Three-phase AC load unbalance detection and balancing method and circuit

    公开(公告)号:US11682904B2

    公开(公告)日:2023-06-20

    申请号:US17484847

    申请日:2021-09-24

    CPC classification number: H02J3/26 G01R29/16

    Abstract: A method comprises, at a power balancing circuit for three-phase AC power: feeding three power phases to respective loads; measuring power drain on the three power phases by the respective loads; based on measuring, detecting an unbalanced power drain across the three power phases due to a relatively light power drain on one or more lightly loaded power phases and a relatively high power drain on one or more heavily loaded power phases; computing an amount of power to be drained from the one or more lightly loaded power phases and to be fed to the one or more heavily loaded power phases to balance the power drain across the three power phases; and transferring the amount of power from the one or more lightly loaded power phases to the one or more heavily loaded power phases to balance the power drain across the three power phases.

    CONTROLLED-FORCE THERMAL MANAGEMENT DEVICE INSTALLATION

    公开(公告)号:US20230129211A1

    公开(公告)日:2023-04-27

    申请号:US17826864

    申请日:2022-05-27

    Abstract: Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.

    Self-locking and foldable ejector arm

    公开(公告)号:US11412634B2

    公开(公告)日:2022-08-09

    申请号:US16808555

    申请日:2020-03-04

    Abstract: A locking mechanism for securing a computing device in an enclosure includes a jaw, a transmission lever, and an arm. The jaw is configured to abut a portion of the enclosure for holding the computing device. The transmission lever includes an arm pivot at one end and an actuating pivot at the opposite end. The arm is configured to rotate open and closed about the arm pivot and be selectively decoupled from the transmission lever. When the arm is coupled to the transmission lever, opening the arm causes the transmission lever to rotate open about the actuating pivot. Rotating open the transmission lever about the actuating pivot releases the jaw from the portion of the enclosure, and allows the computing device to be removed from the enclosure.

    Apparatus for facilitating the separation of mated printed circuit board assemblies

    公开(公告)号:US10186823B2

    公开(公告)日:2019-01-22

    申请号:US15000689

    申请日:2016-01-19

    Abstract: According to one aspect, an apparatus includes an expansion element, an expandable element, and a frame. The expandable element is configured to have an expanded state and an unexpanded state, wherein the expandable element is arranged to be inserted between a mated pair of printed circuit boards (PCBs) while in the unexpanded state. The expansion element is arranged to cause the expandable element to expand to the expanded state. When the expandable element is in the expanded state, the expandable element causes the pair of PCBs to demate. The frame is arranged to facilitate an insertion of the expandable element between the mated pair of PCBs. In one embodiment, the expandable element is an inflatable element and the expansion element is an inflator element that includes an air supply.

    High Impact Resistant Heat Sink
    10.
    发明申请
    High Impact Resistant Heat Sink 审中-公开
    高耐冲击散热器

    公开(公告)号:US20160374232A1

    公开(公告)日:2016-12-22

    申请号:US14740898

    申请日:2015-06-16

    Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

    Abstract translation: 提供了散热器安装配置,其被配置为当线卡经受振动时,防止散热器损坏安装在印刷电路板(PCB)上的专用集成电路(ASIC)的球栅阵列(BGA),并且 冲击。 散热器安装配置可以包括一组螺钉,其被配置为至少部分地设置在散热器的孔内,以将散热器固定到PCB。 安装构造包括弹性构件和围绕靠近孔的螺钉周围的间隔件。 弹性构件构造成将散热器偏压在ASIC上以使散热器与ASIC接触。 间隔件构造成防止散热器在线卡受到振动和冲击时大到足以损坏BGA的力撞击ASIC。

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