公开(公告)号：US20190013284A1

公开(公告)日：2019-01-10

申请号：US15642005

申请日：2017-07-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Kuang FANG ,  Wen-Long LU

IPC: H01L23/00 ,  H01L23/055 ,  H01L25/065 ,  B23K35/02

Abstract: A semiconductor package device includes a carrier, a first electronic component, and a conductive element on the carrier. The first electronic component is over the carrier. The conductive element is on the carrier and electrically connects the first electronic component to the carrier. The conductive element includes at least one conductive particle and a solder material covering the conductive particle, and the conductive particle includes a metal core, a barrier layer covering the metal core, and a metal layer covering the barrier layer.

公开(公告)号：US20180108634A1

公开(公告)日：2018-04-19

申请号：US15294594

申请日：2016-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU ,  Yuan-Feng Chiang ,  Chi-Chang Lee ,  Chung-Hsi Wu

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/17 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/33 ,  H01L2224/1705 ,  H01L2224/175 ,  H01L2224/33104 ,  H01L2224/335

Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. The first columnar portion protrudes from a bottom surface of the first main body. The first conductive layer is disposed on a side surface of the first columnar portion. The second semiconductor device includes a second main body, at least one second columnar portion and at least one second conductive layer. The second columnar portion protrudes from a top surface of the second main body. The second conductive layer is disposed on a side surface of the second columnar portion. The first conductive layer is electrically coupled to the second conductive layer.

公开(公告)号：US20170358527A1

公开(公告)日：2017-12-14

申请号：US15178066

申请日：2016-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU ,  Min Lung HUANG

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An interposer includes an interconnection structure and a redistribution layer. The interconnection structure includes a metal layer, at least one metal via and an isolation material. The metal layer defines at least one through hole having a side wall. The at least one metal via is disposed in the through hole. A space is defined between the at least one metal via and the side wall of the through hole, and the isolation material fills the space. The redistribution layer is disposed on a surface of the interconnection structure and is electrically connected to the metal via.

公开(公告)号：US20240288745A1

公开(公告)日：2024-08-29

申请号：US18114180

申请日：2023-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: G02F1/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16

CPC classification number: G02F1/29 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/167 ,  H01F7/20 ,  H01L23/49811 ,  H01L24/16 ,  H01L2224/16227

Abstract: A semiconductor device is provided. The semiconductor device includes a first optical transceiver, a second optical transceiver and a component. The component is configured to provide a magnetic field to change a light emitting direction from the first optical transceiver to the second optical transceiver or from the second optical transceiver to the first optical transceiver.

公开(公告)号：US20220199538A1

公开(公告)日：2022-06-23

申请号：US17125848

申请日：2020-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a lower conductive structure, a first semiconductor device and a second semiconductor device. The upper conductive structure is disposed on the lower conductive structure. The second semiconductor device is electrically connected to the first semiconductor device by a first path in the upper conductive structure. The lower conductive structure is electrically connected to the first semiconductor device through a second path in the upper conductive structure under the first path.

公开(公告)号：US20210335729A1

公开(公告)日：2021-10-28

申请号：US17368688

申请日：2021-07-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.

公开(公告)号：US20210175164A1

公开(公告)日：2021-06-10

申请号：US16709641

申请日：2019-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A wiring structure includes a first dielectric layer, a first circuit layer, a second dielectric layer and a conductive via. The first dielectric layer defines at least one through hole. The first circuit layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer to cover the first circuit layer, wherein a first portion of the second dielectric layer is disposed in the through hole of the first dielectric layer. The conductive via extends through the first portion of the second dielectric layer in the through hole of the first dielectric layer, and is electrically isolated from the first circuit layer.

公开(公告)号：US20210143072A1

公开(公告)日：2021-05-13

申请号：US16681539

申请日：2019-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/16 ,  H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

Abstract: A semiconductor device package includes a substrate; an electronic component disposed on the substrate; multiple supporting structures disposed on the substrate; and a reinforced structure disposed on the supporting structures and extending in parallel with the substrate.

公开(公告)号：US20210104810A1

公开(公告)日：2021-04-08

申请号：US16592550

申请日：2019-10-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/28 ,  H01L23/52

Abstract: A semiconductor assembly includes a first wiring structure, a first semiconductor die and a first electronic element. The first wiring structure has a first surface. The first semiconductor die is disposed on the first surface of the first wiring structure. The first electronic element is electrically connected to the first wiring structure. The first electronic element includes a first metal layer, a second metal layer and a dielectric material interposed between the first metal layer and the second metal layer. The first metal layer and the second metal layer are substantially perpendicular to the first surface of the first wiring structure.

公开(公告)号：US20210066188A1

公开(公告)日：2021-03-04

申请号：US16557740

申请日：2019-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU

IPC: H01L23/522 ,  H01L23/00 ,  H01L21/768 ,  H01L23/31 ,  H01L21/56

Abstract: A package structure includes a base material, at least one electronic device, at least one dummy pillar and an encapsulant. The electronic device is electrically connected to the base material. The dummy pillar is disposed on the base material. The encapsulant covers the electronic device and a top end of the dummy pillar.