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公开(公告)号：US11916324B2
公开(公告)日：2024-02-27
申请号：US17644999
申请日：2021-12-17
Applicant: Cisco Technology, Inc.
Inventor： Mark C. Nowell , D. Brice Achkir , Joel R. Goergen , Giovanni Giobbio , Mary K. Laue
IPC: H01R12/72 , H01R13/6594
CPC classification number: H01R12/721 , H01R13/6594
Abstract: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.
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公开(公告)号：US20230397343A1
公开(公告)日：2023-12-07
申请号：US17942711
申请日：2022-09-12
Applicant: Cisco Technology, Inc.
Inventor： Mike Sapozhnikov , Sayed Ashraf Mamun , D. Brice Achkir , David Nozadze , Amendra Koul , Upen Reddy Kareti
CPC classification number: H05K3/4697 , H05K3/0047
Abstract: The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.
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43.发明公开公开(公告)号：US20230269873A1
公开(公告)日：2023-08-24
申请号：US18305489
申请日：2023-04-24
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
CPC classification number: H05K1/09 , H05K3/4644 , H05K2203/1545 , H05K2201/0323 , H05K2201/0338
Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US20230071476A1
公开(公告)日：2023-03-09
申请号：US17702892
申请日：2022-03-24
Applicant: Cisco Technology, Inc.
Inventor： D. Brice Achkir , Shobhana Ram Punjabi , Jie Xue
IPC: H01L23/498
Abstract: A multi-layer substrate stacking a plurality of insulating substrates supports one or more devices. Each substrate includes a face supporting conductive traces and edges surrounding the face at a substantially perpendicular angle. The multi-layer substrate includes a ground plane on a first substrate and a power plane on a second substrate. The ground plane is connected to at least one ground pad disposed on a first edge of the first substrate, which provides a low inductance ground path to the ground plane. The power plane is connected to at least one power pad disposed on a second edge of the second substrate, which provides a low inductance power path to the power plane.
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公开(公告)号：US20220228820A1
公开(公告)日：2022-07-21
申请号：US17154785
申请日：2021-01-21
Applicant: CISCO TECHNOLOGY, INC.
Inventor： M. Baris Dogruoz , Mehmet Onder Cap , D. Brice Achkir , Joel Richard Goergen
Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.
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Patent Agency Ranking
公开(公告)号：US20220217837A1
公开(公告)日：2022-07-07
申请号：US17703051
申请日：2022-03-24
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Scott Hinaga , Jessica Kiefer , Alpesh Umakant Bhobe , D. Brice Achkir , David Nozadze , Amendra Koul , Mehmet Onder Cap , Madeline Marie Roemer
IPC: H05K1/02
Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
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47.发明申请公开(公告)号：US20220039257A1
公开(公告)日：2022-02-03
申请号：US17503690
申请日：2021-10-18
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
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公开(公告)号：US20220038189A1
公开(公告)日：2022-02-03
申请号：US17502848
申请日：2021-10-15
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Charles Calvin Byers , Robert Gregory Twiss , D. Brice Achkir , Chad M. Jones
Abstract: In one embodiment, a method includes receiving power delivered over a data fiber cable at an optical transceiver installed at a network communications device and transmitting data and the power from the optical transceiver to the network communications device. The network communications device is powered by the power received from the optical transceiver. An apparatus is also disclosed herein.
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49.发明授权公开(公告)号：US11202368B2
公开(公告)日：2021-12-14
申请号：US17006016
申请日：2020-08-28
Applicant: Cisco Technology, Inc.
Inventor： Joel Goergen , Jessica Kiefer , Alpesh Umakant Bhobe , Kameron Rose Hurst , D. Brice Achkir , Amendra Koul , Scott Hinaga , David Nozadze
Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
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公开(公告)号：US20210042803A1
公开(公告)日：2021-02-11
申请号：US16533458
申请日：2019-08-06
Applicant: Cisco Technology, Inc.
Inventor： D. Brice Achkir , Pavan Mettu
Abstract: The present technology pertains to a distributed server system for verifying vendors. The distributed server system comprises one or more nodes on a distributed network; a communication interface of a first node that communicates over a communication network with the one or more nodes on the distributed network, wherein the communication interface receives information about a unique seal associated with a product in response to a query; and a processor of the first node that executes instructions stored in memory, wherein execution of the instructions by the processor verifies that a vendor is associated with the unique seal has been appended to a distributed ledger, determines a match between the unique seal and the vendor; and, after determining the match, confirms that the vendor is a certified vendor of the product.
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