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公开(公告)号：US11005981B2
公开(公告)日：2021-05-11
申请号：US16583569
申请日：2019-09-26
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Jing-Wei Li , Shin-Wen Chen , Sheng-Jie Ding , Jian-Chao Song
IPC: H04M1/02
Abstract: A single camera module able to swivel to capture images in front of and behind an electronic device includes a housing, a camera module, and a turnover element. The turnover element includes a support plate and a connecting portion. The housing is arranged on the support plate, thus forming a receiving space together with the support plate. The camera assembly is received in the receiving space. The connecting portion is arranged on the support plate and located on an outside of the housing. The disclosure further provides an electronic device including the camera module.
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公开(公告)号：US10897188B2
公开(公告)日：2021-01-19
申请号：US16561386
申请日：2019-09-05
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
IPC: H02K41/035 , H04N5/225 , G02B7/08
Abstract: A voice coil motor in a camera module with a means of being mounted robustly on a base comprises a casing and the base. The casing is hollow, the casing comprises a top surface and a side wall around the top surface. The base comprises a base portion and projections, the base portion being in contact with the side wall of the casing and engaged with the casing to form a cavity. The side wall is provided with recesses external to the cavity to accept the projections, the projections lending structural reinforcement to the casing.
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43.发明授权公开(公告)号：US10827606B2
公开(公告)日：2020-11-03
申请号：US16255352
申请日：2019-01-23
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Shin-Wen Chen , Long-Fei Zhang , Ke-Hua Fan , Kun Li
IPC: H01L27/146 , H05K1/02 , G02B5/20 , H05K1/18 , G02B7/02 , H01L31/0232 , H01L31/0203
Abstract: A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.
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公开(公告)号：US10827105B1
公开(公告)日：2020-11-03
申请号：US16539037
申请日：2019-08-13
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Kun Li , Shin-Wen Chen , Xiao-Mei Ma , Long-Fei Zhang
Abstract: A less conspicuous lens module able to approach closer to a corner of a display screen on an electronic device includes a circuit board, a carrier, and a lens assembly. The circuit board includes a first hard board portion. The carrier is disposed on the first hard board portion, and the lens assembly is disposed on the carrier. The first hard board portion, the carrier, and the lens assembly all have a cutaway structure at their edges. The cutaway structures of the first hard board portion, the carrier, and the lens assembly are consistent in shape and size and are aligned with each other. An electronic device using such a lens module is also provided.
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Patent Agency Ranking
公开(公告)号：US10823973B2
公开(公告)日：2020-11-03
申请号：US16435994
申请日：2019-06-10
Applicant: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
Inventor： Xiao-Mei Ma , Shin-Wen Chen , Long-Fei Zhang , Kun Li
Abstract: A light projecting module for use in electronic devices, the light projecting module including a circuit board having a laser light source, a seat mounted on the circuit board, a transparent conductive film mounted on a surface of the seat away the circuit board, at least one conductive layer formed on the seat and having first and second end portions, at least one conductive ball electrically connecting the first end portion to the transparent conductive film, and at least one insulating colloid formed at a junction of the transparent conductive film, the first end portion, and the conductive ball. The second end portion of the at least one conductive layer is electrically connected to the circuit board.
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公开(公告)号：US10768392B2
公开(公告)日：2020-09-08
申请号：US16185052
申请日：2018-11-09
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Long-Fei Zhang , Shin-Wen Chen , Kun Li , Xiao-Mei Ma
Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.
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公开(公告)号：US10748946B2
公开(公告)日：2020-08-18
申请号：US16222012
申请日：2018-12-17
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
Inventor： Yu-Shuai Li , Shin-Wen Chen , Kun Li , Ke-Hua Fan
IPC: H04N5/225 , H01L27/146 , H05K1/02 , H04N5/335
Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.
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公开(公告)号：US10666843B2
公开(公告)日：2020-05-26
申请号：US16165824
申请日：2018-10-19
Inventor： Kun Li , Shin-Wen Chen , Long-Fei Zhang , Xiao-Mei Ma
IPC: H04N5/225 , H01L27/146 , H01R12/77
Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.
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公开(公告)号：US10359615B2
公开(公告)日：2019-07-23
申请号：US15856081
申请日：2017-12-28
Inventor： Kun Li , Shin-Wen Chen , Jing-Wei Li , Sheng-Jie Ding
Abstract: A camera module which collects incoming dirt and dust so as to prevent the accumulation of same on an optical element of the image-capturing process includes a microscope base and an optical filter unit. The microscope base includes a supporting portion. A first gap is formed in the supporting portion. The optical filter unit filter and adhesive layer formed on the optical filter. The optical filter is bonded on the supporting portion by the adhesive layer. The optical filter comprises a filter area in the optical filter. A surface of the adhesive layer facing away from the optical filter is adhesive. A second gap is formed in the adhesive layer. The filter area is exposed from the second gap. Parts of the adhesive layer and the filter area are exposed from the first gap.
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