Abstract:
An electronic device may be provided with wireless circuitry for conveying radio-frequency signals greater than 10 GHz. The wireless circuitry may include a phased antenna array that transmits a steerable signal beam and independent antennas that are separate from the array. The array may be coupled to a first transceiver and the independent antennas may be coupled to a second transceiver. Power amplifier stages may be coupled between the second transceiver and the independent antennas to boost the gain of the independent antennas. If desired, the array and the independent antennas may be coupled to ports of the same transceiver. In this arrangement, each independent antenna may include an antenna feed that is coupled to a respective pair of ports on the transceiver. This may serve to boost the gain of the independent antennas without power amplifier circuitry. The independent antennas may have smaller footprints than the phased antenna array.
Abstract:
An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may include an antenna with an inverted-F antenna resonating element formed from portions of a peripheral conductive electronic device housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. The antenna may include a first adjustable component coupled between the antenna resonating element arm and the antenna ground on a first side of the antenna feed and a second adjustable component coupled between the antenna resonating element arm and the antenna ground on a second side of the antenna feed. Control circuitry in the electronic device may adjust the first and second adjustable components between a first tuning mode, a second tuning mode, and a third tuning mode.
Abstract:
An electronic device may be provided with wireless circuitry. The wireless circuitry may include antenna structures such as an antenna resonating element arm and an antenna ground. A split return path may be coupled between the antenna resonating element arm and the antenna ground. The antenna structures may form one or more inverted-F antennas when operated at non-near-field communications frequencies. The antenna structures may be coupled to near-field communications transceiver circuitry using a conductive path. When operated at near-field communications frequencies, near-field communications signals may be conveyed using the conductive path, the antenna resonating element arm, the return path, and the antenna ground. A capacitor may be coupled between the conductive path and an antenna ground. The capacitor may short non-near-field communications signals to the antenna ground and block near-field communications signals from passing from the conductive path to the antenna ground.
Abstract:
An electronic device may be provided with wireless circuitry and control circuitry. The wireless circuitry may include multiple antennas and transceiver circuitry. An antenna in the electronic device may have an inverted-F antenna resonating element formed from portions of a peripheral conductive electronic device housing structure and may have an antenna ground that is separated from the antenna resonating element by a gap. A split return path may bridge the gap. The split return path may be coupled between a first point on the inverted-F antenna resonating element arm and second and third points on the antenna ground. The split return path may include a first inductor coupled between the first and second points and a second inductor coupled between the first and third points. The first and second inductors may be adjustable.
Abstract:
An electronic device may have wireless circuitry with antennas. An antenna may have an inverted-F antenna resonating element, an antenna ground, and other resonating element structures. A tip of the antenna resonating element and the antenna ground may be separated by a peripheral housing gap filled with plastic. The antenna may be sensitive to capacitance changes induced by the presence of a user's hand overlapping the gap or other portions of the antenna. A hand capacitance sensing electrode may be mounted in the plastic of the gap or elsewhere in the vicinity of the antenna. A transmission line may couple the hand capacitance sensing electrode to the antenna to retune the antenna in the event that the user's hand overlaps the antenna.
Abstract:
Custom antenna structures may be used to improve antenna performance and to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may include an antenna tuning element and conductive structures formed from portions of a peripheral conductive housing member and other conductive antenna structures. The antenna tuning element may be connected across a gap in the peripheral conductive housing member. The custom antenna structures may be used to couple the antenna tuning element to a fixed custom location on the peripheral conductive housing member to help satisfy design criteria and to compensate for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance. Custom antenna structures may include springs and custom paths on dielectric supports.
Abstract:
Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may form a dual arm inverted-F antenna and an additional antenna such as a monopole antenna sharing a common antenna ground. The antenna structures may have three ports. A first antenna port may be coupled to an inverted-F antenna resonating element at a first location and a second antenna port may be coupled to the inverted-F antenna resonating element at a second location. A third antenna port may be coupled to the additional antenna. An adjustable component may be coupled to the first antenna port to tune the inverted-F antenna. The inverted-F antenna may be near-field coupled to the additional antenna so that the inverted-F antenna may serve as a tunable parasitic antenna resonating element that tunes the additional antenna.
Abstract:
An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.
Abstract:
A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.
Abstract:
An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.