公开(公告)号：US20050007745A1

公开(公告)日：2005-01-13

申请号：US10911847

申请日：2004-08-03

申请人： Derek Gochnour ,  Walter Moden ,  Michael Morrison

发明人： Derek Gochnour ,  Walter Moden ,  Michael Morrison

IPC分类号： H01R31/06 ,  H05K1/00

CPC分类号： G06K19/07739 ,  H01R12/721 ,  H01R31/06

摘要： An apparatus and method of removably interconnecting a reduced-sized memory card with an extension member. A locking mechanism may be formed in a peripheral end portion of the reduced-sized memory card that may include an entry surface and a ledge. The extension member may include a biasing portion that slidably engages the entry surface and removable interconnects with the ledge. With this arrangement, the extension member may easily be secured and removed from the reduced-sized memory card, allowing easy interchangeability between a standard-sized socket of one electronic device and a reduced-sized socket of another electronic device.

摘要翻译： 一种可拆卸地将小型存储卡与扩展构件互连的装置和方法。 可以在缩小尺寸的存储卡的外围端部中形成锁定机构，该外围端部可以包括入口表面和突出部。 延伸构件可以包括可滑动地接合进入表面的偏置部分和与凸缘的可移除的互连。 通过这种布置，扩展构件可以容易地从减小尺寸的存储卡中被固定和移除，从而允许一个电子设备的标准尺寸的插座与另一个电子设备的小型插座之间的容易的互换性。

公开(公告)号：US5537738A

公开(公告)日：1996-07-23

申请号：US386646

申请日：1995-02-10

申请人： David A. Cathey ,  Charles Watkins ,  Derek Gochnour

发明人： David A. Cathey ,  Charles Watkins ,  Derek Gochnour

IPC分类号： H01J9/34 ,  H01J9/24 ,  H01J9/26 ,  H01J9/32 ,  H01J9/36 ,  H01L21/60 ,  H01L21/98 ,  H01L23/538 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01L25/50 ,  H01J9/241 ,  H01J9/261 ,  H01J9/32 ,  H01J9/36 ,  H01L23/5385 ,  H01J2329/8625 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H05K3/328 ,  H05K3/368 ,  Y10T29/49126

摘要： The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads. The method includes adjusting a wire bonder's tear length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection. Further steps include making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bonder, and then severing the bond wire adjacent said wedge bond. The adjusted tear length of the wire bonder results in a tail of severed bond wire which projects from said wedge bond and said individual bond pad. Subsequent steps include positioning the first and second planar substrates with their inwardly facing surfaces facing each other, aligning the matching bond pad patterns of the first and second planar substrates, and pressing the first and second planar substrates against each other. The bond wire tail deforms between the bond pads of the first and second planar substrates to conductively bond therebetween.

摘要翻译： 本公开描述了一种附接和电连接第一和第二平面基板的方法，其中第一和第二基板具有具有匹配的接合焊盘图案的向内表面。 该方法包括将引线接合器的撕裂长度调整到在终止楔形接合连接处留下断开的接合线的突出尾部的设置。 进一步的步骤包括使用来自引线接合器的接合线与第一平面基板的单独接合焊盘楔合，然后切断邻近所述楔形键的接合线。 引线接合器的经调整的撕裂长度导致从所述楔形键和所述单独接合焊盘突出的断开的接合线的尾部。 随后的步骤包括将第一和第二平面基板定位成其面向彼此的向内表面，使第一和第二平面基板的匹配接合焊盘图案对齐，并将第一和第二平面基板相互压制。 接合线尾部在第一和第二平面基板的接合焊盘之间变形，以在它们之间导电地结合。