公开(公告)号：US20080217532A1

公开(公告)日：2008-09-11

申请号：US12043946

申请日：2008-03-06

Applicant: Kazuhiro Ueda ,  Tatsuya Maeda

Inventor： Kazuhiro Ueda ,  Tatsuya Maeda

IPC: G01N23/00

CPC classification number: G01N23/2251 ,  H01J2237/0041 ,  H01J2237/221 ,  H01J2237/248 ,  H01J2237/28

Abstract: A method and apparatus for setting a sample observation condition and a method and apparatus for sample observation which allow sample observation by speedily and simply finding an optimum condition while suppressing damage to the sample are provided. The setting of a sample observation condition according to the present invention is realized by an electron beam apparatus acquiring a profile at a predetermined evaluation location of a sample under a reference observation condition, by a processing section judging whether or not the above described acquired profile is located within a predetermined setting range and setting an optimum observation condition to be used for sample observation based on this judgment result. More specifically, locations where the condition can be examined are registered beforehand first and then a jump is made to the corresponding location which is irradiated with an electron beam (hereinafter referred to as “predosing”) at a low magnification, the surface of the sample is charged, enlarged to an observation magnification and secondary electron information on the target location is obtained. After that, secondary electron information is obtained at any time while performing predosing, it is successively judged from the information whether the pattern bottom part can be observed/measured or whether or not the sample is destroyed and an optimum observation condition is thereby found.

Abstract translation: 提供了一种用于设置样品观察条件的方法和装置以及用于样品观察的方法和装置，其允许通过快速简单地找到最佳条件同时抑制对样品的损伤的样品观察。 根据本发明的样品观察条件的设定是通过电子束装置实现的，该电子束装置在参考观察条件下在样本的预定评估位置获取轮廓，通过处理部分判断上述获得的轮廓是否为 位于预定设定范围内，并且基于该判断结果设定用于样本观察的最佳观察条件。 更具体地说，先检查条件的位置，然后，以低放大倍数，以低放大倍率，对照射有电子束的对应位置（以下称为“预取”）进行跳转，将样品的表面 被放大到观察倍率，并且获得目标位置上的二次电子信息。 之后，在执行预取时随时获得二次电子信息，根据信息连续判断图案底部是否可以被观察/测量，或者样品是否被破坏，从而找到最佳观察条件。

公开(公告)号：US20070045538A1

公开(公告)日：2007-03-01

申请号：US11499805

申请日：2006-08-07

Applicant: Mitsuji Ikeda ,  Tatsuya Maeda ,  Osamu Nasu ,  Fumihiro Sasajima

Inventor： Mitsuji Ikeda ,  Tatsuya Maeda ,  Osamu Nasu ,  Fumihiro Sasajima

IPC: G21K7/00

CPC classification number: G06T7/001 ,  G01N21/95607 ,  G06T2207/30148

Abstract: Information indicating the reason for a failure of template matching is provided. Difference information between a first image, which is referred to as a template, and a third image that is selected by the operator from a second image and that is larger than the template is displayed.

Abstract translation: 提供指示模板匹配失败的原因的信息。 显示被称为模板的第一图像与操作者从第二图像选择并且大于模板的第三图像之间的差异信息。

公开(公告)号：US20060091309A1

公开(公告)日：2006-05-04

申请号：US11260187

申请日：2005-10-28

Applicant: Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

Inventor： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC: G21K7/00

CPC classification number: H01J37/28 ,  H01J37/222 ,  H01J2237/221 ,  H01J2237/2826

Abstract: As measurement accuracy required for the scanning electron microscope (SEM) for measuring a pattern width becomes stringent, a technique of reducing the difference in a measured dimension between the SEM's is desired. However, the conventional technique of evaluating the difference in a measured dimension between the SEM's cannot separate the difference in a measured dimension between the SEM's themselves and a dimensional change resulting from deformation of the pattern itself. Moreover, the technique of reducing the difference in a measured dimension between the SEM's needs an operator for reducing the difference in a measured dimension between the SEM's for each measurement pattern shape. In this invention, a pattern at the same position is measured for a plurality of times with each SEM, and a different between extrapolated values of measured values obtained by the respective SEM's is calculated, whereby separation between the difference in a measured dimension between the SEM's and a dimensional change resulting from deformation of the pattern itself is made possible. Moreover, matching electron beam image profiles between the SEM's using an operator that simulates a difference in beam diameter between the SEM's makes it possible to reduce the difference in a measured dimension between the SEM's, not depending on a dimensional measurement pattern shape.

