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    INTEGRATED SPEAKERS
    46.
    发明申请
    INTEGRATED SPEAKERS 有权
    综合演讲者

    公开(公告)号：US20160088379A1

    公开(公告)日：2016-03-24

    申请号：US14495777

    申请日：2014-09-24

    Applicant: Apple Inc.

    Inventor： G. Kyle Lobisser ,  Jason S. Keats ,  Ryan J. Mihelich ,  Pablo Seoane Vieites ,  Kevin M. Kenney ,  John Raff ,  Erik A. Uttermann ,  Melody L. Kuna ,  Oliver C. Ross

    IPC: H04R1/02 ,  H04R31/00

    CPC classification number: H04R1/2888 ,  H04R1/2834 ,  H04R2201/029 ,  H04R2499/11

    Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.

    Abstract translation: 封闭电子设备外壳。 外壳包括构造成改善结构支撑以防止损坏并消散整个外壳的振动的肋结构。 肋结构可以接收扬声器模块和盖构件。 肋结构和扬声器模块可以组合形成三维体积，从而允许扬声器模块可以投影声音的扬声器模块，从而增强声学性能。 此外，盖构件可以粘合地附接到肋结构，以提供抵抗由与落下事件相关联的负载力引起的振动和滥用的附加结构支撑。

    Trimless glass enclosure interface
    48.
    发明授权
    Trimless glass enclosure interface 有权
    无边玻璃外壳接口

    公开(公告)号：US09047044B2

    公开(公告)日：2015-06-02

    申请号：US13908970

    申请日：2013-06-03

    Applicant: Apple Inc.

    Inventor： John Raff

    IPC: G06F1/16

    CPC classification number: G06F1/1656 ,  G06F1/16 ,  G06F1/1626 ,  G06F1/1637 ,  H04M1/0266 ,  H05K5/0217 ,  Y10T156/10

    Abstract: An enclosure for a portable computing device can include a cover glass affixed to an enclosure without trim pieces disposed between the cover glass and the disclosure. In one embodiment, the enclosure can include an edge profile that can define a relatively large contact pad about the enclosure. The contact pad can distribute impact forces over a relatively large area and thereby protect the cover glass integrity.

    Abstract translation: 用于便携式计算设备的外壳可以包括固定到外壳的盖玻片，而不设置在盖玻璃和本公开内容之间的饰件。 在一个实施例中，外壳可以包括边缘轮廓，该边缘轮廓可以围绕围绕物限定相对较大的接触垫。 接触垫可以在相对大的区域上分布冲击力，从而保护盖玻璃的完整性。

    COMBINED SPEAKER AND AUDIO JACK
    49.
    发明申请
    COMBINED SPEAKER AND AUDIO JACK 审中-公开
    组合扬声器和音频插孔

    公开(公告)号：US20140193024A1

    公开(公告)日：2014-07-10

    申请号：US13738822

    申请日：2013-01-10

    Applicant: APPLE INC.

    Inventor： John Raff

    IPC: H04R1/02

    CPC classification number: H04R1/02 ,  H04R1/021 ,  H04R1/1041 ,  H04R2420/03 ,  H04R2499/11

    Abstract: A speaker and audio jack module for a portable electronic device. The module includes an audio jack housing having a tube dimensioned to receive an audio plug. An acoustic port is formed through a side of the tube so as to acoustically connect a speaker housing having a speaker contained therein to the audio jack housing. The audio jack housing is capable of receiving an audio input when the audio plug is inserted therein and outputting an audio output from the speaker when the audio plug is removed.

    Abstract translation: 用于便携式电子设备的扬声器和音频插孔模块。 该模块包括音频插座外壳，其具有尺寸适于接收音频插头的管。 声管通过管的一侧形成，以将其中包含有扬声器的扬声器壳体声学连接到音频插座外壳。 当音频插头插入其中时，音频插孔外壳能够接收音频输入，并且当音频插头被移除时从扬声器输出音频输出。

    Electronic Devices With Components Mounted to Touch Sensor Substrates
    50.
    发明申请
    Electronic Devices With Components Mounted to Touch Sensor Substrates 审中-公开
    电子元件安装在触摸传感器基板上

    公开(公告)号：US20140111953A1

    公开(公告)日：2014-04-24

    申请号：US13655982

    申请日：2012-10-19

    Applicant: Apple Inc.

    Inventor： Stephen R. McClure ,  John Raff ,  Sean S. Corbin

    IPC: G06F3/044

    CPC classification number: G06F3/044 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09154 ,  H05K2201/10053 ,  H05K2201/10136

    Abstract: Touch panel structures may be provided with flexible substrates. A touch sensor array may be formed from transparent capacitive touch sensor electrodes. Electrical components such as ambient light sensors, proximity sensors, magnetic sensors, camera sensors, buttons, and integrated circuits may be mounted on the same flexible substrate as the transparent capacitive touch sensor electrodes. A flexible substrate for a touch panel structure may be formed from multiple substrate portions that are coupled using solder connections or conductive adhesive connections. A touch panel may have a flexible tail that is coupled to a printed circuit board in an electronic device housing. The flexible tail may bend when installing the touch panel in the housing.

    Abstract translation: 触摸面板结构可以设置有柔性基板。 触摸传感器阵列可以由透明电容式触摸传感器电极形成。 诸如环境光传感器，接近传感器，磁传感器，照相机传感器，按钮和集成电路的电气部件可以安装在与透明电容式触摸传感器电极相同的柔性基板上。 用于触摸面板结构的柔性基板可以由使用焊料连接或导电粘合剂连接而耦合的多个基板部分形成。 触摸面板可以具有柔性尾部，其耦合到电子设备壳体中的印刷电路板。 当将触摸面板安装在外壳中时，柔性尾部可能会弯曲。

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