公开(公告)号：US20200373253A1

公开(公告)日：2020-11-26

申请号：US16989492

申请日：2020-08-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chia Hu ,  Chun-Chiang Kuo ,  Sen-Bor Jan ,  Ming-Fa Chen ,  Hsien-Wei Chen

IPC: H01L23/58 ,  H01L23/522 ,  H01L23/532 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L29/06

Abstract: A structure includes a first die and a second die. The first die includes a first bonding layer having a first plurality of bond pads disposed therein and a first seal ring disposed in the first bonding layer. The first bonding layer extends over the first seal ring. The second die includes a second bonding layer having a second plurality of bond pads disposed therein. The first plurality of bond pads is bonded to the second plurality of bond pads. The first bonding layer is bonded to the second bonding layer. An area interposed between the first seal ring and the second bonding layer is free of bond pads.