Abstract translation: 由于用于测量图形宽度的扫描电子显微镜（SEM）所需的测量精度变得严格，所以希望减少SEM之间的测量尺寸差异的技术。 然而，评估SEM之间的测量尺寸差异的常规技术不能分离SEM本身之间的测量尺寸与由图案本身的变形引起的尺寸变化之间的差异。 此外，减少SEM之间的测量尺寸的差异的技术需要一个操作者，用于减小每个测量图案形状的SEM之间的测量尺寸的差异。 在本发明中，通过各SEM测量同一位置的图案多次，并且计算通过各SEM得到的测量值的外推值之间的差异，由此SEM之间的测量尺寸差异之间的差异 并且由于图案本身的变形引起的尺寸变化成为可能。 此外，使用模拟SEM之间的光束直径差的SEM的SEM之间的匹配电子束图像轮廓可以减小SEM之间的测量尺寸的差异，而不依赖于尺寸测量图案形状。

公开(公告)号：US07002151B2

公开(公告)日：2006-02-21

申请号：US10933342

申请日：2004-09-03

Applicant: Satoru Yamaguchi ,  Takashi Iizumi ,  Osamu Komuro ,  Hidetoshi Morokuma ,  Tatsuya Maeda ,  Juntaro Arima ,  Yasuhiko Ozawa

Inventor： Satoru Yamaguchi ,  Takashi Iizumi ,  Osamu Komuro ,  Hidetoshi Morokuma ,  Tatsuya Maeda ,  Juntaro Arima ,  Yasuhiko Ozawa

IPC: H01J37/28

CPC classification number: H01J37/28 ,  G01N23/04 ,  G01N23/225 ,  G06T7/74 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01J37/222 ,  H01J2237/2817

Abstract: An object of the present invention is to provide a scanning electron microscope for reducing a process concerning inspection positioning or an input operation, thereby functioning with high precision at high speed. To accomplish the above object, the present invention provides a scanning electron microscope having a function for identifying a desired position on the basis of a pattern registered beforehand, which includes a means for setting information concerning the pattern kind, the interval between a plurality of parts constituting the pattern, and the size of parts constituting the pattern and a means for forming a pattern image composed of a plurality of parts on the basis of the information obtained by the concerned means.

Abstract translation: 本发明的目的是提供一种用于减少与检查定位或输入操作相关的处理的扫描电子显微镜，从而以高速度高精度地运行。 为了实现上述目的，本发明提供了一种扫描电子显微镜，其具有基于预先登记的图案来识别期望位置的功能，该扫描电子显微镜包括用于设置关于图案种类的信息的装置，多个部分之间的间隔 构成图案的部分，以及构成图案的部分的尺寸，以及基于由相关装置获得的信息形成由多个部分组成的图案图像的装置。

公开(公告)号：US08502144B2

公开(公告)日：2013-08-06

申请号：US13190847

申请日：2011-07-26

Applicant: Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

Inventor： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC: H01J37/28 ,  H01J37/256 ,  G01N23/00

CPC classification number: H01J37/28 ,  H01J2237/282

Abstract: A system for controlling a tool-to-tool disparity between a plurality of scanning electron microscopes includes a measuring unit for measuring a tool-to-tool disparity between plural scanning electron microscopes based on information extracted from secondary electron images which are captured by imaging a reference pattern, a tool state monitoring unit for monitoring tool states of each of the plural scanning electron microscopes, and an output unit for displaying on a screen a relationship between the tool-to-tool disparity between the plural scanning electron microscopes and tool states of each of the plural scanning electron microscopes monitored by the tool state monitoring unit. The tool state monitoring unit monitors the tool states of each of the plural scanning electron microscopes while imaging the reference pattern by using each of the plural scanning electron microscopes.

Abstract translation: 用于控制多个扫描电子显微镜之间的工具对工具差异的系统包括：测量单元，用于基于通过成像获得的二次电子图像提取的信息来测量多个扫描电子显微镜之间的工具对工具差异 参考图案，用于监视多个扫描电子显微镜中的每一个的工具状态的工具状态监视单元和用于在屏幕上显示多个扫描电子显微镜之间的工具与工具之间的差异与工具状态之间的关系的输出单元 由工具状态监视单元监视的多个扫描电子显微镜中的每一个。 工具状态监视单元通过使用多个扫描电子显微镜中的每一个来对多个扫描电子显微镜中的每个扫描电子显微镜的工具状态进行监视，同时对参考图案进行成像。

公开(公告)号：US08384030B2

公开(公告)日：2013-02-26

申请号：US12043946

申请日：2008-03-06

Applicant: Kazuhiro Ueda ,  Tatsuya Maeda

Inventor： Kazuhiro Ueda ,  Tatsuya Maeda

IPC: G01N23/00

CPC classification number: G01N23/2251 ,  H01J2237/0041 ,  H01J2237/221 ,  H01J2237/248 ,  H01J2237/28

