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公开(公告)号:US20220403755A1
公开(公告)日:2022-12-22
申请号:US17842874
申请日:2022-06-17
Applicant: Raytheon Technologies Corporation
Inventor: Brian T. Hazel , John R. Farris , Matthew A. Devore , John A. Sharon , James F. Wiedenhoefer , Paul M. Lutjen , Mario P. Bochiechio
Abstract: An article comprises a first portion comprising a first alloy and a second portion comprising a second alloy that is metallurgically bonded to the first portion to form a monolithic article. The metallurgical bonding involves the application of an electrical current across the bond line and results in a retention of a metallurgical structure of the first portion and of a metallurgical structure of the second portion immediately adjacent to a bond line. The first portion has a first dominant property and the second portion has a second dominant property. The first dominant property is different from the second dominant property. The first dominant property is selected to handle operating conditions at a first position of the article where the first portion is located and the second dominant property is selected to handle operating conditions at a second position of the article where the second portion is located.
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公开(公告)号:US11852078B2
公开(公告)日:2023-12-26
申请号:US17363958
申请日:2021-06-30
Applicant: Raytheon Technologies Corporation
Inventor: Brian T. Hazel , Alan C. Barron , Mary Catherine Gurak
IPC: C23C14/30 , F02C7/24 , C23C14/08 , C23C16/06 , C23C16/455
CPC classification number: F02C7/24 , C23C14/083 , C23C14/30 , C23C16/06 , C23C16/45525 , F05D2220/32 , F05D2230/31 , F05D2300/1431 , F05D2300/1432 , F05D2300/1433 , F05D2300/1434 , F05D2300/1435
Abstract: A process for coating a component includes applying a bond coat on a substrate of a component; applying a thermal barrier material to the bond coat; and applying a conforming reflective layer to the thermal barrier material, the conforming reflective layer conforming to porous microstructure of the ceramic coating.
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43.
公开(公告)号:US20230323784A1
公开(公告)日:2023-10-12
申请号:US17842932
申请日:2022-06-17
Applicant: Raytheon Technologies Corporation
Inventor: Paul M. Lutjen , John R. Farris , Matthew A. Devore , John A. Sharon , James F. Wiedenhoefer , Mario P. Bochiechio , Brian T. Hazel
CPC classification number: F01D11/18 , F01D25/005 , F05D2230/90 , F05D2230/22 , F05D2260/30
Abstract: An advanced passive clearance control (APCC) control ring is provided. The APCC control ring includes first and second cover sections, first and second wall sections and a control ring. At least one of the first and second cover sections is bonded to corresponding edges of the first and second wall sections by field assisted sintering technology (FAST) processing along a bond surface to form an enclosure for the control ring.
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公开(公告)号:US11781486B2
公开(公告)日:2023-10-10
申请号:US18153509
申请日:2023-01-12
Applicant: RAYTHEON TECHNOLOGIES CORPORATION
Inventor: Brian T. Hazel , Raymond Surace , Robert A. White, III , Zhongfen Ding
CPC classification number: F02C7/28 , F02C3/04 , F16J15/16 , C23C4/11 , C23C4/134 , C23C4/18 , F05D2220/32 , F05D2240/35 , F05D2300/611
Abstract: A seal system includes a ceramic component that has a non-core-gaspath surface region that defines a first surface roughness and a core gaspath surface region. A metallic component is situated adjacent the non-core-gaspath surface region. A coating system is disposed on the ceramic component. The coating system includes a silicon-containing layer on the non-core-gaspath surface region and a barrier layer that has a first section on the silicon-containing layer and a second section on the core-gaspath region and that is connected to the first section. The surface of the barrier layer has a second surface roughness that is less than the first surface roughness. The first section is in contact with the metallic component and the second section serves as an environmental barrier on the core-gaspath region.
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45.
公开(公告)号:US20230278935A1
公开(公告)日:2023-09-07
申请号:US18138395
申请日:2023-04-24
Applicant: Raytheon Technologies Corporation
Inventor: Richard Wesley Jackson , James T. Beals , Xia Tang , Xuan Liu , David A. Litton , Brian T. Hazel
CPC classification number: C04B41/4527 , C04B41/5071 , C04B41/52
Abstract: A coated article including an article having a surface; an oxidation resistant bond coat layer deposited on the surface, the oxidation resistant bond coat layer comprising a metal silicide phase, a crystalline ceramic phase and an amorphous ceramic phase, wherein the metal silicide phase has an aspect ratio greater than 1:1 but less than 50:1.
