公开(公告)号：US20250132275A1

公开(公告)日：2025-04-24

申请号：US18909082

申请日：2024-10-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangho Cha ,  Yunrae Cho

IPC: H01L23/00 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes a semiconductor substrate, connection pads on a bottom surface of the semiconductor substrate, and connection bumps respectively on the connection pads, wherein the connection bumps include an extension bump and a non-extension bump, wherein the extension bump includes an extension seed layer on a respective one of the connection pads and a first conductive pillar on the extension seed layer, and wherein the extension seed layer longitudinally extends in a first extension direction.

公开(公告)号：US20250132257A1

公开(公告)日：2025-04-24

申请号：US18650306

申请日：2024-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyo Jin KIM ,  Dong Hoon HWANG ,  Min Chan GWAK

IPC: H01L23/535 ,  H01L23/528 ,  H01L23/532 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/775

Abstract: A semiconductor device may include a via pattern connected to a conductive pattern on a substrate, the via pattern including a lower via pattern and an upper via pattern stacked on the lower via pattern, and a wiring line connected to the upper via pattern and extending in a second direction. The wiring line may include a same metal as the upper via pattern. A bottom width of the wiring line may be greater than a top width of the wiring line. a widths of an upper face of the lower via pattern may be equal to width of the bottom face of the upper via pattern.

公开(公告)号：US20250132253A1

公开(公告)日：2025-04-24

申请号：US18625341

申请日：2024-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taejin PARK ,  Hyeonkyu LEE ,  Sungsoo YIM

IPC: H01L23/528 ,  H10B12/00

Abstract: A semiconductor memory device includes a conductive line extending in a first direction, first and second channel regions connected to the conductive line, contact plugs apart from the conductive line in a vertical direction with the first and second channel regions therebetween, a back gate electrode extending in a second direction perpendicular to the first direction between the first and second channel regions, and a back gate dielectric film covering surfaces of the back gate electrode, wherein the back gate dielectric film includes a vertical extension portion arranged between the back gate electrode and each of the first and second channel regions to cover sidewalls of the back gate electrode, and a horizontal extension portion connected integrally to the vertical extension portion and covering the back gate electrode at one position selected from a first position facing the conductive line and a second position facing the contact plugs.

公开(公告)号：US20250132238A1

公开(公告)日：2025-04-24

申请号：US18991938

申请日：2024-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yukyung Park ,  Ungcheon Kim ,  Sungwoo Park ,  Seungkwan Ryu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/544 ,  H01L25/18

Abstract: Provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.

公开(公告)号：US20250132227A1

公开(公告)日：2025-04-24

申请号：US18621451

申请日：2024-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansung RYU ,  Jongbeom PARK

IPC: H01L23/48 ,  H01L23/00 ,  H01L23/522

Abstract: A semiconductor package may include a first semiconductor chip and a second semiconductor chip below the first semiconductor chip. The first semiconductor chip may include a first semiconductor substrate, a first semiconductor device and a first interconnection layer on a bottom surface of the first semiconductor substrate, a first via penetrating the first semiconductor substrate and electrically connected to the first interconnection layer, and a first pad on a bottom surface of the first interconnection layer. The second semiconductor chip may include a second semiconductor substrate, a second via penetrating the second semiconductor substrate, and a second pad on a top surface of the second semiconductor substrate and electrically connected to the second via. The first and second vias may be shifted from each other in a horizontal direction, and the first via may be horizontally spaced apart from the first pad, when viewed in a plan view.

公开(公告)号：US20250131877A1

公开(公告)日：2025-04-24

申请号：US18908330

申请日：2024-10-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeksu KWON ,  Insuk Kim ,  Jeeyeon Eom

IPC: G09G3/3225

Abstract: A display driving circuit includes an operational amplifier configured to, in a first phase of a test period, charge a source line of a display panel based on a first voltage received through a first input terminal, and in a second phase of the test period, output a comparison result signal by comparing a second voltage received through the first input terminal with a source line voltage received through a second input terminal; a discharge circuit configured to discharge the source line in the second phase; switches configured to, in the first phase, connect an output terminal of the operational amplifier to the source line, and in the second phase, connect the discharge circuit to the source line and the second input terminal of the operational amplifier; and a control logic configured to control a bias current of the operational amplifier based on the comparison result signal.

公开(公告)号：US20250131657A1

公开(公告)日：2025-04-24

申请号：US18999425

申请日：2024-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongmin KIM ,  Daehee PARK ,  Jinki JUNG ,  Saeimi CHOI

IPC: G06T19/00 ,  G06F40/30

Abstract: The present disclosure provides an electronic device and a control method therefor. The electronic device according to an embodiment of the present disclosure includes: memory for storing a plurality of images; and at least one processor, comprising processing circuitry, individually and/or collectively, configured to: generate a content to be displayed in a virtual space of metaverse using the plurality of images, select a plurality of images corresponding to a user location from among the plurality of images; obtain an object keyword included in each of the selected plurality of images; determine an object to be reflected onto the virtual space of the metaverse based on a frequency of the object keyword obtained through each of the selected plurality of images; and generate an object content corresponding to the determined object.

公开(公告)号：US20250130948A1

公开(公告)日：2025-04-24

申请号：US18643160

申请日：2024-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungjune CHO ,  Donggil KANG ,  Minsik OH ,  Yoon soo KIM ,  Jongmin KIM ,  Kyungsik UM ,  MyungGwan JEONG

IPC: G06F12/0862

Abstract: Disclosed is a storage device. The storage device includes: a memory device; a buffer memory configured to store partial data among data stored in the memory device; and a memory controller configured to determine prefetch logical addresses expected to be received sequentially after sequential logical addresses are received from a host, to read prefetch data corresponding to the prefetch logical addresses from the memory device to store the prefetch data as a prefetch group of in the buffer memory, and to release the prefetch group from the buffer memory in response to a logical address discontinuous with the logical addresses being received from the host.

公开(公告)号：US20250130671A1

公开(公告)日：2025-04-24

申请号：US18742854

申请日：2024-06-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： San-Ho Byun ,  Junchul Park ,  Taegyun Song

IPC: G06F3/041 ,  G06F3/044 ,  G09G3/20

Abstract: A touch sensor controller according to some implementations includes a reference signal generator generating a reference signal based on an input image signal and a receiver connected to a touch electrode, receiving a sensing signal from the touch electrode, and generating an output signal based on difference between the reference signal and the sensing signal.

公开(公告)号：US20250130638A1

公开(公告)日：2025-04-24

申请号：US19007470

申请日：2024-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinmo KANG ,  Sungoh KIM ,  Jihyun KIM ,  Hyungsok YEO ,  Donghyun YEOM ,  Gunhee LEE ,  Sanghun LEE ,  Bokun CHOI

IPC: G06F3/01 ,  G06T7/73 ,  H04N23/71

Abstract: An electronic device includes a sensor and a processor. The processor identifies whether a characteristic value measured from the sensor while acquiring a first image including a user's eye satisfies a designated condition. When the characteristic value satisfies the designated condition, the processor identifies a pupil position in the first image using a first scheme of extracting a feature point, based on matching with a designated pattern, acquires a second image including the user's eye, and identifies an amount of change in the second image with reference to the first image. When the amount of change in the second image is greater than or equal to a designated level, the processor calculates accuracy of the first scheme, and according to the calculated accuracy, identifies a pupil position in the second image using the first scheme, or a second scheme of extracting a feature point based on a trained network.