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公开(公告)号：US20230260674A1
公开(公告)日：2023-08-17
申请号：US18307672
申请日：2023-04-26
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , Kiranjit Dhaliwal
Abstract: Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.
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公开(公告)号：US12266846B2
公开(公告)日：2025-04-01
申请号：US17465761
申请日：2021-09-02
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , Wansuk Yun , Flynn P. Carson
Abstract: A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flexible cable includes first surface directly coupled to the first portion of the antenna array module. The flexible cable also includes a second surface directly coupled to the second portion of the antenna array module. The flexible cable communicates signals between the first portion of the distributed antenna array module and the second portion of the antenna array module.
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公开(公告)号：US20220328212A1
公开(公告)日：2022-10-13
申请号：US17226491
申请日：2021-04-09
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , Kiranjit Dhaliwal
Abstract: Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.
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公开(公告)号：US20240243113A1
公开(公告)日：2024-07-18
申请号：US18096174
申请日：2023-01-12
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia
IPC: H01L25/16 , H01L23/00 , H01L23/31 , H01L23/498 , H01L23/538 , H01L23/552
CPC classification number: H01L25/165 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49833 , H01L23/5385 , H01L23/552 , H01L24/16 , H01L2224/16225
Abstract: A system-in-package for an electronic device with a reduced thickness is presented herein. The system-in-package includes a stepped mold, an insulation film substrate, at least one processor die, and at least one passive element. The insulation film substrate is connected to a multi-layer board via a first plurality of connectors. The at least one processor die is integrated into the stepped mold and stacked onto the insulation film substrate via a second plurality of connectors. The at least one passive element is integrated into the stepped mold and stacked onto the insulation film substrate.
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Patent Agency Ranking
公开(公告)号：US20240222877A1
公开(公告)日：2024-07-04
申请号：US18092683
申请日：2023-01-03
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , David M. Signoff , Jennifer M. Edwards
CPC classification number: H01Q15/142 , H01Q1/2283
Abstract: A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.
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公开(公告)号：US11670435B2
公开(公告)日：2023-06-06
申请号：US17226491
申请日：2021-04-09
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , Kiranjit Dhaliwal
Abstract: Flexible cables may include multiple power, ground, and signal traces, and include EM interference suppression devices within the cable itself. Signal traces may be shielded by ground traces. The body of a cable may be divided into lateral portions through which different types of traces extend. One lateral side of a cable body may include a stack of power traces, while another lateral side of the cable body may include ground and signal traces. EBG patterns may be incorporated into ground traces. Capacitors may be positioned within the cable along its length, mounted between power and ground traces, for decoupling.
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公开(公告)号：US20240356225A1
公开(公告)日：2024-10-24
申请号：US18306063
申请日：2023-04-24
Applicant: Apple Inc.
Inventor： Trang T. Thai , Jennifer M. Edwards , Sidharth S. Dalmia , Menglu Li , Taegui Kim , Hai H. Ta
CPC classification number: H01Q9/0407 , H01Q1/14 , H01Q1/48 , H01Q1/50 , H01Q23/00
Abstract: An electronic device may be provided with a phased antenna array with antennas on an antenna module. The module may include a primary substrate and a secondary substrate mounted to the primary substrate by an interconnect. An antenna may include patch elements in the primary substrate and patch elements in the secondary substrate that are fed using conductive vias. Fences of conductive vias may couple the patch elements in the primary substrate to ground to isolate the patch elements in the primary substrate from the patch elements in the secondary substrate. The secondary substrate may be smaller than the primary substrate, allowing the secondary substrate to fit into relatively small portions of the electronic device while locating the patch elements in the secondary substrates closer to free space, thereby maximizing antenna performance.
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公开(公告)号：US20230238365A1
公开(公告)日：2023-07-27
申请号：US17582870
申请日：2022-01-24
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , Kumar Nagarajan
IPC: H01L25/10 , H04B1/40 , H01L25/16 , H01L25/18 , H01L23/552
CPC classification number: H01L25/105 , H04B1/40 , H01L25/162 , H01L25/18 , H01L23/552 , H01L2225/1094 , H01L2225/1041 , H01L2225/1035 , H01L2225/1058
Abstract: A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.
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公开(公告)号：US20230066814A1
公开(公告)日：2023-03-02
申请号：US17465761
申请日：2021-09-02
Applicant: Apple Inc.
Inventor： Sidharth S. Dalmia , Wansuk Yun , Flynn P. Carson
Abstract: A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flexible cable includes first surface directly coupled to the first portion of the antenna array module. The flexible cable also includes a second surface directly coupled to the second portion of the antenna array module. The flexible cable communicates signals between the first portion of the distributed antenna array module and the second portion of the antenna array module.
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