散热器组件包括壳体，第一散热装置，杆，弹性构件和杆。 壳体包括具有第一孔，第一滑动孔和止挡部分的第一侧壁和具有第二孔和第二滑动孔的第二侧壁。 第一散热装置在壳体中，并且具有第三孔，在第一滑动孔中滑动的第一突起和在第二滑动孔中滑动的第二突起。 杆穿过第一，第二和第三孔。 第一散热装置在第一位置和第二位置之间以杆为旋转中心的方式旋转。 弹性构件的第一端与止动部连接，其第二端与第一突起连接。 杠杆随着第二突起移动。

公开(公告)号：US20070240734A1

公开(公告)日：2007-10-18

申请号：US11279754

申请日：2006-04-14

Applicant: Ching-Wen Teng ,  Chin-Kun Lin ,  Yu-Hsiang Tseng ,  Boon-Tiong Neo

Inventor： Ching-Wen Teng ,  Chin-Kun Lin ,  Yu-Hsiang Tseng ,  Boon-Tiong Neo

IPC: B08B3/12 ,  C23G1/02 ,  B08B3/00 ,  C23G1/00

CPC classification number: C23G1/103 ,  C11D11/0047 ,  C23G1/20 ,  H01L21/02074

Abstract: A post-CMP wafer is loaded into a buffer unit of a cleaning apparatus and is kept moist by adding a chemical. The post-CMP wafer is then loaded into a cleaning unit of the cleaning apparatus for performing the following cleaning process. The chemical added in the buffer unit is used to reduce the adhesion of benzotriazole (BTA) for improving the cleanliness of the post-CMP wafer.

Abstract translation: 后CMP晶片被装载到清洁装置的缓冲单元中，并通过添加化学品而保持湿润。 然后将CMP后的晶片装载到清洁装置的清洁单元中，以执行以下清洁处理。 缓冲单元中添加的化学物质用于降低苯并三唑（BTA）的粘附力，以提高CMP后的清洁度。

公开(公告)号：US20070153456A1

公开(公告)日：2007-07-05

申请号：US11500900

申请日：2006-08-09

Applicant: Yung-Kun Lin

Inventor： Yung-Kun Lin

IPC: G06F1/16

CPC classification number: G06F1/1624 ,  G06F1/1616 ,  G06F1/1647

Abstract: An electronic device includes a housing. The housing includes a cavity for inserting a display monitor and a support module. When the display monitor is extended outside the housing, the support module is moves along the track while coupled to the track for loading the display monitor. When the display monitor is fully extended, the support module then rotates with a specific angle forming an open position to allow the display monitor to be viewed uncovered outside the housing. The display monitor can also be lodged within the housing to protect the monitor surface and to utilize electricity saving features.

Abstract translation: 电子设备包括壳体。 壳体包括用于插入显示监视器和支撑模块的空腔。 当显示器监视器延伸到壳体外部时，支撑模块沿着轨道移动，同时耦合到轨道以加载显示监视器。 当显示器监视器完全伸出时，支撑模块然后以特定角度旋转，形成打开位置，以允许显示监视器被覆盖在壳体外部。 显示监视器还可以放置在外壳内，以保护显示器表面并利用节电功能。

公开(公告)号：US20070111517A1

公开(公告)日：2007-05-17

申请号：US11164204

申请日：2005-11-14

Applicant: Boon-Tiong Neo ,  Chin-Kun Lin ,  Lee-Lee Lau

Inventor： Boon-Tiong Neo ,  Chin-Kun Lin ,  Lee-Lee Lau

IPC: H01L21/4763 ,  H01L21/461 ,  H01L21/302

CPC classification number: H01L21/3212 ,  B24B37/042 ,  H01L21/7684

Abstract: A copper/barrier CMP process includes (a) providing a substrate having a bulk metal layer and a barrier layer; (b) polishing the substrate with a first hard polishing pad on a first platen to substantially remove an upper portion of the bulk metal layer, wherein the first hard polishing pad has a hardness of above 50 (Shore D); (c) polishing the substrate with a second hard polishing pad on a second platen to remove residual copper, thereby exposing the barrier layer, wherein the second hard polishing pad has a hardness of above 50 (Shore D); and (d) polishing the substrate with a third hard polishing pad on a third platen to remove the barrier layer, wherein the third hard polishing pad has a hardness ranging between 40-50 (Shore D).

Abstract translation: 铜/阻挡CMP工艺包括（a）提供具有块状金属层和阻挡层的基板; （b）用第一台板上的第一硬抛光垫抛光所述基板，以基本上移除所述本体金属层的上部，其中所述第一硬抛光垫具有高于50的硬度（肖氏D）; （c）用第二压板上的第二硬抛光垫抛光衬底以除去残留的铜，从而暴露阻挡层，其中第二硬抛光垫的硬度大于50（肖氏D）; 和（d）用第三平板上的第三硬质抛光垫抛光衬底以除去阻挡层，其中第三硬质抛光垫的硬度范围在40-50（肖氏D）之间。

公开(公告)号：US20060274801A1

公开(公告)日：2006-12-07

申请号：US11143374

申请日：2005-06-01

Applicant: Ashish Tandon ,  Kostadin Djordjev ,  Chao-Kun Lin ,  Michael Tan

Inventor： Ashish Tandon ,  Kostadin Djordjev ,  Chao-Kun Lin ,  Michael Tan

IPC: H01S5/00

CPC classification number: B82Y20/00 ,  H01S5/34 ,  H01S5/3407

Abstract: In accordance with the invention, increased maximum modulation speeds and improved hole distribution are obtained for light emitting devices. Barrier layers of a quantum well structure for a light emitting device are formed with varying barrier energy heights. Quantum well layers of the quantum well structure are formed between the barrier layers.

公开(公告)号：US20060078254A1

公开(公告)日：2006-04-13

申请号：US10961940

申请日：2004-10-08

Applicant: Kostadin Djordjev ,  Chao-Kun Lin ,  Michael Tan

Inventor： Kostadin Djordjev ,  Chao-Kun Lin ,  Michael Tan

IPC: G02B6/42 ,  G02B6/26

CPC classification number: G02B6/12007

Abstract: Embodiments of the invention involve a monolithic vertical configuration for coupling a ring resonator and a bus waveguides. The monolithic vertical coupling arrangement, with the epitaxial grown coupling between the waveguide and the resonator, provides control of the coupling coefficient. The vertical coupling arrangement allows for different material compositions in the waveguide and resonator structures, e.g. active quantum well resonators and transparent waveguides, to facilitate the design of active WDM components.

Abstract translation: 本发明的实施例涉及用于耦合环形谐振器和总线波导的单片垂直配置。 具有波导和谐振器之间的外延生长耦合的单片垂直耦合布置提供了耦合系数的控制。 垂直耦合布置允许波导和谐振器结构中的不同材料组成，例如。 有源量子阱谐振器和透明波导，以方便有源WDM器件的设计。