公开(公告)号：US20180156973A1

公开(公告)日：2018-06-07

申请号：US15830467

申请日：2017-12-04

Applicant: Luxtera, Inc.

Inventor： Brian Welch ,  Attila Mekis ,  Steffan Gloeckner

IPC: G02B6/12 ,  G02B6/124 ,  G02B6/125 ,  H04B10/40 ,  H04B10/80 ,  H04J14/02 ,  G02B6/293

CPC classification number: G02B6/12004 ,  G02B6/124 ,  G02B6/125 ,  G02B6/29386 ,  G02B6/4213 ,  G02B6/4215 ,  G02B6/4246 ,  G02B2006/12142 ,  H04B10/40 ,  H04B10/801 ,  H04J14/0256

Abstract: Methods and systems for partial integration of wavelength division multiplexing and bi-directional solutions are disclosed and may include, an optical transceiver on a silicon photonics integrated circuit coupled to a planar lightwave circuit (PLC). The silicon photonics integrated circuit may include a first modulator and first light source that operates at a first wavelength and a second modulator and second light source that operates at a second wavelength. The transceiver and PLC are operable to modulate a first continuous wave (CW) optical signal from the first light source utilizing the first modulator and modulate a second CW optical signal from the second light source utilizing the second modulator. The modulated signals may be communicated from the modulators to the PLC utilizing a first pair of grating couplers in the IC and combined in the PLC.

公开(公告)号：US09912408B2

公开(公告)日：2018-03-06

申请号：US14925452

申请日：2015-10-28

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peter De Dobbelaere ,  Lieven Verslegers ,  Peng Sun ,  Yannick De Koninck

IPC: H04B10/50 ,  H04B10/40 ,  H04J14/02

CPC classification number: H04B10/40 ,  H04B10/5053 ,  H04B10/506 ,  H04J14/02

Abstract: Methods and systems for silicon photonics wavelength division multiplexing transceivers are disclosed and may include, in a transceiver integrated in a silicon photonics chip: generating a first modulated output optical signal at a first wavelength utilizing a first electrical signal, generating a second modulated output optical signal at a second wavelength utilizing a second electrical signal, communicating the first and second modulated output optical signals into an optical fiber coupled to the chip utilizing a multiplexing grating coupler in the chip. A received input optical signal may be split into a modulated input optical signal at the first wavelength and a modulated input optical signal at the second wavelength utilizing a demultiplexing grating coupler in the chip. The first and second modulated input optical signals may be converted to first and second electrical input signals utilizing first and second photodetectors in the chip.

公开(公告)号：US09904012B2

公开(公告)日：2018-02-27

申请号：US15628273

申请日：2017-06-20

Applicant: Luxtera, Inc.

Inventor： Thierry Pinguet ,  Attila Mekis ,  Steffen Gloeckner

IPC: G02B6/34 ,  G02B6/124 ,  G01J1/02 ,  G02B6/42 ,  G02B6/30 ,  G01J1/04 ,  G02B6/12

CPC classification number: G02B6/124 ,  G01J1/02 ,  G01J1/0425 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4208 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12157

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.

公开(公告)号：US09823495B2

公开(公告)日：2017-11-21

申请号：US15231356

申请日：2016-08-08

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Adithyaram Narasimha ,  Jeremy Witzens

IPC: G02F1/035 ,  G02F1/01 ,  G02F1/313 ,  G02B6/126 ,  G02B6/125 ,  G02B6/27 ,  G02B6/293 ,  G02B6/34 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02F1/0136 ,  G02B6/125 ,  G02B6/126 ,  G02B6/2726 ,  G02B6/2773 ,  G02B6/29344 ,  G02B6/34 ,  G02B6/4286 ,  G02B2006/12142 ,  G02F1/011 ,  G02F1/313

Abstract: A system for integrated power combiners is disclosed and may include receiving optical signals in input optical waveguides and phase-modulating the signals to configure a phase offset between signals received at a first optical coupler, where the first optical coupler may generate output signals having substantially equal optical powers. Output signals of the first optical coupler may be phase-modulated to configure a phase offset between signals received at a second optical coupler, which may generate an output signal having an optical power of essentially zero and a second output signal having a maximized optical power. Optical signals received by the input optical waveguides may be generated utilizing a polarization-splitting grating coupler to enable polarization-insensitive combining of optical signals. Optical power may be monitored using optical detectors. The monitoring of optical power may be used to determine a desired phase offset between the signals received at the first optical coupler.

