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    Contaminant separator for a vapor-compression refrigeration apparatus
    1.
    发明授权
    Contaminant separator for a vapor-compression refrigeration apparatus 有权
    用于蒸气压缩式制冷装置的污染物分离器

    公开(公告)号：US09207002B2

    公开(公告)日：2015-12-08

    申请号：US13271304

    申请日：2011-10-12

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： F25D23/12 ,  F25B21/02 ,  F25B43/00 ,  H05K7/20 ,  B23P15/26

    CPC分类号： F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

    摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

    摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

    Direct facility coolant cooling of a rack-mounted heat exchanger
    2.
    发明授权
    Direct facility coolant cooling of a rack-mounted heat exchanger 有权
    直接设置机架式热交换器的冷却液冷却

    公开(公告)号：US09167721B2

    公开(公告)日：2015-10-20

    申请号：US13305937

    申请日：2011-11-29

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20281 ,  F24F3/14 ,  F24F11/30 ,  F24F2110/20 ,  F25B2600/13 ,  F25D17/02 ,  F25D31/002 ,  F25D2317/04131 ,  H05K7/20781 ,  H05K7/20836

    摘要： A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

    摘要翻译： 提供了一种冷却装置和方法。 冷却装置包括冷却剂冷却的热交换器，用于便于散发在电子机架内产生的热量和冷却剂控制装置。 冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。 控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂 泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

    Combined power and cooling rack supporting an electronics rack(S)
    4.
    发明授权
    Combined power and cooling rack supporting an electronics rack(S) 有权
    组合电源和散热架支持电子机架（S）

    公开(公告)号：US08824143B2

    公开(公告)日：2014-09-02

    申请号：US13271262

    申请日：2011-10-12

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20627 ,  H05K7/20772 ,  H05K7/20836

    摘要： A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks.

    摘要翻译： 提供了组合的动力和冷却装置，其有助于对与动力和冷却装置不同的一个或多个电子机架供电和冷却。 动力和冷却装置包括框架，与框架相关联的一个或多个主体动力组件以及与框架相关联的一个或多个热交换组件。 所述一个或多个主体动力组件被配置成向所述一个或多个电子机架提供动力，并且所述一个或多个热交换组件被配置为冷却提供给所述一个或多个电子机架的系统冷却剂。 热量由一个或多个热交换组件从系统冷却剂传送到设备冷却剂。 在操作中，电源和冷却装置被耦合以向一个或多个电子机架提供电力和冷却。

    THERMAL RESISTANCE-BASED MONITORING OF COOLING OF AN ELECTRONIC COMPONENT
    6.
    发明申请
    THERMAL RESISTANCE-BASED MONITORING OF COOLING OF AN ELECTRONIC COMPONENT 有权
    电子元件的基于耐热性的冷却监测

    公开(公告)号：US20130128918A1

    公开(公告)日：2013-05-23

    申请号：US13300803

    申请日：2011-11-21

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： G01N25/00

    CPC分类号： H05K7/20836

    摘要： Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

    摘要翻译： 提供了对电子部件的冷却的监视，其包括：确定与电子部件中的一个或多个相关联的当前热阻，耦合到电子部件的散热器或耦合电子部件和散热器的热接口; 以及通过处理器确定当前热阻是否超过设定的热阻阈值，并且响应于当前热阻超过设定的热阻阈值，指示热阻故障。 作为增强，确定热阻时间的变化率，并且与变化率阈值进行比较，并且如果超过阈值，则提供变化率热阻警告。

    COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S)
    7.
    发明申请
    COOLANT MANIFOLD WITH SEPARATELY ROTATABLE MANIFOLD SECTION(S) 有权
    具有单独可旋转的节气门部分的冷却液喷射（S）

    公开(公告)号：US20130107457A1

    公开(公告)日：2013-05-02

    申请号：US13281495

    申请日：2011-10-26

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Eric J. McKEEVER ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Eric J. McKEEVER ,  Robert E. SIMONS

    IPC分类号： H05K7/20 ,  F28D7/10

    CPC分类号： H05K7/20272 ,  H05K7/2079 ,  Y10T29/4935 ,  Y10T29/49389

    摘要： A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

    摘要翻译： 提供了一种冷却装置，其包括连接到一个或多个电子部件，一个或多个冷却剂管道和一个或多个冷却剂歧管的一个或多个冷却剂冷却结构。 冷却剂冷却结构包括一个或多个冷却剂输送通道，并且冷却剂歧管包括一个或多个可旋转的歧管段。 一个冷却剂管道将相应的可旋转歧管部分和相应冷却剂冷却结构的冷却剂输送通道流体连通地连接。 相应的可旋转歧管部分可相对于冷却剂歧管的另一部分旋转，以便于将冷却剂冷却结构与其相关联的电子部件分离，同时保持冷却剂冷却结构与相应的可旋转歧管部分流体连通，通过一个冷却剂管道 ，其在一个实施例中是基本刚性的冷却剂导管。

    MULTI-RACK ASSEMBLY WITH SHARED COOLING UNIT
    8.
    发明申请
    MULTI-RACK ASSEMBLY WITH SHARED COOLING UNIT 有权
    具有共享冷却单元的多机架组件

    公开(公告)号：US20130105139A1

    公开(公告)日：2013-05-02

    申请号：US13285116

    申请日：2011-10-31

    申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

    IPC分类号： F28F27/00 ,  B21D53/02 ,  F28F13/00

    CPC分类号： H05K7/20263 ,  H05K7/20709 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

    摘要： A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

    摘要翻译： 提供了包括第一和第二电子机架的多机架组件。 第一电子机架包括设置在第一电子机架内的一个或多个冷却单元，其联接成与第一电子机架的主冷却剂回路流体连通，至少部分地将冷却的冷却剂提供给主冷却剂回路，并且促进 冷却一个或多个第一机架电子部件。 第二电子机架包括与布置在第一电子机架内的冷却单元流体连通的二次冷却剂回路。 多机架组件还包括控制器，用于将冷却的冷却剂自动地提供给二次冷却剂回路，并且其中控制器控制冷却的冷却剂从冷却单元到第二冷却剂回路的流动，这至少部分地取决于冷却 第一电子机架的要求。