Defect inspection apparatus, program, and manufacturing method of semiconductor device
    41.
    发明申请
    Defect inspection apparatus, program, and manufacturing method of semiconductor device 有权
    半导体器件的缺陷检查装置,程序和制造方法

    公开(公告)号:US20050230618A1

    公开(公告)日:2005-10-20

    申请号:US11086212

    申请日:2005-03-23

    摘要: A defect inspection apparatus includes a charged particle beam source which emits a charged particle beam to illuminate the charged particle beam onto a sample as a primary beam; an image pickup which includes an imaging element having a light receiving face receiving at least one of a secondary charged particle, a reflective charged particle, and a back-scattered charged particle generated from the sample by the illumination of the primary beam and which outputs a signal indicating a state of the surface of the sample; a mapping projection system which maps/projects at least one of the secondary charged particle, the reflective charged particle, and the back-scattered charged particle as a secondary beam and which makes the beam to form an image on the light receiving face of the imaging element; a controller which adjusts a beam diameter of the primary beam in such a manner as to apply the beam to the sample with a size smaller than that of an imaging region as a target of review to scan the imaging region and which allows the image pickup to pick up a plurality of frame images; an image processor which processes the plurality of obtained frame images to prepare a review image; and a defect judgment unit which judges a defect of the sample based on the review image.

    摘要翻译: 缺陷检查装置包括:带电粒子束源,其发射带电粒子束,以将带电粒子束照射到样品上作为主光束; 一种图像拾取器,其包括具有光接收面的成像元件,所述光接收面接收通过所述一次光束的照射从所述样品产生的二次带电粒子,反射带电粒子和反向散射带电粒子中的至少一个,并且输出 指示样品表面状态的信号; 映射投影系统,其将二次带电粒子,反射带电粒子和反向散射带电粒子中的至少一个作为次级光束进行映射/投影,并且使得该光束在成像的光接收面上形成图像 元件; 控制器,其以这样的方式调节主光束的光束直径,使得将光束以比成像区域的尺寸小的像素的尺寸施加到作为检查对象的扫描成像区域,并且允许图像拾取 拾取多个帧图像; 处理所述多个获得的帧图像以准备检查图像的图像处理器; 以及缺陷判定单元,其基于检查图像判断样本的缺陷。

    Defect inspection apparatus, program, and manufacturing method of semiconductor device
    43.
    发明授权
    Defect inspection apparatus, program, and manufacturing method of semiconductor device 有权
    半导体器件的缺陷检查装置,程序和制造方法

    公开(公告)号:US07148479B2

    公开(公告)日:2006-12-12

    申请号:US11086212

    申请日:2005-03-23

    IPC分类号: H01J37/256

    摘要: A defect inspection apparatus includes a charged particle beam source which emits a charged particle beam to illuminate the charged particle beam onto a sample as a primary beam; an image pickup which includes an imaging element having a light receiving face receiving at least one of a secondary charged particle, a reflective charged particle, and a back-scattered charged particle generated from the sample by the illumination of the primary beam and which outputs a signal indicating a state of the surface of the sample; a mapping projection system which maps/projects at least one of the secondary charged particle, the reflective charged particle, and the back-scattered charged particle as a secondary beam and which makes the beam to form an image on the light receiving face of the imaging element; a controller which adjusts a beam diameter of the primary beam in such a manner as to apply the beam to the sample with a size smaller than that of an imaging region as a target of review to scan the imaging region and which allows the image pickup to pick up a plurality of frame images; an image processor which processes the plurality of obtained frame images to prepare a review image; and a defect judgment unit which judges a defect of the sample based on the review image.

    摘要翻译: 缺陷检查装置包括:带电粒子束源,其发射带电粒子束,以将带电粒子束照射到样品上作为主光束; 一种图像拾取器,其包括具有光接收面的成像元件,所述光接收面接收通过所述一次光束的照射从所述样品产生的二次带电粒子,反射带电粒子和反向散射带电粒子中的至少一个,并且输出 指示样品表面状态的信号; 映射投影系统,其将二次带电粒子,反射带电粒子和反向散射带电粒子中的至少一个作为次级光束进行映射/投影,并且使得该光束在成像的光接收面上形成图像 元件; 控制器,其以这样的方式调节主光束的光束直径,使得将光束以比成像区域的尺寸小的像素的尺寸施加到作为检查对象的扫描成像区域,并且允许图像拾取 拾取多个帧图像; 处理所述多个获得的帧图像以准备检查图像的图像处理器; 以及缺陷判定单元,其基于检查图像判断样本的缺陷。

    Substrate inspection method, method of manufacturing semiconductor device, and substrate inspection apparatus
    44.
    发明申请
    Substrate inspection method, method of manufacturing semiconductor device, and substrate inspection apparatus 有权
    基板检查方法,半导体装置的制造方法以及基板检查装置

    公开(公告)号:US20050263701A1

    公开(公告)日:2005-12-01

    申请号:US11137473

    申请日:2005-05-26

    摘要: A substrate inspection method includes: generating an electron beam and irradiating the electron beam as a primary electron beam to a substrate as a specimen; inducing at least any of a secondary electron, a reflected electron and a backscattering electron which are emitted from the substrate receiving the primary electron beam, and magnifying and projecting the induced electron as a secondary electron beam so as to form an image of the secondary electron beam; a trajectory of the primary electron beam and a trajectory of the secondary electron beam having an overlapping space and space charge effect of the secondary electron beam occurring in the overlapping space, detecting the image of the secondary electron beam to output a signal representing a state of the substrate; and suppressing aberration caused by the space charge effect in the overlapping space.

