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41.发明申请公开(公告)号：US20110094679A1
公开(公告)日：2011-04-28
申请号：US12968607
申请日：2010-12-15
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译： 本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。 在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过 。
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42.发明授权Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment 失效添加D2至H2以检测和校准由离子电子附着形成的原子氢公开(公告)号：US07434719B2
公开(公告)日：2008-10-14
申请号：US11298262
申请日：2005-12-09
CPC分类号： B23K1/206 , H01L2924/0002 , H05K3/3489 , H01L2924/00
摘要： A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.
摘要翻译： 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法，包括以下步骤：a）提供一种或多种待焊接的组分， 连接到作为目标组件的第一电极; b）提供邻近目标组件的第二电极; c）在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d）向所述第一和第二电极提供直流（DC）电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e）使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。
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公开(公告)号：US06776330B2
公开(公告)日：2004-08-17
申请号：US09949580
申请日：2001-09-10
IPC分类号： B23K3538
CPC分类号： H05K3/3489 , B23K1/20 , B23K1/206
摘要： A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.
摘要翻译： 一种待焊接的一种或多种组分的干熔剂金属表面的方法，包括以下步骤：a）提供一个或多个连接到作为目标组件的第一电极的被焊接部件; b）提供邻近目标组件的第二电极; c）在第一和第二电极之间提供包含还原气体的气体混合物; d）向所述第一和第二电极提供直流（DC）电压并且向所述还原气体提供电子以形成带负电荷的离子还原气体; e）使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。
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