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    CAPACITOR COMPONENT
    42.
    发明申请
    CAPACITOR COMPONENT 有权

    公开(公告)号：US20230094110A1

    公开(公告)日：2023-03-30

    申请号：US17572176

    申请日：2022-01-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jung Min Kim ,  Hong Je Choi ,  Ji Hye Han ,  Byung Woo Kang ,  Hye Jin Park ,  Sang Wook Lee ,  Bon Seok Koo ,  Jung Won Lee

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12

    Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.

    MULTILAYER ELECTRONIC COMPONENT
    44.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220165500A1

    公开(公告)日：2022-05-26

    申请号：US17462726

    申请日：2021-08-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Il Ro Lee ,  Jung Min Kim ,  Hong Je Choi ,  Sang Wook Lee ,  Seon Ho Park ,  Jeong Ryeol Kim ,  Bon Seok Koo

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/06

    Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 μm.

    MULTILAYER ELECTRONIC COMPONENT
    45.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220139618A1

    公开(公告)日：2022-05-05

    申请号：US17308273

    申请日：2021-05-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byung Woo Kang ,  Bon Seok Koo ,  Jeong Ryeol Kim ,  Jung Min Kim ,  Jae Seok Yi ,  Ji Hye Han ,  Hye Jin Park

    IPC: H01G4/015 ,  H01G4/30 ,  H01G4/248

    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.

    Capacitor component
    48.
    发明授权
    Capacitor component 有权

    公开(公告)号：US11094460B2

    公开(公告)日：2021-08-17

    申请号：US16275795

    申请日：2019-02-14

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jeong Suong Yang ,  Bon Seok Koo ,  Sung Min Cho ,  Woong Do Jung ,  Hai Joon Lee

    IPC: H01G4/012 ,  H01G4/30 ,  H01G4/228 ,  H01G4/12

    Abstract: A capacitor component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes including first and second connection portions, and first and second band portions extending onto portions of a surface from the first and second connection portions, respectively; first and second plating layers disposed on the first and second band portions, respectively; humidity resistant layers disposed between the first and second external electrodes, disposed on the first and second external electrodes, and having openings respectively exposing portions of the first and second band portions. The first and second plating layers are disposed in the openings of the humidity resistant layers, respectively, and are in contact with the first and second band portions, respectively.

    Multilayer capacitor having external electrode including conductive resin layer
    49.
    发明授权
    Multilayer capacitor having external electrode including conductive resin layer 有权

    公开(公告)号：US10658117B2

    公开(公告)日：2020-05-19

    申请号：US16271084

    申请日：2019-02-08

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jung Min Kim ,  Bon Seok Koo ,  Jung Wook Seo ,  Yoon Hee Lee ,  Kun Hoi Koo

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/12

    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.

    Coil component and method of manufacturing the same
    50.
    发明授权
    Coil component and method of manufacturing the same 有权

    公开(公告)号：US10580567B2

    公开(公告)日：2020-03-03

    申请号：US15472700

    申请日：2017-03-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yoon Hee Lee ,  Bon Seok Koo ,  Yeon Tae Kim ,  Chang Hak Choi ,  Jung Min Kim

    IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

    Abstract: A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.

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