ELASTIC WAVE DEVICE, FRONT-END CIRCUIT, AND COMMUNICATION DEVICE

    公开(公告)号:US20190238114A1

    公开(公告)日:2019-08-01

    申请号:US16375871

    申请日:2019-04-05

    CPC classification number: H03H9/145 H03H9/02007 H03H9/25 H03H9/64

    Abstract: An elastic wave device includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. The IDT electrode includes a busbar electrode extending in an elastic wave propagation direction and electrode fingers connected to the busbar electrode and extending in a direction perpendicular or substantially perpendicular to the elastic wave propagation direction. The piezoelectric substrate includes a groove extending along the elastic wave propagation direction. The groove is provided on a side across the busbar electrode in the perpendicular or substantially perpendicular direction from a side at which the electrode fingers are located.

    PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE

    公开(公告)号:US20170179925A1

    公开(公告)日:2017-06-22

    申请号:US15448633

    申请日:2017-03-03

    Inventor: Yutaka KISHIMOTO

    Abstract: In a method of manufacturing a piezoelectric device in which a piezoelectric thin film on which functional conductors are formed is fixed to a support substrate by a fixing layer, an alignment mark is formed on one main surface of a light-transmitting piezoelectric substrate. A sacrificial layer is formed on a main surface of the piezoelectric substrate with reference to the alignment mark and the fixing layer is formed so as to cover the sacrificial layer and is bonded to the support substrate. The piezoelectric thin film is formed by being separated from the piezoelectric substrate and the functional conductors are formed on the surface of the piezoelectric thin film with reference to the alignment mark. The piezoelectric device is able to be manufactured while positions of formation regions of conductors are adjusted efficiently.

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