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公开(公告)号:US20210213730A1
公开(公告)日:2021-07-15
申请号:US16768125
申请日:2019-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Boon Bing NG , James Michael GARDNER
IPC: B41J2/045
Abstract: A memory circuit for a print component including a plurality of I/O pads, including an analog pad, to connect to a plurality of signals paths which communicate operating signals to the print component, and a memory component to store memory values associated with the print component. A control circuit to, in response to identifying a sequence of operating signals representing a memory read, provide a first analog signal on the analog pad in parallel with a second analog signal from the print component to provide an analog electrical value on the analog pad representing stored memory values selected by the memory read.
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公开(公告)号:US20210162735A1
公开(公告)日:2021-06-03
申请号:US16957524
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Scott A. LINN , James Michael GARDNER , John ROSSI
IPC: B41J2/045
Abstract: A print component includes an array of fluidic actuation structures including a first column of fluidic actuating structures addressable by a set of actuation addresses, each fluidic actuating structure having a different one of the actuation addresses and having a fluidic architecture type, and a second column of fluidic actuating structures addressable by the set of actuation addresses. Each fluidic actuating structure of the second column has a different one of the actuation addresses and has a same fluidic architecture type as the fluidic actuating structure of the first column having the same address. An address bus communicates the set of addresses to the array of fluidic actuating structures, and a fire signal line communicates a plurality of fire pulse signal types to the array of fluidic actuating structures, the fire pulse signal type depending on the actuation address on the address bus.
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公开(公告)号:US20210081350A1
公开(公告)日:2021-03-18
申请号:US16954388
申请日:2018-12-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Stephen D. PANSHIN , Jefferson P. WARD , Scott A. LINN , James Michael GARDNER
IPC: G06F13/42 , G06F21/44 , G06F21/62 , G06F21/74 , G06F9/30 , G06F21/85 , H04L9/08 , H04L9/32 , B41J2/175
Abstract: In an example, a logic circuitry package has a first address and comprises a first logic circuit. In some examples, the first address is an I2C address for the first logic circuit, and the package is configured such that, in response to a first command indicative of a task and a first time period sent to the first address, the first logic circuit is to, for a duration of the time period, perform a task, and disregard I2C traffic sent to the first address.
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公开(公告)号:US20210001635A1
公开(公告)日:2021-01-07
申请号:US16977675
申请日:2018-12-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James Michael GARDNER , Scott A. LINN , Stephen D. PANSHIN , Jefferson P. WARD , David Owen ROETHIG
Abstract: In an example, a logic circuit comprising a communications interface including a data contact to communicate via a communications bus, an enablement contact, separate from the communication interface, to receive an input to enable the logic circuit, and at least one memory register, comprising at least one reconfigurable address register. The logic circuit may be configured, such that, when enabled, it responds to communications sent via the communication bus which are addressed to the address held in a reconfigurable address register.
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公开(公告)号:US20220176707A1
公开(公告)日:2022-06-09
申请号:US17601345
申请日:2019-04-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Anthony D. STUDER , David N. OLSEN , Michael W. CUMBIE , Chien-Hua CHEN , James Michael GARDNER , Scott A. LINN
Abstract: A fluid property sensor may comprising an integrated circuit (IC) including a fluid level sensor, and/or a pressure sensor; and an external interface electrically coupled to a proximal end of the EC, wherein the pressure sensor may be configured to measure a flexure of the fluid property sensor.
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公开(公告)号:US20220001672A1
公开(公告)日:2022-01-06
申请号:US16769922
申请日:2019-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael GARDNER , Scott A. LINN
IPC: B41J2/175
Abstract: A logic circuitry package for a replaceable print apparatus component includes an analog sensor cell block with a plurality of sensor cells, analog control circuitry to bias and control the analog sensor cell block, an interface to communicate with a print apparatus logic circuit, a dedicated bit field that indicates whether the logic circuitry package is in a power saving mode, and at least one logic circuit. The at least one logic circuit may be configured to receive, via the interface, a request to cause the analog sensor cell block to provide sensor information for at least one sensor measurement; and selectively enable and disable power to the analog control circuitry based on the request and a value of the dedicated bit field.
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公开(公告)号:US20210402786A1
公开(公告)日:2021-12-30
申请号:US16959375
申请日:2019-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael GARDNER , Sirena LU , Frank D. DERRYBERRY , Michael W. CUMBIE
IPC: B41J2/175
Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.
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公开(公告)号:US20210402783A1
公开(公告)日:2021-12-30
申请号:US16763450
申请日:2019-12-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Anthony D. STUDER , Quinton B. WEAVER , David N. N. OLSEN , James Michael GARDNER , Jim RING , David Owen ROETHIG , Christopher Hans BAKKER
IPC: B41J2/175
Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.
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公开(公告)号:US20210252871A1
公开(公告)日:2021-08-19
申请号:US16770805
申请日:2019-04-05
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Anthony D. STUDER , David N. OLSEN , Michael W. CUMBIE , Chien-Hua CHEN , James Michael GARDNER , Scott A. LINN
Abstract: This disclosure discusses a fluid property sensor, comprising an electrical circuit assembly (ECA) including an external interface coupled to a common interface bus; a fluid level sensor coupled to the common interface bus to indicate a fluid level and/or a pressure sensor coupled to the common interface bus to indicate a pressure event; and/or a driver circuit coupled to the common interface bus, configured to communicate characteristics of the fluid level sensor and the pressure sensor.
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公开(公告)号:US20210237435A1
公开(公告)日:2021-08-05
申请号:US16768651
申请日:2019-12-03
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael GARDNER , James William , David Owen , Christopher Hans
IPC: B41J2/045
Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The logic circuit is configured to receive, via the interface, a plurality of first requests in a heater disabled mode, each first request corresponding to a different sensor ID of a plurality of sensor IDs; transmit, via the interface, a first digital value in response to each first request; receive, via the interface, a plurality of second requests in a heater enabled mode, each second request corresponding to a different sensor ID of the plurality of sensor IDs; and transmit, via the interface, a second digital value in response to each second request. Delta values corresponding to a difference between the first digital value and the second digital value for each different sensor ID of the plurality of sensor IDs are indicative of a print material level.
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