Abstract:
A high contrast spatial light modulator for display and printing is fabricated by coupling a high active reflection area fill-ratio and non-diffractive micro-mirror array with a high electrostatic efficiency and low surface adhesion control substrate.
Abstract:
Devices and methods for forming a spatial light modulator with high contrast are described. Light absorbing materials are used within a chamber that houses a spatial light modulator. The light absorbing materials absorb reflected light that is not intended for forming a part of a display image. The light absorbing material can form an aperture layer, wherein light to form the display image is transmitted through an opening in the aperture layer. An array of spatial light modulators can be within the housing and dummy spatial light modulators may be formed to enable easy alignment of the array with the opening in the aperture layer.
Abstract:
A high contrast spatial light modulator for display and printing is fabricated by coupling a high active reflection area fill-ratio and non-diffractive micro-mirror array with a high electrostatic efficiency and low surface adhesion control substrate.
Abstract:
A micro mirror includes a hinge support post on the substrate, a hinge connection post on the hinge support post, wherein the hinge connection post comprises a bottom layer connected to the hinge support post and a side layer surrounding a cavity in the center of the hinge connection post, a hinge component connected to the side layer of the hinge connection post; and a mirror plate configured to tilt around the hinge component.
Abstract:
A method for fabricating a micro structure includes forming a first structure portion on a substrate; disposing a sacrificial material over the first structure portion; depositing a layer of a first structural material over the sacrificial material and the substrate; removing at least a portion of the sacrificial material to form a second structure portion in the layer of the first structural material, and forming a carbon layer on a surface of the second structure portion or on a surface of the first structure portion to prevent stiction between the second structure portion and the first structure portion. The second structure portion is connected with the substrate and is movable between a first position in which the second structural portion is separated from the first structure portion and a second position in which the second structure portion is in contact with the first structure portion.
Abstract:
A spatial light modulator includes a two-dimensional array of hexagonal mirror plates disposed in a honeycomb pattern over a substrate. Each of the hexagonal mirror plates is supported by one or more structural members. There is a gap between adjacent hexagonal mirror plates. The structural members are not located in the gap.
Abstract:
Methods and apparatus for providing a high-resolution spatial light modulator. A spatial light modulator includes a cell that includes: a substrate portion; a first support post and a second support post, each having a top surface; and a micro mirror. The micro mirror includes a bottom layer that includes a hinge member having a longitudinal axis, a width across the longitudinal axis, a first end on the longitudinal axis, and a second end on the longitudinal axis. The first end and second end is secured to the first support post and the second support post, respectively. The hinge member has a same thickness of the bottom layer, wherein the width of the hinge member is greater than a thickness of the bottom layer.
Abstract:
Apparatus for in-situ monitoring of a process in a semiconductor wafer processing system consists of a process chamber having a dome, an enclosure disposed above the chamber, a process monitoring assembly positioned proximate the dome, an opening in the dome, and a window covering the opening. A portion of the apparatus supports the process monitoring assembly to establish a line-of-sight propagation path of monitoring beams from above the dome, through the window to the substrate to facilitate etch depth measurement without encountering interference from high power energy sources proximate the chamber. A method of fabricating a process monitoring apparatus consists of the steps of boring an opening into a dome, positioning the process monitoring assembly in proximity to the dome so as to allow a line-of-sight propagation path of monitoring beams from the process monitoring assembly to a wafer, and covering the opening with a window. The window is permanent or removable dependent upon the type of process monitoring assembly being used in the system.
Abstract:
A wafer containing a plurality of electro-optical devices, each device being enclosed in chamber that has a translucent cover. An X-Y matrix of pairs of interconnections on the wafer are connected to the circuitry of the electro-optical devices for addressing the electro-optical devices. The pairs of interconnections extend outside of the chambers enclosing the devices to testing areas on the periphery of the wafer. Testing is done by signals applied through the interconnections while simultaneously exposing the devices to light through the translucent covers.