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41.
公开(公告)号:US06656827B1
公开(公告)日:2003-12-02
申请号:US10272629
申请日:2002-10-17
申请人: Pei-Haw Tsao , Chender Huang , Jones Wang , Ken Chen , Hank Huang
发明人: Pei-Haw Tsao , Chender Huang , Jones Wang , Ken Chen , Hank Huang
IPC分类号: H01L2144
CPC分类号: H01L23/49833 , H01L23/49838 , H01L23/50 , H01L2924/0002 , H01L2924/00
摘要: A method including providing a first substrate having a first bond pad and a second bond pad; forming a subassembly comprising securing a second substrate to the first substrate with a ground layer interposed between the first substrate and the second substrate; forming a first trench in the subassembly through the first substrate so that the trench is defined at least in part by a side wall of the first substrate and through at least a portion of the ground layer; and forming a first electrically conductive layer overlying the first bond pad, the side wall of the first substrate and overlying a portion of the ground layer.
摘要翻译: 一种包括提供具有第一接合焊盘和第二接合焊盘的第一基板的方法; 形成子组件,其包括将第二衬底固定到所述第一衬底上,所述接地层置于所述第一衬底和所述第二衬底之间; 通过所述第一衬底在所述子组件中形成第一沟槽,使得所述沟槽至少部分地由所述第一衬底的侧壁和所述接地层的至少一部分限定; 以及形成覆盖所述第一接合焊盘,所述第一基板的侧壁并覆盖所述接地层的一部分的第一导电层。
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公开(公告)号:US06638837B1
公开(公告)日:2003-10-28
申请号:US10251441
申请日:2002-09-20
申请人: Pei-Haw Tsao , Chender Huang , Jones Wang , Ken Chen , Hank Huang
发明人: Pei-Haw Tsao , Chender Huang , Jones Wang , Ken Chen , Hank Huang
IPC分类号: H01L2130
CPC分类号: H01L21/02118 , H01L21/02282 , H01L21/312 , H01L21/6835 , H01L21/6836 , H01L27/14618 , H01L27/1462 , H01L27/14627 , H01L27/14685 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/00
摘要: A method of protecting the active surface, front side, of semiconductor wafers during the operations of backside grinding, transporting, and packaging has been achieved. The invention discloses a method for applying an organic passivation layer or an aqueous material for protection of the active components. These materials are easily removed prior to final packaging of the dies.
摘要翻译: 已经实现了在背面研磨,运输和包装的操作期间保护半导体晶片的有源表面正面的方法。 本发明公开了一种用于施加有机钝化层或水性材料以保护活性组分的方法。 这些材料在模具的最终包装之前很容易去除。
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