摘要:
By suppressing a short-channel effect of a MIS field-effect transistor and reducing a fringing capacitance of a gate, a signal delay in the transistor can be shortened. The MIS field-effect transistor is formed d by forming a side-wall spacer from a dielectric having a large dielectric constant and then forming an impurity diffusion layer area with the side-wall spacer used as an introduction end in an ion implantation process to introduce impurities. In this case, the side wall of the side-wall spacer having the large dielectric constant has an optimum film thickness in the range from 5 nm to 15 nm, which is required for achieving a large driving current. On the other hand, a side-wall spacer on an outer side is made of a silicon-dioxide film, which is a dielectric having a small dielectric constant.
摘要:
The present invention provides a MISFET with a replacement gate electrode, which ensures large ON-current. A semiconductor device, in which on the substrate, first and second field effect transistors are formed, the first field effect transistor is a replacement gate type field effect transistor, and the length of the overlap between a gate electrode and a source/drain diffusion zone of the first field effect transistor correspond to that between a gate electrode and a source/drain diffusion zone of the second field effect transistor.