Abstract: A method and apparatus for setting a sample observation condition and a method and apparatus for sample observation which allow sample observation by speedily and simply finding an optimum condition while suppressing damage to the sample are provided. The setting of a sample observation condition according to the present invention is realized by an electron beam apparatus acquiring a profile at a predetermined evaluation location of a sample under a reference observation condition, by a processing section judging whether or not the above described acquired profile is located within a predetermined setting range and setting an optimum observation condition to be used for sample observation based on this judgment result. More specifically, locations where the condition can be examined are registered beforehand first and then a jump is made to the corresponding location which is irradiated with an electron beam (hereinafter referred to as “predosing”) at a low magnification, the surface of the sample is charged, enlarged to an observation magnification and secondary electron information on the target location is obtained. After that, secondary electron information is obtained at any time while performing predosing, it is successively judged from the information whether the pattern bottom part can be observed/measured or whether or not the sample is destroyed and an optimum observation condition is thereby found.

Abstract translation: 提供了一种用于设置样品观察条件的方法和装置以及用于样品观察的方法和装置，其允许通过快速简单地找到最佳条件同时抑制对样品的损伤的样品观察。 根据本发明的样品观察条件的设定是通过电子束装置实现的，该电子束装置在参考观察条件下在样本的预定评估位置获取轮廓，通过处理部分判断上述获得的轮廓是否为 位于预定设定范围内，并且基于该判断结果设定用于样本观察的最佳观察条件。 更具体地说，可以首先登录可以检查条件的位置，然后跳转到以低倍率照射电子束的对应位置（以下称为预取），将样品的表面充电 获得放大到目标位置的观察倍率和二次电子信息。 之后，在执行预取时随时获得二次电子信息，根据信息连续判断图案底部是否可以被观察/测量，或者样品是否被破坏，从而找到最佳观察条件。

公开(公告)号：US08207512B2

公开(公告)日：2012-06-26

申请号：US12898455

申请日：2010-10-05

Applicant: Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

Inventor： Chie Shishido ,  Mayuka Oosaki ,  Mitsugu Sato ,  Hiroki Kawada ,  Tatsuya Maeda

IPC: G21K7/00 ,  A61N5/00 ,  G21G5/00

CPC classification number: H01J37/263 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2826

Abstract: The present invention provides a charged particle beam apparatus used to measure micro-dimensions (CD value) of a semiconductor apparatus or the like which captures images for measurement. For the present invention, a sample for calibration, on which a plurality of polyhedral structural objects with known angles on surfaces produced by the crystal anisotropic etching technology are arranged in a viewing field, is used. A beam landing angle at each position within a viewing field is calculated based on geometric deformation on an image of each polyhedral structural object. Beam control parameters for equalizing the beam landing angle at each position within the viewing field are pre-registered. The registered beam control parameters are applied according to the position of the pattern to be measured within the viewing field when performing dimensional measurement. Accordingly, the present invention provides methods for reducing the variation in the CD value caused by the variation in the electron beam landing angle with respect to the sample with an equal beam landing angle and methods for reducing the instrumental error caused by the difference in the electron beam landing angle between apparatuses.

Abstract translation: 本发明提供一种用于测量捕获用于测量的图像的半导体装置等的微尺寸（CD值）的带电粒子束装置。 对于本发明，使用用于校准的样品，其上在视场中排列有通过晶体各向异性蚀刻技术产生的表面上具有已知角度的多个多面体结构物体。 基于每个多面体结构物体的图像上的几何变形来计算视野内的每个位置处的束着陆角。 用于均衡视场内每个位置的束着陆角的光束控制参数被预先注册。 当进行尺寸测量时，根据待测图案的位置在观察区域中应用登记的光束控制参数。 因此，本发明提供了减少相对于具有相同束着陆角的样品的电子束着角的变化引起的CD值的变化的方法，以及用于减少由电子差异引起的仪器误差的方法 设备之间的束着陆角度。

公开(公告)号：US20110278453A1

公开(公告)日：2011-11-17

申请号：US13190847

申请日：2011-07-26

Applicant: Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

Inventor： Mayuka Oosaki ,  Chie Shishido ,  Hiroki Kawada ,  Tatsuya Maeda

IPC: G01N23/00

CPC classification number: H01J37/28 ,  H01J2237/282

Abstract: A system for controlling a tool-to-tool disparity between a plurality of scanning electron microscopes includes a measuring unit for measuring a tool-to-tool disparity between plural scanning electron microscopes based on information extracted from secondary electron images which are captured by imaging a reference pattern, a tool state monitoring unit for monitoring tool states of each of the plural scanning electron microscopes, and an output unit for displaying on a screen a relationship between the tool-to-tool disparity between the plural scanning electron microscopes and tool states of each of the plural scanning electron microscopes monitored by the tool state monitoring unit. The tool state monitoring unit monitors the tool states of each of the plural scanning electron microscopes while imaging the reference pattern by using each of the plural scanning electron microscopes.

