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公开(公告)号：US10777362B2
公开(公告)日：2020-09-15
申请号：US16684828
申请日：2019-11-15
Applicant: KEMET Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Christian Guerrero , Chris Stolarski , Jeffrey N. Kelly , Philip M. Lessner , Siva Jyoth Lingala , Javaid Qazi
Abstract: An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
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公开(公告)号：US20200273949A1
公开(公告)日：2020-08-27
申请号：US16531255
申请日：2019-08-05
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Lonnie G. Jones , Allen Templeton , Philip M. Lessner
IPC: H01L49/02 , H01L23/48 , H01L23/522
Abstract: Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.
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公开(公告)号：US10650980B2
公开(公告)日：2020-05-12
申请号：US16165649
申请日：2018-10-19
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Qingping Chen , Yaru Shi , Philip M. Lessner
IPC: H01G9/042 , C09D125/18 , C09D4/06 , C09D7/65 , C09D5/24 , C09D165/00 , H01G9/00 , H01G9/15 , H01G9/025 , C08F12/30 , H01B1/12 , C08F212/14 , C09D133/14 , H01G9/028
Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
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公开(公告)号：US20200090875A1
公开(公告)日：2020-03-19
申请号：US16684828
申请日：2019-11-15
Applicant: KEMET Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Christian Guerrero , Chris Stolarski , Jeffrey N. Kelly , Philip M. Lessner , Siva Jyoth Lingala , Javaid Qazi
Abstract: An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
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公开(公告)号：US10340091B2
公开(公告)日：2019-07-02
申请号：US15595137
申请日：2017-05-15
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Yaru Shi , Qingping Chen , Philip M. Lessner
Abstract: A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.
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Patent Agency Ranking
公开(公告)号：US20190115158A1
公开(公告)日：2019-04-18
申请号：US15787126
申请日：2017-10-18
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Qinping Chen , Yaru Shi , Philip M. Lessner
IPC: H01G9/042 , C09D5/24 , C09D7/12 , C09D4/06 , C09D125/18 , C09D165/00
Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
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公开(公告)号：US20180337002A1
公开(公告)日：2018-11-22
申请号：US15601323
申请日：2017-05-22
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Philip M. Lessner , Abhijit Gurav
Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.
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公开(公告)号：US10062519B2
公开(公告)日：2018-08-28
申请号：US14853493
申请日：2015-09-14
Applicant: Kemet Electronics Corporation
Inventor： Yuri Freeman , Steven C. Hussey , Jimmy Dale Cisson , Philip M. Lessner
CPC classification number: H01G9/012 , H01G9/0036 , H01G9/0425 , H01G9/052 , H01G9/10 , H01G9/14 , H01G9/15 , H01G13/003
Abstract: An improved capacitor and a method for forming an improved capacitor is detailed. The method comprises forming a tantalum anode from a tantalum powder with a powder charge of no more than 40,000 μC/g; forming a dielectric on the anode by anodization at a formation voltage of no more than 100 V; and forming a conductive polymeric cathode on the dielectric wherein the capacitor has a breakdown voltage higher than the formation voltage.
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49.发明授权Linear-hyperbranched polymers as performance additives for solid electrolytic capacitors 有权线性超支化聚合物作为固体电解电容器的性能添加剂公开(公告)号：US09378898B2
公开(公告)日：2016-06-28
申请号：US14098664
申请日：2013-12-06
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , Gopakumar Sivasankarapillai , Yaru Shi , Philip M. Lessner
CPC classification number: H01G9/0425 , C09D5/24 , C09D177/12 , H01B1/124 , H01G9/0029 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: Provided herein is an improved capacitor and a method for forming an improved capacitor. The method includes providing an anode and forming a dielectric on the anode. A linear-hyperbranched polymer is formed and a conductive polymer dispersion is prepared comprising at least one conducting polymer, one polyanion and the linear-hyperbranched polymer. A layer of the conductive polymer dispersion if formed wherein said dielectric is between the anode and the layer.
Abstract translation: 本文提供了改进的电容器和形成改进的电容器的方法。 该方法包括提供阳极并在阳极上形成电介质。 形成线型超支化聚合物并制备包含至少一种导电聚合物，一个聚阴离子和线性超支化聚合物的导电聚合物分散体。 如果形成导电聚合物分散体的一层，其中所述电介质位于阳极和层之间。
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50.发明授权Materials and method for improving corner and edge coverage of solid electrolytic capacitors 有权改善固体电解电容器拐角和边缘覆盖的材料和方法公开(公告)号：US09236191B2
公开(公告)日：2016-01-12
申请号：US14490981
申请日：2014-09-19
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , Yang Jin , Randolph S. Hahn , Yongjian Qiu , Philip M. Lessner , Keith R. Brenneman
CPC classification number: H01G9/0032 , B05D1/185 , B82Y99/00 , H01G9/0036 , H01G9/028 , H01G9/0425 , H01G9/052 , H01G9/15 , Y10S977/948 , Y10T29/417 , Y10T29/43
Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.
Abstract translation: 一种制备固体电解电容器的方法，包括应用覆盖增强催化剂，然后施加导电聚合物层。 涂层和固化后除去覆盖增强催化剂。
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