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公开(公告)号：US11557692B2
公开(公告)日：2023-01-17
申请号：US16748692
申请日：2020-01-21
摘要： The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.
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公开(公告)号：US11344971B1
公开(公告)日：2022-05-31
申请号：US16376156
申请日：2019-04-05
摘要： Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. A method includes emitting a laser beam providing the laser beam to a lenslet array including a plurality of lenslets, and generating, from the laser beam, a plurality of laser sub-beams using the lenslet array. Each one of the plurality of laser sub-beams is generated by a corresponding one of the plurality of lenslets. Each lenslet of the plurality of lenslets has the same shape.
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公开(公告)号：US11107948B1
公开(公告)日：2021-08-31
申请号：US16700354
申请日：2019-12-02
发明人： Yigit Menguc , Pooya Saketi , Thomas John Farrell Wallin , Nicholas Roy Corson , Ali Sengül , Katherine Healy , Oscar Torrents Abad , Daniel Brodoceanu , Robert Manson , Leif-Erik Sharif Simonsen , Remi Alain Delille
IPC分类号： H01L33/06 , H01L25/075 , H01L21/683
摘要： A method and system for assembling a device by picking up semiconductor devices from a carrier substrate and placing the semiconductor devices onto a target substrate. The transfer of the semiconductor devices uses fluid as a transfer medium. The fluid enters a fluid channel of a pickup head, causing the pickup head to expand, make contact with, and attach to an aligned semiconductor device. After the semiconductor device is aligned with and placed onto the target substrate, at least a portion of the fluid is removed from the pickup head to release the semiconductor device onto the target substrate. The semiconductor device bonds to the target substrate.
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公开(公告)号：US20200035880A1
公开(公告)日：2020-01-30
申请号：US16049783
申请日：2018-07-30
发明人： Daniel Brodoceanu , David Massoubre , James Small , Oscar Torrents Abad , Patrick Joseph Hughes
摘要： Techniques related to laser lift-off masks are disclosed. In some embodiments, masking material is applied to a substrate that is attached to a plurality of semiconductor device sets. More specifically, the masking material is applied to one or more regions of the substrate between the semiconductor device sets. When the semiconductor device sets are embedded in a filling material, the masking material may be situated between the substrate and the filling material. Thus, transmitting light through the substrate toward the semiconductor device sets causes the substrate to become detached from the semiconductor device sets. However, the light is at least partially occluded by the masking material.
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公开(公告)号：US20220393060A1
公开(公告)日：2022-12-08
申请号：US17849541
申请日：2022-06-24
发明人： Jeb Wu , Daniel Brodoceanu , Zheng Sung Chio , Tennyson Nguty , Oscar Torrents Abad , Ali Sengul
摘要： The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.
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6.发明授权公开(公告)号：US11374148B2
公开(公告)日：2022-06-28
申请号：US16748689
申请日：2020-01-21
发明人： Daniel Brodoceanu , Oscar Torrents Abad , Jeb Wu , Zheng Sung Chio , Sharon Nanette Farrens , Ali Sengul , Tennyson Nguty
摘要： The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.
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公开(公告)号：US11255529B1
公开(公告)日：2022-02-22
申请号：US16666839
申请日：2019-10-29
发明人： Jeb Wu , Oscar Torrents Abad , Daniel Brodoceanu , Pooya Saketi , Zheng Sung Chio , Ali Sengül
摘要： A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.
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公开(公告)号：US11239400B1
公开(公告)日：2022-02-01
申请号：US16737176
申请日：2020-01-08
发明人： Zheng Sung Chio , Daniel Brodoceanu , Oscar Torrents Abad , Ali Sengül , Pooya Saketi , Jeb Wu , Chao Kai Tung , Remi Alain Delille , Tennyson Nguty , Allan Pourchet
摘要： A light-emitting diode (LED) array is formed by bonding an LED chip or wafer to a backplane substrate via curved interconnects. The backplane substrate may include circuits for driving the LED's. One or more curved interconnects are formed on the backplane substrate. A curved interconnect may be electrically connected to a corresponding circuit of the backplane substrate, and may include at least a portion with curvature. The LED chip or wafer may include one or more LED devices. Each LED device may have one or more electrical contacts. The LED chip or wafer is positioned above the backplane substrate to spatially align electrical contacts of the LED devices with the curved interconnects on the backplane substrate. The electrical contacts are bonded to the curved interconnects to electrically connect the LED devices to corresponding circuits of the backplane substrate.
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公开(公告)号：US10998286B1
公开(公告)日：2021-05-04
申请号：US15892336
申请日：2018-02-08
摘要： A laser is used to induce bonding of LED contact pads with corresponding substrate contact pads on a display substrate. The wavelength of the laser light and the material used for the contact pads are both selected so that the laser light is capable of melting the contact pads. For example, the laser light has a wavelength of between 220 nm and 1200 nm, and the contact pads are formed of a copper-tin oxide (CuSn). Furthermore, the system may be configured to shine the laser light through a number of other components, such as the pick-up head and the LED itself. These materials can be formed of materials that do not absorb the energy of the laser light. Bonding the contacts with a laser in this manner allows for faster heating and cooling times, avoids reheating of previously bonded contact pads, and reduces thermal expansion of the display substrate.
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公开(公告)号：US20200035882A1
公开(公告)日：2020-01-30
申请号：US16049728
申请日：2018-07-30
IPC分类号： H01L33/58 , H01L21/67 , H01L25/075 , H01L33/00
摘要： Techniques related to optics formation using pick-up tools are disclosed. Optical elements are formed by pressing a pick-up tool (PUT) against elastomeric material deposited on a light-outputting side of light-emitting diode (LED) devices. Pressing the PUT against the elastomeric material causes a molded shape of the PUT to be transferred to the elastomeric material. This forms the optical elements in the elastomeric material.
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