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公开(公告)号：US20210375543A1
公开(公告)日：2021-12-02
申请号：US17022518
申请日：2020-09-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kun Hoi Koo , Soung Jin Kim , Bon Seok Koo
Abstract: An electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode including a conductive resin layer, disposed on the body, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a metal particle, a first intermetallic compound, and a base resin, and a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer.
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公开(公告)号：US10658117B2
公开(公告)日：2020-05-19
申请号：US16271084
申请日：2019-02-08
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jung Min Kim , Bon Seok Koo , Jung Wook Seo , Yoon Hee Lee , Kun Hoi Koo
Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
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公开(公告)号：US11574773B2
公开(公告)日：2023-02-07
申请号：US17490039
申请日：2021-09-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Soo Yi , Soung Jin Kim , Kun Hoi Koo , Jun Hyeon Kim , Kyung Ryul Lee
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.
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公开(公告)号：US10770230B2
公开(公告)日：2020-09-08
申请号：US15972860
申请日：2018-05-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kun Hoi Koo , Bon Seok Koo , Jung Min Kim , Jun Hyeon Kim , Hae Sol Kang , Soung Jin Kim , Ji Hye Han , Byung Woo Kang , Chang Hak Choi
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.
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公开(公告)号：US11817251B2
公开(公告)日：2023-11-14
申请号：US17514292
申请日：2021-10-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kun Hoi Koo , Byung Woo Kang , Ji Hye Han , Bon Seok Koo
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/04 , H01F27/29 , H01F27/292 , H01F2017/048 , H01F2027/2809
Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.
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Patent Agency Ranking
公开(公告)号：US11437192B2
公开(公告)日：2022-09-06
申请号：US17318938
申请日：2021-05-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Mi Geum Kim , Byeong Cheol Moon , Kun Hoi Koo , Jung Min Kim
Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
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公开(公告)号：US20210118616A1
公开(公告)日：2021-04-22
申请号：US17133851
申请日：2020-12-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kun Hoi Koo , Soung Jin Kim , Bon Seok Koo
IPC: H01G4/232
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.
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公开(公告)号：US20200176189A1
公开(公告)日：2020-06-04
申请号：US16387984
申请日：2019-04-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kun Hoi Koo , Soung Jin Kim , Bon Seok Koo
IPC: H01G4/232
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.
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公开(公告)号：US11342119B2
公开(公告)日：2022-05-24
申请号：US17030943
申请日：2020-09-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Min Kim , Bon Seok Koo , Jung Wook Seo , Yoon Hee Lee , Kun Hoi Koo
Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
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公开(公告)号：US11037732B2
公开(公告)日：2021-06-15
申请号：US16537843
申请日：2019-08-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Mi Geum Kim , Byeong Cheol Moon , Kun Hoi Koo , Jung Min Kim
Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.
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