公开(公告)号：US20180222202A1

公开(公告)日：2018-08-09

申请号：US15749399

申请日：2015-10-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Devin Alexander Mourey ,  Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/16 ,  B41J2/175

CPC classification number: B41J2/1637 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/164 ,  B41J2/175 ,  B41J2/17503 ,  B41J2202/22

Abstract: In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.

公开(公告)号：US20180215151A1

公开(公告)日：2018-08-02

申请号：US15748856

申请日：2015-10-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/175 ,  B41J2/315

CPC classification number: B41J2/14072 ,  B41J2/135 ,  B41J2/14088 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/175 ,  B41J2/315 ,  B41J2202/01

Abstract: In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.

公开(公告)号：US20180203194A1

公开(公告)日：2018-07-19

申请号：US15750004

申请日：2015-08-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: G02B6/42 ,  G02B6/13

CPC classification number: G02B6/4255 ,  G02B6/13 ,  G02B6/4204 ,  G02B6/4269 ,  G02B6/428

Abstract: Optical modules are disclosed. An example method includes coupling optoelectronic components to a carrier substrate; overmolding the optoelectronic components with a material to form a molded panel, a surface of the molded panel to be at least substantially flush; and removing the carrier substrate from the surface.