Hydrogen fluxless soldering by electron attachment
    1.
    发明授权
    Hydrogen fluxless soldering by electron attachment 有权
    通过电子附着的无氢无焊剂

    公开(公告)号:US06776330B2

    公开(公告)日:2004-08-17

    申请号:US09949580

    申请日:2001-09-10

    IPC分类号: B23K3538

    CPC分类号: H05K3/3489 B23K1/20 B23K1/206

    摘要: A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.

    摘要翻译: 一种待焊接的一种或多种组分的干熔剂金属表面的方法,包括以下步骤:a)提供一个或多个连接到作为目标组件的第一电极的被焊接部件; b)提供邻近目标组件的第二电极; c)在第一和第二电极之间提供包含还原气体的气体混合物; d)向所述第一和第二电极提供直流(DC)电压并且向所述还原气体提供电子以形成带负电荷的离子还原气体; e)使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。

    Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
    2.
    发明授权
    Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation 有权
    用于通过无电子技术去除表面氧化物的设备,涉及电子附着和远程离子生成

    公开(公告)号:US08593778B2

    公开(公告)日:2013-11-26

    申请号:US13151883

    申请日:2011-06-02

    IPC分类号: H01T23/00

    摘要: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

    摘要翻译: 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中,提供了从组分表面去除氧化物的方法,包括:在基底上提供组分,其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压,其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。

    Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation
    6.
    发明授权
    Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation 有权
    通过涉及电子附着和远程离子生成的无通量技术去除表面氧化物的装置和方法

    公开(公告)号:US07977598B2

    公开(公告)日:2011-07-12

    申请号:US10819277

    申请日:2004-04-07

    IPC分类号: B23K1/00

    摘要: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

    摘要翻译: 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中,提供了从组分表面去除氧化物的方法,包括:在基底上提供组分,其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压,其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。

    Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation
    8.
    发明申请
    Apparatus for Removal of Surface Oxides via Fluxless Technique Involving Electron Attachment and Remote Ion Generation 有权
    用于通过无电极技术去除表面氧化物的装置,涉及电子附件和远程离子生成

    公开(公告)号:US20110229377A1

    公开(公告)日:2011-09-22

    申请号:US13151883

    申请日:2011-06-02

    IPC分类号: B01J19/08

    摘要: The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.

    摘要翻译: 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中,提供了从组分表面去除氧化物的方法,包括:在基底上提供组分,其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压,其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。