摘要:
A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.
摘要:
A multilayer chip capacitor including: a capacitor body formed of a lamination of a plurality of dielectric layers and having a bottom surface that is a mounting area; a plurality of internal electrodes disposed to be opposite to each other, interposing a dielectric layer there between in the capacitor body and having one lead extended to the bottom surface, respectively; and three or more external electrodes formed on the bottom surface and connected to corresponding internal electrodes via the leads, wherein the internal electrodes are vertically disposed on the bottom surface, and the leads of the internal electrodes having a different polarity from each other, adjacent to each other in a lamination direction, are disposed to be always adjacent to each other in a horizontal direction.
摘要:
There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged in a laminated direction; and first to fourth outer electrodes formed on side surfaces of the capacitor body, respectively, wherein the first capacitor unit includes first and second inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing a corresponding one of dielectric layers, the second capacitor unit includes third and fourth inner electrodes of different polarities alternately arranged in the capacitor body to oppose each other while interposing another corresponding one of the dielectric layers, the first and second capacitor units are electrically insulated from each other, and the first capacitor unit operates in a first frequency range and the second capacitor unit operates in a second frequency range lower than the first frequency range.
摘要:
A multilayer chip capacitor including: a capacitor body where a plurality of dielectric layers are deposited, the capacitor body having opposing first and second sides and opposing third and fourth sides; a plurality of layers of internal electrodes deposited alternately with the dielectric layers in the capacitor body; at least one first external electrode formed on the first side; and at least one second external electrode formed on the second side, wherein the first and second external electrodes are staggered with respect to each other and spaced apart from each other at a certain distance in a length direction of the first side.
摘要:
There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of the outer electrodes having identical polarity, a corresponding one of the inner electrodes having identical polarity to the inner connecting conductor includes a plurality of groups each including at least one of the inner electrodes, wherein the inner electrodes of the respective groups are connected to the outer electrodes having identical polarity that are different from one another for each of the groups and electrically connected to the inner connecting conductor through the connected outer electrode.
摘要:
A multilayer chip capacitor includes: a capacitor body; internal electrodes disposed in the capacitor body, each internal electrode having one or more lead; and external electrodes disposed on first and second side surfaces of the capacitor body to be electrically connected to the internal electrodes through the leads. The average number of leads in each internal electrode is smaller than half (½) of the total number of external electrodes. The leads of the internal electrodes having opposite polarities and adjacent in the lamination direction are disposed to be adjacent to each other as seen from the lamination direction. All the internal electrodes having the same polarity are electrically connected to each other in the capacitor.
摘要:
Disclosed is a method of implementing controlled equivalent series resistance (ESR) having low equivalent series inductance (ESL) of a multi-layer chip capacitor which includes a plurality of internal electrodes each having first polarity or second polarity which is opposite to the first polarity, and dielectric layers each disposed between the internal electrodes of the first polarity and the second polarity, wherein the internal electrodes having the first polarity and the internal electrodes having the second polarity are alternated at least once to form one or more blocks being stacked.
摘要:
A multi-layer chip capacitor includes a capacitor body; first and second internal electrodes alternately arranged therein and separated by dielectric layers, each of the internal electrodes having at least one opening formed at one or more sides thereof; first and second conductive vias passing through the openings and electrically connected to the first and second internal electrodes, respectively; first and second terminal electrodes of opposite polarities formed on one or more side faces of the capacitor body; and first and second lowermost electrode patterns being coplanar, each pattern including a via contact portion and a lead portion extending therefrom. The first and second lowermost electrode patterns are connected to the first and second terminal electrodes, respectively, through the respective lead portions of the lowermost patterns.
摘要:
A laminated ceramic capacitor includes a ceramic block formed by laminating a plurality of ceramic sheets, a plurality of external electrodes formed on outer surfaces of the ceramic block facing each other, and set as a positive terminal and a negative terminal, respectively, one or more first and second internal electrodes alternately arranged within the ceramic block such that electric currents flow in opposite directions in the internal electrodes, and a plurality of withdrawing patterns for connecting the first and second internal electrodes to the external electrodes, respectively.
摘要:
A multilayered chip capacitor including a capacitor main body including a plurality of dielectric layers, which are laminated; at least one pair of first and second internal electrodes, each of which is formed on the corresponding one of the plural dielectric layers and includes at least one lead extended to one end of the corresponding dielectric layer; a plurality of external terminals formed on the outer surface of the capacitor main body, and respectively connected to the first and second internal electrodes through the leads; and at least one opened region, formed through the inner area of each of the first and second internal electrodes, for branching the flow of current so as to increase the offset quantity of parasitic inductances between the first and second internal electrodes.