公开(公告)号：US20200229323A1

公开(公告)日：2020-07-16

申请号：US16741493

申请日：2020-01-13

Applicant: Inertech IP LLC

Inventor： John Costakis ,  Ken Nguyen ,  Ming Zhang ,  Doron Shapiro

IPC: H05K7/20

Abstract: Modular air cooling and distribution systems include a fan and heat exchanger cooling assembly and a controller which controls the fan speed based on temperature and velocity measurements. The cooling assembly includes a fluid-to-air heat exchanger and a variable speed fan. The fluid in the fluid-to-air heat exchanger may be propylene glycol or water. The heat exchanger minimizes pressure drop and maximizes heat transfer. The quantity of cooling assemblies is selected to match the indoor cooling requirements. The cooling assemblies are easily assembled together, stacked vertically, and/or connected horizontally, to match the cooling load. If additional cooling capacity is needed in the future, more cooling assemblies can easily be added, and the cooling assemblies may be expanded vertically and/or horizontally. The speed of the fans of the fan and heat exchanger assemblies are controlled based on fluid temperature and fluid velocity measurements, which may be obtained by an anemometer.

公开(公告)号：US20170268792A1

公开(公告)日：2017-09-21

申请号：US15398512

申请日：2017-01-04

Applicant: INERTECH IP LLC

Inventor： John Costakis ,  Ming Zhang ,  Earl Keisling ,  Ken Nguyen

IPC: F24F5/00 ,  F24F11/00

CPC classification number: F24F5/0007 ,  F24F5/0003 ,  F24F5/001 ,  F24F5/0035 ,  F24F11/46 ,  F24F11/83 ,  F24F2013/225 ,  F24F2110/12 ,  F24F2140/50 ,  F25B23/006 ,  F25B25/00 ,  F25B25/005 ,  F25B2339/041 ,  F25B2339/047 ,  F25B2700/197 ,  F25B2700/21163 ,  F28C2001/006 ,  Y02B30/542

Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

公开(公告)号：USD744996S1

公开(公告)日：2015-12-08

申请号：US29449647

申请日：2013-03-15

Applicant: INERTECH IP LLC

Designer： Earl Keisling ,  John Costakis ,  Michael Welch

公开(公告)号：US20150195958A1

公开(公告)日：2015-07-09

申请号：US14665866

申请日：2015-03-23

Applicant: Inertech IP LLC

Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

IPC: H05K7/20

CPC classification number: H05K7/20745 ,  H05K7/20736 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/49826

Abstract: A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

Abstract translation: 用于冷却数据中心组件的至少一个服务器机架中的至少一个服务器的模块化服务器机架冷却结构包括至少第一支撑构件和至少第一热交换器。 第一热交换器联接到第一支撑构件，其构造成将第一热交换器与至少一个服务器的热传递关系定位。 第一热交换器不连接到至少一个服务器机架。 模块化服务器机架冷却结构还应用于包括至少第一机架和至少彼此相对设置的第二机架以形成热通道或冷通道的系统。 公开了一种用于在模块化服务器机架冷却结构的支撑结构上安装附加热交换器以满足增加的冷却能力要求而不需要额外空间的方法。

公开(公告)号：US20150192345A1

公开(公告)日：2015-07-09

申请号：US14534957

申请日：2014-11-06

Applicant: Inertech IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25D17/02 ,  F25B1/00

CPC classification number: F25D17/02 ,  F25B1/00 ,  F25B1/005 ,  F25B25/005 ,  F25B2339/047

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

Abstract translation: 本公开的冷却系统和方法涉及在数据中心中冷却电子设备或具有高散热温度和高显热比的任何其它应用。

公开(公告)号：US20150176865A1

公开(公告)日：2015-06-25

申请号：US14520322

申请日：2014-10-21

Applicant: Inertech IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25B5/02 ,  F25B31/00 ,  F25B6/02

CPC classification number: F25B29/003 ,  F25B2339/047 ,  H05K7/20827

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

Abstract translation: 本公开的冷却系统和方法涉及在数据中心中冷却电子设备或具有高散热温度和高显热比的任何其它应用。