    摘要翻译: 基板检查方法包括:产生电子束并将作为一次电子束的电子束照射到作为检体的基板; 诱导从接收一次电子束的基板发射的二次电子,反射电子和后向散射电子中的任一种,并且将感应电子放大并投影为二次电子束,以形成二次电子的图像 光束; 一次电子束的轨迹和二次电子束的轨迹具有在重叠空间中发生的二次电子束的重叠空间和空间电荷效应,检测二次电子束的图像以输出表示二次电子束的状态的信号 基材; 并且抑制由重叠空间中的空间电荷效应引起的像差。

    Pattern inspection method and pattern inspection apparatus
    45.
    发明授权
    Pattern inspection method and pattern inspection apparatus 有权
    图案检验方法和图案检验装置

    公开(公告)号:US08611638B2

    公开(公告)日:2013-12-17

    申请号:US13014226

    申请日:2011-01-26

    申请人: Ichirota Nagahama

    发明人: Ichirota Nagahama

    IPC分类号: G06K9/00

    摘要: According to an embodiment, a pattern inspection apparatus includes an imaging unit, a defect detection unit, and an inspection control unit. The imaging unit is configured to image a pattern on a substrate to acquire a pattern image. The defect detection unit is configured to detect a defect of the pattern by a first outer shape comparison in associate with the pattern image and design information for the pattern or by a comparison in pixel values between images of patterns designed to be formed into the same shape in the substrate. The inspection control unit is configured to select an inspection based on the amount of the defect detected by the first outer shape comparison or based on a value of a gradient of an edge profile of the pattern image and to control the imaging unit and the defect detection unit in accordance with the selected inspection.

    摘要翻译: 根据实施例,图案检查装置包括成像单元,缺陷检测单元和检查控制单元。 成像单元被配置为对基板上的图案进行成像以获取图案图像。 缺陷检测单元被配置为通过与图案图像相关联的第一外部形状比较和图案的设计信息或通过设计成形成相同形状的图案的图像之间的像素值的比较来检测图案的缺陷 在基材中。 检查控制单元被配置为基于由第一外部形状比较检测到的缺陷的量或者基于图案图像的边缘轮廓的梯度的值来选择检查,并且控制成像单元和缺陷检测 单位按照选定的检验。

    Substrate inspection apparatus, substrate inspection method and semiconductor device manufacturing method
    46.
    发明授权
    Substrate inspection apparatus, substrate inspection method and semiconductor device manufacturing method 有权
    基板检查装置,基板检查方法及半导体装置的制造方法

    公开(公告)号:US07838831B2

    公开(公告)日:2010-11-23

    申请号:US12053174

    申请日:2008-03-21

    申请人: Ichirota Nagahama

    发明人: Ichirota Nagahama

    IPC分类号: G01N23/00

    摘要: A substrate inspection method includes forming a conductive thin film on a surface of an inspection target substrate with a pattern formed thereon, generating an electron beam and irradiating the substrate having the thin film formed thereon with the electron beam, detecting at least any of secondary electrons, reflected electrons and backscattered electrons released from the surface of the substrate and outputting signals constituting an inspection image, and selecting at least any of a material, a film thickness and a configuration for the thin film, or at least any of a material, a film thickness and a configuration for the thin film and an irradiation condition with the electron beam according to an arbitrary inspection image characteristic so that an inspection image according to an inspection purpose can be obtained.

    摘要翻译: 基板检查方法包括:在其上形成图案的检查对象基板的表面上形成导电性薄膜,产生电子束,并对其上形成有薄膜的基板照射电子束,检测二次电子中的至少一种 ,从基板的表面释放的反射电子和反向散射电子,并输出构成检查图像的信号,并且选择薄膜的材料,膜厚度和结构中的至少任一种,或者至少选择材料, 膜厚度和薄膜的结构以及根据任意检查图像特性的电子束的照射条件,从而可以获得根据检查目的的检查图像。

    PATTERN INSPECTION APPARATUS, PATTERN INSPECTION METHOD AND COMPUTER READABLE RECORDING MEDIUM
    47.
    发明申请
    PATTERN INSPECTION APPARATUS, PATTERN INSPECTION METHOD AND COMPUTER READABLE RECORDING MEDIUM 审中-公开
    图案检查装置,图案检查方法和计算机可读记录介质

    公开(公告)号:US20100021046A1

    公开(公告)日:2010-01-28

    申请号:US12509101

    申请日:2009-07-24

    申请人: Ichirota Nagahama

    发明人: Ichirota Nagahama

    IPC分类号: G06K9/00

    CPC分类号: G06T7/001 G06T2207/30148

    摘要: A pattern inspection apparatus includes: an inspection threshold setting unit to set a defect detection threshold to be used in inspection of an inspection pattern by referring to design information of an inspection layer which is included in a plurality of layers on a substrate and which has the inspection pattern formed thereon, and design information of an adjacent layer which is one of two layers adjacent to the inspection layer in a normal line direction of the substrate; a deviation amount calculation unit to receive an image containing the inspection layer and the adjacent layer, detect edges of the image, and calculate a deviation amount between an edge of the inspection pattern and an edge of a pattern of the adjacent layer; and a defect determination unit to determine whether there is a defect in the inspection pattern by comparing the calculated deviation amount with the defect detection threshold.

    摘要翻译: 图案检查装置包括:检查阈值设定单元,其通过参照包含在基板上的多层的检查层的设计信息来设定检查图案的检查中使用的缺陷检测阈值, 形成在其上的检查图案和在基板的法线方向上与检查层相邻的两层之一的相邻层的设计信息; 偏移量计算单元,用于接收包含检查层和相邻层的图像,检测图像的边缘,并且计算检查图案的边缘与相邻层的图案的边缘之间的偏差量; 以及缺陷确定单元,通过将计算的偏差量与缺陷检测阈值进行比较来确定检查图案中是否存在缺陷。