公开(公告)号：US10586725B1

公开(公告)日：2020-03-10

申请号：US15867380

申请日：2018-01-10

申请人： Facebook Technologies, LLC

发明人： Pooya Saketi ,  Oscar Torrents Abad ,  Allan Pourchet ,  Patrick Joseph Hughes ,  Karsten Moh ,  Daniel Brodoceanu

IPC分类号： H01L21/683 ,  B32B38/10 ,  B32B37/12 ,  H01L33/00 ,  H01L33/32

摘要： One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

公开(公告)号：US10559486B1

公开(公告)日：2020-02-11

申请号：US15867400

申请日：2018-01-10

申请人： Facebook Technologies, LLC

发明人： Daniel Brodoceanu ,  Pooya Saketi ,  Oscar Torrents Abad ,  Allan Pourchet ,  Patrick Joseph Hughes ,  Karsten Moh

IPC分类号： H01L21/683 ,  B32B38/10 ,  H01L33/00 ,  B32B7/12 ,  H01L33/32 ,  B32B37/12

摘要： One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

公开(公告)号：US10522709B1

公开(公告)日：2019-12-31

申请号：US15832652

申请日：2017-12-05

申请人： Facebook Technologies, LLC

发明人： Pooya Saketi ,  Patrick Joseph Hughes ,  David Massoubre

IPC分类号： H01L33/00 ,  H01L33/62 ,  H01L33/44 ,  H01L21/67 ,  H01L21/68 ,  H01L21/66 ,  H01L25/075 ,  H01L33/48

摘要： LEDs are manufactured on a substrate layer and picked and placed using a pick-up tool (PUT) onto a target substrate. The PUT typically attaches to an LED via an elastomer layer deposited on a surface of the LED. A given batch of manufactured LEDs may contain operational LEDs as well as non-operational LEDs. In order to separate the operational and non-operational LEDs, the LEDs are placed on a unidirectional conductive film. A photo-curable polymer is deposited on a surface of each LED. A voltage difference is applied across the electrodes of each LED via the unidirectional conductive film, causing the operational LEDs to emit light and cure the photo-curable polymer to form an elastomer layer, while the polymer deposited on the non-operational LEDs will not cure. As such, the PUT will be able to pick up the operational LEDs, while being unable to pick up the non-operational LEDs.

公开(公告)号：US10388516B1

公开(公告)日：2019-08-20

申请号：US15867389

申请日：2018-01-10

申请人： Facebook Technologies, LLC

发明人： Oscar Torrents Abad ,  Pooya Saketi ,  Daniel Brodoceanu ,  Karsten Moh

IPC分类号： H01L21/50 ,  H01L21/02 ,  H01L23/00

摘要： One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

公开(公告)号：US10325791B1

公开(公告)日：2019-06-18

申请号：US15841247

申请日：2017-12-13

申请人： Facebook Technologies, LLC

发明人： Pooya Saketi ,  Patrick Joseph Hughes ,  William Padraic Henry ,  Joseph O'Keeffe

IPC分类号： H01L21/67 ,  H01L33/20 ,  B65G47/90 ,  H01L25/075 ,  H01L33/10 ,  H01L27/12 ,  H01L27/15

摘要： A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.