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公开(公告)号：US10593484B2
公开(公告)日：2020-03-17
申请号：US16155474
申请日：2018-10-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Jae Yeol Choi , Soo Hwan Son
Abstract: An electronic component includes: a plurality of multilayer capacitors stacked in multiple rows and columns and each having external electrodes on both ends thereof in a first direction; and a board including a body and a connection portion. The connection portion includes: a plurality of positive electrode land patterns; a plurality of negative electrode land patterns; positive and negative electrode terminal patterns formed on a lower surface of the body to be spaced apart from each other in the first direction; a positive electrode connection portion connecting the plurality of positive electrode land patterns to the positive electrode terminal pattern; and a negative electrode connection portion connecting the plurality of negative electrode land patterns to the negative electrode terminal pattern.
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公开(公告)号：US10580574B1
公开(公告)日：2020-03-03
申请号：US16195499
申请日：2018-11-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The pair of external terminals include bonding portions disposed on a top surface of the interposer body, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer to connect the bonding portions and the mounting portions to each other. The mounting portions have lengths greater than lengths of the bonding portions in a direction of connection of the pair of external terminals.
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公开(公告)号：US20200006003A1
公开(公告)日：2020-01-02
申请号：US16365088
申请日：2019-03-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dae Heon Jeong , Kyung Hwa Yu , Man Su Byun , Min Kyoung Cheon , Soo Hwan Son , Ho Yoon Kim
Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.
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公开(公告)号：US10448502B2
公开(公告)日：2019-10-15
申请号：US15179513
申请日：2016-06-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Kyoung Jin Jun , Min Kyoung Cheon
Abstract: An electronic component includes a body including a dielectric material and internal electrodes embedded in the dielectric material; external electrodes connected to the internal electrodes and disposed on the body; a first substrate connected to the external electrodes and disposed on one side of the body; and a second substrate connected to the first substrate and disposed on one side of the first substrate. The first and second substrates have different Young's modulus.
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Patent Agency Ranking
公开(公告)号：US10446323B1
公开(公告)日：2019-10-15
申请号：US16189239
申请日：2018-11-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Soo Hwan Son , Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive layer disposed on facing boundaries of the multilayer capacitor and the interposer; wherein the external terminals include bonding portions disposed on a top surface of the interposer body and connected to the external electrodes via the adhesive layer, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer body to connect the bonding portions and the mounting portions to each other; wherein 0.1≤t/T≤0.3 in which dimension “t” is a maximum height of the adhesive layer and dimension “T” is a height of the electronic component.
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公开(公告)号：US10403441B2
公开(公告)日：2019-09-03
申请号：US15974285
申请日：2018-05-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Kyung Hwa Yu , Man Su Byun , Dae Heon Jeong , Min Kyoung Cheon , Soo Hwan Son
IPC: H01G4/012 , H01G4/40 , H01G4/30 , H01G4/232 , H01G4/248 , H01G4/224 , H02H9/02 , H05K1/18 , H01G4/12
Abstract: A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.
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公开(公告)号：US10366839B1
公开(公告)日：2019-07-30
申请号：US16200639
申请日：2018-11-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Yoon Kim , Sang Soo Park , Woo Chul Shin
Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and external electrodes disposed on opposite ends of the capacitor body in a first direction, respectively; and an interposer including an interposer body including a woven glass fiber material and external terminals disposed on opposite ends of the interposer body in the first direction, respectively. An angle between a weaving direction of the woven glass fiber material and the first direction is 0° to 10° or 80° to 90°.
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公开(公告)号：US10249438B1
公开(公告)日：2019-04-02
申请号：US15935680
申请日：2018-03-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Man Su Byun , Young Ghyu Ahn , Ho Yoon Kim , Jae Yeol Choi , Soo Hwan Son
Abstract: A multilayer ceramic capacitor includes a ceramic body in which a plurality of dielectric layers are layered in a width direction, an active part including a plurality of first and second internal electrodes alternately exposed to opposing end surfaces of the ceramic body with the dielectric layer interposed therebetween to form capacitance, an upper cover part provided on an upper surface of the active part, a lower cover part provided on a lower surface of the active part and having a thickness greater than that of the upper cover part, and first and second external electrodes formed to cover opposing end surfaces of the ceramic body, wherein a ratio of the cube root of the volume of the active part to the thickness of the lower cover part is between 1.4 and 8.8.
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公开(公告)号：US09767950B2
公开(公告)日：2017-09-19
申请号：US14281097
申请日：2014-05-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Myeong Gi Kim , Il Jin Park , Ho Yoon Kim , Jin Woo Hahn , Min Kyoung Cheon
CPC classification number: H01F17/0013
Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.
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