公开(公告)号：US20170285263A1

公开(公告)日：2017-10-05

申请号：US15628273

申请日：2017-06-20

Applicant: Luxtera, Inc.

Inventor： Thierry Pinguet ,  Attila Mekis ,  Steffen Gloeckner

IPC: G02B6/124 ,  G01J1/02

CPC classification number: G02B6/124 ,  G01J1/02 ,  G01J1/0425 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4208 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12157

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.

公开(公告)号：US09575253B2

公开(公告)日：2017-02-21

申请号：US15232051

申请日：2016-08-09

Applicant: Luxtera, Inc.

Inventor： Lieven Verslegers ,  Attila Mekis

IPC: G02B6/34 ,  G02B6/26 ,  G02B6/124 ,  G02B6/30 ,  G02B5/18 ,  G02B6/12

CPC classification number: G02B6/26 ,  G02B5/1861 ,  G02B6/124 ,  G02B6/126 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4214 ,  G02B2006/12107 ,  G02B2006/12147 ,  G02B2006/1215

Abstract: Methods and systems for grating couplers incorporating perturbed waveguides are disclosed and may include in a semiconductor photonics die, communicating optical signals into and/or out of the die utilizing a grating coupler on the die, where the grating coupler comprises perturbed waveguides. The perturbed waveguides may include rows of continuous waveguides with non-discrete scatterers extending throughout a length of said perturbed waveguides a variable width along their length. The grating coupler may comprise a single polarization grating coupler comprising perturbed waveguides and a non-perturbed grating. The grating coupler may comprise a polarization splitting grating coupler (PSGC) that includes two sets of perturbed waveguides at a non-zero angle, or a plurality of non-linear rows of discrete shapes. The PSGC may comprise discrete scatterers at an intersection of the sets of perturbed waveguides. The grating coupler may comprise individual scatterers between the perturbed waveguides.

Abstract translation: 公开了包含扰动波导的光栅耦合器的方法和系统，并且可以包括在半导体光子管芯中，使用在管芯上的光栅耦合器将光信号传送到和/或离开裸片，其中光栅耦合器包括扰动的波导。 扰动的波导可以包括具有非离散散射体的连续波导行，其在所述扰动波导的长度上沿其长度延伸可变宽度。 光栅耦合器可以包括包含扰动波导和非扰动光栅的单偏振光栅耦合器。 光栅耦合器可以包括偏振分光光栅耦合器（PSGC），其包括非零角度的两组扰动波导，或多个离散形状的非线性行。 PSGC可以包括在扰动波导组的相交处的离散散射体。 光栅耦合器可以包括扰动波导之间的各个散射体。

公开(公告)号：US09417410B2

公开(公告)日：2016-08-16

申请号：US14811199

申请日：2015-07-28

Applicant: Luxtera, Inc.

Inventor： Lieven Verslegers ,  Attila Mekis

IPC: G02B6/34 ,  G02B6/42 ,  G02B6/124

CPC classification number: G02B6/26 ,  G02B5/1861 ,  G02B6/124 ,  G02B6/126 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4214 ,  G02B2006/12107 ,  G02B2006/12147 ,  G02B2006/1215

Abstract: A system for grating couplers incorporating perturbed waveguides is disclosed and may include, in a semiconductor photonics die, communicating optical signals into and/or out of said semiconductor die utilizing a grating coupler on the semiconductor photonics die, where the grating coupler includes perturbed waveguides as scattering elements, and the perturbed waveguides comprise rows of continuous waveguides defined by non-discrete scatterers. The perturbed waveguides may include a variable width along a length of the perturbed waveguides. The grating coupler may include a single polarization grating coupler comprising perturbed waveguides and a non-perturbed grating, or a polarization splitting grating coupler including two sets of rows of perturbed waveguides at a non-zero angle from each other. The polarization splitting grating coupler may include discrete scatterers at an intersection of the two sets of rows of perturbed waveguides and/or may include non-linear rows of discrete shapes at an intersection of the perturbed waveguides.