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公开(公告)号:US20230212951A1
公开(公告)日:2023-07-06
申请号:US18120843
申请日:2023-03-13
Applicant: Raytheon Technologies Corporation
Inventor: Brian Craig , James M. Koonankeil , Brian T. Hazel , Paul E. Denney , Dominic J. Mongillo
CPC classification number: F01D25/12 , F01D5/186 , F01D9/02 , F05D2220/32 , F05D2240/12 , F05D2240/30 , F05D2260/202
Abstract: A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate. A meter section of a cooling aperture is formed in the substrate. An internal coating is applied onto a surface of the meter section. An external coating is applied over the substrate. A diffuser section of the cooling aperture is formed in the external coating and the substrate to provide the cooling aperture.
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公开(公告)号:US11674448B2
公开(公告)日:2023-06-13
申请号:US17377591
申请日:2021-07-16
Applicant: RAYTHEON TECHNOLOGIES CORPORATION
Inventor: Raymond Surace , Brian T. Hazel , Robert A. White, III , Zhongfen Ding
CPC classification number: F02C7/28 , F01D11/001 , F01D11/005 , F01D11/08 , F02C3/04 , F16J15/16 , F05D2220/32 , F05D2240/35 , F05D2240/55
Abstract: A seal system includes a ceramic component, a metallic component, a silicon-containing layer, and a barrier layer. The ceramic component has a first surface region that defines a first surface roughness. The metallic component is situated adjacent to the first surface region and has a second surface region facing the first surface region. The silicon-containing layer is on the first surface region of the ceramic component and has a contact surface that defines a second surface roughness which is less than the first surface roughness. The barrier layer is on the metallic component and in contact with the silicon-containing layer and serves to limit interaction between silicon of the silicon-containing layer and the metallic component. The barrier layer includes at least one of alumina or MCrAlY.
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公开(公告)号:US20230151738A1
公开(公告)日:2023-05-18
申请号:US17842924
申请日:2022-06-17
Applicant: Raytheon Technologies Corporation
Inventor: Paul M. Lutjen , John R. Farris , Brian T. Hazel , Matthew A. Devore , John A. Sharon , James F. Wiedenhoefer , Mario P. Bochiechio
CPC classification number: F01D11/08 , F01D25/007 , F05D2230/21 , F05D2230/10 , F05D2230/22 , F05D2260/204
Abstract: A method of assembling a part is provided and includes forming a first section of the part, defining, in the first section, passages with dimensions as small as 0.005 inches (0.127 mm), forming a second section of the part, metallurgically bonding the first and second sections whereby the passages are delimited by the first and second sections and executing the metallurgically bonding without modifying a condition of the passages.
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公开(公告)号:US20230151736A1
公开(公告)日:2023-05-18
申请号:US17842926
申请日:2022-06-17
Applicant: Raytheon Technologies Corporation
Inventor: Brian T. Hazel , John R. Farris , Matthew A. Devore , John A. Sharon , James F. Wiedenhoefer , Paul M. Lutjen , Mario P. Bochiechio
CPC classification number: F01D5/005 , B22F3/105 , B22F3/24 , B22F2003/247 , B22F2003/242 , F05D2230/80
Abstract: A method of repair of a part is provided and includes removing a section that is damaged from the part, casting a replacement section for the part, the replacement section having a geometry similar to that of the section in an undamaged condition and bonding the replacement section to the part using field assisted sintering technology (FAST).
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公开(公告)号:US11634989B2
公开(公告)日:2023-04-25
申请号:US16859493
申请日:2020-04-27
Applicant: Raytheon Technologies Corporation
Inventor: Daniel A. Bales , Brian T. Hazel , Thomas DeMichael
IPC: F01D5/14 , B23K20/02 , B23K101/00
Abstract: During a bonding process, a tip cap and an airfoil base are provided. The tip cap is arranged on the airfoil base. The tip cap is diffusion bonded to the airfoil base.
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