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    Substrate treating apparatus and substrate treating method
    41.
    发明申请
    Substrate treating apparatus and substrate treating method 审中-公开
    基板处理装置及基板处理方法

    公开(公告)号：US20050115671A1

    公开(公告)日：2005-06-02

    申请号：US10998843

    申请日：2004-11-29

    申请人： Hiroyuki Araki

    发明人： Hiroyuki Araki

    IPC分类号： B08B1/00 ,  B05C11/08 ,  B05C11/10 ,  B08B3/02 ,  B08B7/04 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306 ,  H01L21/311 ,  H01L21/3213

    CPC分类号： H01L21/02071 ,  B08B7/04 ,  H01L21/02049 ,  H01L21/02052 ,  H01L21/31116 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67167 ,  H01L21/67236

    摘要： A substrate treating apparatus includes at least two types of treatment units, and a substrate carrying mechanism for carrying a substrate into/out of at least the two types of treatment units. At least the two types of treatment units are selected out of a chemical liquid treatment unit for supplying a chemical liquid to the substrate, a scrubbing unit for scrubbing a surface of the substrate, a polymer removal unit for supplying a polymer removal liquid to the substrate, a peripheral end surface treatment unit for supplying a treatment liquid to an area including the whole of one surface and a peripheral end surface of the substrate, and a gas phase treatment unit for supplying a vapor to the substrate.

    摘要翻译： 基板处理装置包括至少两种类型的处理单元，以及用于将基板输送到至少两种类型的处理单元中的基板承载机构。 从用于向基板供给化学液体的化学液体处理单元中选择至少两种类型的处理单元，用于洗涤基板表面的洗涤单元，用于向基板供应聚合物去除液体的聚合物去除单元 外周端面处理单元，用于将处理液供给到包括基板整体的一个表面和外周端面的区域;以及气相处理单元，用于向基板供给蒸气。