Abstract translation: 用于控制多个扫描电子显微镜之间的工具对工具差异的系统包括：测量单元，用于基于通过成像获得的二次电子图像提取的信息来测量多个扫描电子显微镜之间的工具对工具差异 参考图案，用于监视多个扫描电子显微镜中的每一个的工具状态的工具状态监视单元和用于在屏幕上显示多个扫描电子显微镜之间的工具与工具之间的差异与工具状态之间的关系的输出单元 由工具状态监视单元监视的多个扫描电子显微镜中的每一个。 工具状态监视单元通过使用多个扫描电子显微镜中的每一个来对多个扫描电子显微镜中的每个扫描电子显微镜的工具状态进行监视，同时对参考图案进行成像。

公开(公告)号：US07684937B2

公开(公告)日：2010-03-23

申请号：US12078840

申请日：2008-04-07

Applicant: Atsuko Yamaguchi ,  Hiroshi Fukuda ,  Hiroki Kawada ,  Tatsuya Maeda

Inventor： Atsuko Yamaguchi ,  Hiroshi Fukuda ,  Hiroki Kawada ,  Tatsuya Maeda

IPC: G01B5/28

CPC classification number: G01B15/08 ,  G01N23/2251 ,  G03F7/70625 ,  H01J2237/223 ,  H01J2237/2817

Abstract: Equipment extracts components of spatial frequency that need to be evaluated in manufacturing a device or in analyzing a material or process out of edge roughness on fine line patterns and displays them as indexes. The equipment acquires data of edge roughness over a sufficiently long area, integrates components corresponding to a spatial frequency region being set on a power spectrum by the operator, and displays them on a length measuring SEM. Alternatively, the equipment divides the edge roughness data of the sufficiently long area, computes long-period roughness and short-period roughness that correspond to an arbitrary inspection area by performing statistical processing and fitting based on theoretical calculation, and displays them on the length measuring SEM.

Abstract translation: 设备提取在制造设备时需要评估的空间频率的组件，或者在细线图案上分析材料或工艺的边缘粗糙度并将其显示为索引。 设备在足够长的区域上获取边缘粗糙度的数据，对与操作者在功率谱上设置的空间频率区域相对应的分量进行积分，并将其显示在长度测量SEM上。 或者，设备对足够长的区域的边缘粗糙度数据进行分割，通过进行基于理论计算的统计处理和拟合来计算与任意检查区域相对应的长周期粗糙度和短周期粗糙度，并将其显示在长度测量 SEM。

公开(公告)号：US20080215274A1

公开(公告)日：2008-09-04

申请号：US12078840

申请日：2008-04-07

Applicant: Atsuko Yamaguchi ,  Hiroshi Fukuda ,  Hiroki Kawada ,  Tatsuya Maeda

Inventor： Atsuko Yamaguchi ,  Hiroshi Fukuda ,  Hiroki Kawada ,  Tatsuya Maeda

IPC: G06F17/18 ,  G06F19/00 ,  G01N23/22

CPC classification number: G01B15/08 ,  G01N23/2251 ,  G03F7/70625 ,  H01J2237/223 ,  H01J2237/2817

Abstract: Equipment extracts components of spatial frequency that need to be evaluated in manufacturing a device or in analyzing a material or process out of edge roughness on fine line patterns and displays them as indexes. The equipment acquires data of edge roughness over a sufficiently long area, integrates a components corresponding to a spatial frequency region being set on a power spectrum by the operator, and displays them on a length measuring SEM. Alternatively, the equipment divides the edge roughness data of the sufficiently long area, computes long-period roughness and short-period roughness that correspond to an arbitrary inspection area by performing statistical processing and fitting based on theoretical calculation, and displays them on the length measuring SEM.

Abstract translation: 设备提取在制造设备时需要评估的空间频率的组件，或者在细线图案上分析材料或工艺的边缘粗糙度并将其显示为索引。 设备在足够长的区域上获取边缘粗糙度的数据，对与操作者在功率谱上设置的空间频率区域相对应的分量进行积分，并将其显示在长度测量SEM上。 或者，设备对足够长的区域的边缘粗糙度数据进行分割，通过进行基于理论计算的统计处理和拟合来计算与任意检查区域相对应的长周期粗糙度和短周期粗糙度，并将其显示在长度测量 SEM。