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公开(公告)号：US11107948B1
公开(公告)日：2021-08-31
申请号：US16700354
申请日：2019-12-02
发明人： Yigit Menguc , Pooya Saketi , Thomas John Farrell Wallin , Nicholas Roy Corson , Ali Sengül , Katherine Healy , Oscar Torrents Abad , Daniel Brodoceanu , Robert Manson , Leif-Erik Sharif Simonsen , Remi Alain Delille
IPC分类号： H01L33/06 , H01L25/075 , H01L21/683
摘要： A method and system for assembling a device by picking up semiconductor devices from a carrier substrate and placing the semiconductor devices onto a target substrate. The transfer of the semiconductor devices uses fluid as a transfer medium. The fluid enters a fluid channel of a pickup head, causing the pickup head to expand, make contact with, and attach to an aligned semiconductor device. After the semiconductor device is aligned with and placed onto the target substrate, at least a portion of the fluid is removed from the pickup head to release the semiconductor device onto the target substrate. The semiconductor device bonds to the target substrate.
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公开(公告)号：US10930529B2
公开(公告)日：2021-02-23
申请号：US16738965
申请日：2020-01-09
IPC分类号： H01L21/67 , H01L33/10 , H01L33/20 , B65G47/90 , H01L25/075 , H01L33/00 , H01L27/12 , H01L27/15 , H01L33/44 , H01L33/58
摘要： A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.
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公开(公告)号：US20200152492A1
公开(公告)日：2020-05-14
申请号：US16738965
申请日：2020-01-09
摘要： A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.
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公开(公告)号：US10600823B2
公开(公告)日：2020-03-24
申请号：US15918985
申请日：2018-03-12
发明人： Padraig Hughes , Joseph O'Keeffe , Celine Oyer , William Henry , David Massoubre , Pooya Saketi
IPC分类号： H01L27/12 , H01L27/15 , H01L25/075
摘要： A method for manufacturing a display element comprising a plurality of pixels, each comprising a plurality of subpixels. The method comprises undertaking, using a pick up tool, a first placement cycle (1908) comprising picking up a plurality of first, untested LED dies and placing them on a display substrate at locations corresponding to the plurality of pixels, testing (1912) the first LED emitters on the display substrate to determine one or more locations of non-functional first LED emitters, selecting one or more second tested LED dies based on a result of the test, configuring the selected one or more second LED dies to enable their pick up and placement on the display substrate and undertaking, using the PUT, a second placement cycle (2008) comprising picking up the selected one or more second LED dies and placing them on the display substrate at the determined locations of the nonfunctional first LED emitters.
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公开(公告)号：US11255529B1
公开(公告)日：2022-02-22
申请号：US16666839
申请日：2019-10-29
发明人： Jeb Wu , Oscar Torrents Abad , Daniel Brodoceanu , Pooya Saketi , Zheng Sung Chio , Ali Sengül
摘要： A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.
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公开(公告)号：US11239400B1
公开(公告)日：2022-02-01
申请号：US16737176
申请日：2020-01-08
发明人： Zheng Sung Chio , Daniel Brodoceanu , Oscar Torrents Abad , Ali Sengül , Pooya Saketi , Jeb Wu , Chao Kai Tung , Remi Alain Delille , Tennyson Nguty , Allan Pourchet
摘要： A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.
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公开(公告)号：US11145797B1
公开(公告)日：2021-10-12
申请号：US16263477
申请日：2019-01-31
摘要： Embodiments relate to forming an elastomeric interface layer (elayer) with a flap over multiple light emitting diode (LED) dies by forming materials across multiple LED dies and removing the materials between the LED dies. The formed flap of the elayer provides a large surface area for adhesion between each LED and a pick-up surface. For example, the flap may have a surface area that is larger than the light emitting surface of the LED die, or larger than the surface area of an elastomeric interface layer without the flap. As such, the elayer allows each LED to be picked up by a pick-up surface and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (μLED) dies.
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公开(公告)号：US11076519B1
公开(公告)日：2021-07-27
申请号：US16370770
申请日：2019-03-29
发明人： Pooya Saketi
摘要： A method and system for manufacturing a device by forming a conformable interface layer from elastomer solution on semiconductor devices to facilitate picking and placing the semiconductor devices from a carrier substrate to a target substrate. The method may include transferring elastomer solution onto fluidic tips of a subset of fluidic heads of a fluidic head array by extending one or more fluidic head actuators of the subset of the fluidic heads, transferring the elastomer solution on the fluidic tips of the subset of the fluidic heads to semiconductor devices on a carrier substrate to form conformable interface layers on the semiconductor devices, and picking up the semiconductor devices via adhesive attachment with the conformable interface layers from the carrier substrate to place on a target substrate.
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公开(公告)号：US10936061B2
公开(公告)日：2021-03-02
申请号：US16572966
申请日：2019-09-17
发明人： Vincent Brennan , Patrick Joseph Hughes , Pooya Saketi , Andrew John Ouderkirk , William Anthony Wall
IPC分类号： G06F3/01
摘要： Techniques related to eye tracking using reverse-biased light-emitting diode (LED) devices are disclosed. In some embodiments, a viewing apparatus comprises a reverse-biased LED device that is positioned within a field-of-view of an eye. The reverse-biased LED device receives light reflected from the eye and generates signal based on the received light. The generated signal is used to determine a position of the eye.
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公开(公告)号：US10753959B1
公开(公告)日：2020-08-25
申请号：US16036627
申请日：2018-07-16
发明人： Pooya Saketi , Christopher Percival
摘要： A probe card includes a conductive body, an insulation block, and a plurality of conductive microsprings. The insulation block covers at least one side of the body and at least partially encloses the microsprings. A first end of each microspring is connected to the conductive body and a second end is exposed from the insulation block. In operation, the probe card is moved onto one or more semiconductor devices to be tested. As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads on the semiconductor devices. The insulation block encloses the microsprings, which prevents the microsprings from buckling or making contact with each other. As a result, the probe card produces fewer false positives and false negatives during the testing process.
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