公开(公告)号：US20080264604A1

公开(公告)日：2008-10-30

申请号：US11739160

申请日：2007-04-24

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： F28F3/12 ,  F28F3/02 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.

摘要翻译： 提供冷却装置和制造方法以便于从电子设备移除热量。 冷却装置包括具有多个入口和出口通道的歧管结构，该入口和出口通道用于将冷却剂喷射到待冷却的表面上并且在撞击待冷却表面之后排出冷却剂。 冷却剂入口和出口通道在歧管结构中交错，并且冷却剂通过歧管的公共边缘被注入和排出。 歧管结构还包括冷却剂入口和出口增压室，其中冷却剂沿着第一方向从入口通风室通过入口通道，并且冷却剂在第二方向上通过出口通道到出口增压室，第一和第二方向垂直于 待冷却的表面并且是相反的方向，并且其中歧管结构包含在由公共边缘的突出部限定的矩形体积内。

公开(公告)号：US20080170366A1

公开(公告)日：2008-07-17

申请号：US12054944

申请日：2008-03-25

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H01L23/4338 ,  H01L2924/0002 ,  H01L2924/00

摘要： Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

摘要翻译： 提供冷却装置和方法用于冷却包括支撑多个电子部件的基板的组件。 冷却装置包括：多个分立的冷板，每个分别具有冷却剂入口，冷却剂出口和设置在其间的至少一个冷却剂室; 和多个冷却剂输送管，每个管从相应的冷板延伸并与冷板的冷却剂入口或出口流体连通。 提供了一个外壳，其周边区域与基板接合以形成空腔，电子部件和冷板设置在空腔内。 外壳被配置有多个孔，每个孔的尺寸和位置被定位成接收从冷板延伸的管的相应的冷却剂承载管。 此外，外壳配置有与管流体连通的歧管，用于与冷板平行地分配冷却剂。

公开(公告)号：US20080158815A1

公开(公告)日：2008-07-03

申请号：US12049632

申请日：2008-03-17

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

摘要翻译： 使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。 冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。 框架包括一个带空气入口的前部和一个带有空气出口的后部。 框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧空气在框架的相对侧返回。 至少一个空气移动装置在电子抽屉之间建立空气流。 空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。 空气对液体的热交换器冷却流过电子抽屉的空气。

公开(公告)号：US20130019614A1

公开(公告)日：2013-01-24

申请号：US13187561

申请日：2011-07-21

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F25D31/00

CPC分类号： H05K7/20136 ,  H05K7/20209 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20781

摘要： A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

公开(公告)号：US20100296248A1

公开(公告)日：2010-11-25

申请号：US12850104

申请日：2010-08-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20 ,  F04B43/04 ,  F28D15/00

CPC分类号： H05K7/20218

摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

摘要翻译： 为多流体电子冷却系统和方法提供双室流体泵。 泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。 第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。 将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸 第一流体冷却剂进入第一泵送室。

公开(公告)号：US20090314467A1

公开(公告)日：2009-12-24

申请号：US12141290

申请日：2008-06-18

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28F7/00

CPC分类号： H01L23/4735 ,  F28F3/022 ,  F28F13/02 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin including a stem with a bulb structure on its distal end; depositing material onto the plurality of thermally conductive pin fins to integrally form a jet impingement structure with the pin fins, wherein the distal ends of the plurality of thermally conductive pin fins form part of the jet impingement structure; and controlling the depositing of material onto the distal ends of the pin fins to form a plurality of jet orifices in the jet impingement structure, with the depositing resulting in the plurality of jet orifices automatically self-aligning between the plurality of thermally conductive pin fins.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 制造方法包括：将多个导热针翅片接合到待冷却的表面，每个销翅片包括在其远端具有灯泡结构的杆; 将材料沉积到所述多个导热销翅片上以一体地形成具有所述销翅片的喷射冲击结构，其中所述多个导热销翅片的远端形成所述喷射冲击结构的一部分; 以及控制材料沉积到销散热片的远端上以在喷射冲击结构中形成多个喷射孔，沉积导致多个喷射孔在多个导热销翅片之间自动自对准。

公开(公告)号：US20090157333A1

公开(公告)日：2009-06-18

申请号：US11956405

申请日：2007-12-14

申请人： Ronald P. CORRADO ,  Madhusudan K. IYENGAR ,  Jeffrey A. NEWCOMER ,  Roger R. SCHMIDT ,  Gerard V. WEBER, JR.

发明人： Ronald P. CORRADO ,  Madhusudan K. IYENGAR ,  Jeffrey A. NEWCOMER ,  Roger R. SCHMIDT ,  Gerard V. WEBER, JR.

IPC分类号： G01R21/00 ,  G06F19/00 ,  G06Q10/00

CPC分类号： G06Q10/06 ,  G01R22/00 ,  G06Q50/00 ,  G06Q50/06 ,  Y02P90/82

摘要： An automated method and system are provided for facilitating monitoring of energy usage within a data center. The method includes automatically determining energy usage of one or more electronics racks of a data center by automatically ascertaining time-based energy usage of the electronics racks. The automatically ascertaining includes obtaining multiple measurements of instantaneous energy usage by each of the electronics racks in the data center over a period of time, and then separately averaging the multiple measurements for each electronics rack to obtain the time-based energy usage of each electronics racks. The method also includes outputting the time-based energy usage of the electronic(s) racks to facilitate monitoring of the data center.