Abstract translation: 公开了一种包含扰动波导的光栅耦合器的系统，并且可以包括在半导体光子管芯中，使用半导体光子管芯上的光栅耦合器将光信号传送到所述半导体管芯中和/或从所述半导体管芯流出，其中光栅耦合器包括扰动波导作为 扰动波导包括由非离散散射体限定的连续波导行。 扰动的波导可以包括沿着扰动波导的长度的可变宽度。 光栅耦合器可以包括包含扰动波导和非扰动光栅的单偏振光栅耦合器，或包括彼此成非零角的两组扰动波导的偏振分束光栅耦合器。 偏振分束光栅耦合器可以包括在两组扰动波导的交点处的离散散射体和/或可以在扰动波导的交点处包括离散形状的非线性行。

公开(公告)号：US20150028192A1

公开(公告)日：2015-01-29

申请号：US14513886

申请日：2014-10-14

Applicant: Luxtera, Inc.

Inventor： Thierry Pinguet ,  Attila Mekis ,  Steffen Gloeckner

IPC: G01J1/04

CPC classification number: G02B6/124 ,  G01J1/02 ,  G01J1/0425 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4208 ,  G02B2006/12038 ,  G02B2006/12061 ,  G02B2006/12104 ,  G02B2006/12157

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip in a photonic transceiver, wherein photonic, electronic, or optoelectronic devices may be integrated in layers on a front surface of the CMOS photonic chip. Optical couplers, such as grating couplers, may receive the optical signals in the front surface. The optical signals may be coupled into the back surface of the chips via optical fibers and/or optical source assemblies. The optical signals may be coupled to the optical couplers via a light path etched in the chips, which may be refilled with silicon dioxide. The chips may be bonded to a second chip. Optical signals may be reflected back to the optical couplers via metal reflectors, which may be integrated in dielectric layers on the chips.

Abstract translation: 公开了一种用于将光信号耦合到硅光电芯片的方法和系统，并且可以包括将一个或多个光信号耦合到光子收发器中的CMOS光子芯片的背表面，其中光子，电子或光电器件可以集成在层 在CMOS光子芯片的正面上。 诸如光栅耦合器的光耦合器可以在前表面中接收光信号。 光信号可以经由光纤和/或光源组件耦合到芯片的后表面中。 光信号可以经由在芯片中蚀刻的光路耦合到光耦合器，其可以用二氧化硅再填充。 芯片可以结合到第二芯片。 光信号可以经由金属反射器反射回到光耦合器，金属反射器可以集成在芯片上的电介质层中。

公开(公告)号：US20190331866A1

公开(公告)日：2019-10-31

申请号：US16504609

申请日：2019-07-08

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peng Sun ,  Steffen Gloeckner ,  Michael Mack ,  Steven Hovey

IPC: G02B6/42

Abstract: Methods and systems for coupling a light source assembly to an optical integrated circuit are disclosed and may include a system comprising a laser source assembly having a laser, a rotator, and a mirror, where the laser source assembly is coupled to a die including an angled grating coupler and a waveguide. The system may generate an optical signal utilizing the laser, rotate the polarization of the optical signal utilizing the rotator, reflect the rotated optical signal onto the grating coupler on the die, and couple the optical signal to the waveguide, where an angle between a grating coupler axis that is parallel to the waveguide and a plane of incidence of the optical signal reflected to the angled grating coupler is non-zero. The angle between the grating coupler axis and the plane of incidence of the optical signal reflected to the angled grating coupler may be 45 degrees.

公开(公告)号：US10451801B2

公开(公告)日：2019-10-22

申请号：US16253000

申请日：2019-01-21

Applicant: Luxtera, Inc.

Inventor： Thierry Pinguet ,  Attila Mekis ,  Steffen Gloeckner

IPC: G02B6/34 ,  G02B6/124 ,  G02B6/30 ,  G01J1/02 ,  G01J1/04 ,  G02B6/42 ,  G02B6/12

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.