摘要翻译： 提供了一种自动化方法和系统，用于便于监视数据中心内的能量使用。 该方法包括通过自动确定电子机架的基于时间的能量使用来自动确定数据中心的一个或多个电子机架的能量使用。 自动确定包括在一段时间内获得数据中心中每个电子机架的瞬时能量使用的多个测量值，然后分别平均每个电子机架的多个测量值，以获得每个电子机架的基于时间的能量使用 。 该方法还包括输出电子机架的基于时间的能量使用以便于监视数据中心。

公开(公告)号：US20090129016A1

公开(公告)日：2009-05-21

申请号：US11942818

申请日：2007-11-20

申请人： Allan R. HOEFT ,  Madhusudan K. IYENGAR ,  Francis R. KRUG, JR. ,  Steven C. McINTOSH ,  Matthew A. NOBILE ,  Donald W. PORTER ,  Roger R. SCHMIDT ,  Howard P. WELZ

发明人： Allan R. HOEFT ,  Madhusudan K. IYENGAR ,  Francis R. KRUG, JR. ,  Steven C. McINTOSH ,  Matthew A. NOBILE ,  Donald W. PORTER ,  Roger R. SCHMIDT ,  Howard P. WELZ

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism.

摘要翻译： 提供了一种气流拦截装置，其被配置为驻留在数据中心内的电子机架上方。 该装置包括气流避雷器和轨道机构。 气流避雷器包括可折叠的面板，其尺寸和构造设置成驻留在电子机架上方，并且当可操作地定位在电子机架上方时，垂直地延伸到电子机架的上方，并且至少部分地阻止气流从空气出口和 机架的入口侧。 轨道机构的尺寸和构造设置在驻留在电子机架上方，并且气流避雷器可滑动地与轨道机构接合。 通过可滑动地接合轨道机构的气流避雷器便利气流避雷器在电子机架上方的期望位置的定位。

公开(公告)号：US20090129000A1

公开(公告)日：2009-05-21

申请号：US11942815

申请日：2007-11-20

申请人： Allan R. HOEFT ,  Madhusudan K. IYENGAR ,  Francis R. KRUG, JR. ,  Steven C. McINTOSH ,  Matthew A. NOBILE ,  Donald W. PORTER ,  Roger R. SCHMIDT ,  Howard P. WELZ

发明人： Allan R. HOEFT ,  Madhusudan K. IYENGAR ,  Francis R. KRUG, JR. ,  Steven C. McINTOSH ,  Matthew A. NOBILE ,  Donald W. PORTER ,  Roger R. SCHMIDT ,  Howard P. WELZ

IPC分类号： H05K5/00 ,  H05K7/20

CPC分类号： H05K7/20745 ,  F24F13/081

摘要： An airflow arrester is provided and configured to reside between electronics racks disposed in a row within a data center. The airflow arrester includes a panel, which when operatively disposed, has a first vertical end, a second vertical end, and a central vertical hinge located intermediate the first and second vertical ends. The airflow arrester further includes an attachment mechanism at the first vertical end and at the second vertical end, and when operatively disposed between a first and second structures, the airflow arrester has a single V-shaped configuration, and is sized and constructed to block airflow from passing therebetween. The single V-shaped configuration provides operational stability to the airflow arrester by translating net twisting forces applied to the airflow arrester to normal forces applied to the first and second structures at the attachment points of the airflow arrester to the first and second structures.

摘要翻译： 气流避雷器被设置和配置为驻留在数据中心内排列成行的电子机架之间。 气流避雷器包括面板，当操作地设置时，该面板具有位于第一和第二垂直端之间的第一垂直端，第二垂直端和中心垂直铰链。 气流避雷器还包括在第一垂直端和第二垂直端处的附接机构，并且当操作地设置在第一和第二结构之间时，气流避雷器具有单个V形构造，并且其尺寸和构造以阻挡气流 通过它们之间。 单个V形构造通过将施加到气流避雷器的净扭转力平移到在气流避雷器的附接点处的第一和第二结构到第一和第二结构的法向力，从而为气流缓冲器提供操作稳定性。

公开(公告)号：US20080273306A1

公开(公告)日：2008-11-06

申请号：US11744269

申请日：2007-05-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

摘要翻译： 提供冷却系统和方法来冷却离开数据中心的一个或多个电子机架的空气。 冷却系统包括与数据中心的至少一个相应的电子机架分离和独立的至少一个冷却站，并且被配置为用于设置与其相邻的电子机柜的空气出口侧，用于冷却从电子机架排出空气。 冷却站包括从相应的电子机架分离和独立的框架结构，以及由框架结构支撑的空气对液体热交换组件。 热交换组件包括入口和出口，其构造成分别耦合到冷却剂供应源和冷却剂返回管线，以便于冷却剂通过其中。 空气 - 液体热交换组件的尺寸设定为在排出到数据中心之前冷却从相应的电子机架的空气出口侧排出的空气。