公开(公告)号：US08072489B2

公开(公告)日：2011-12-06

申请号：US11592912

申请日：2006-11-03

Applicant: Ying-Cheng Wu ,  Ying-Tang Su

Inventor： Ying-Cheng Wu ,  Ying-Tang Su

IPC: A61B1/04 ,  H04N5/225

CPC classification number: H04N5/2253 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/16195 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract translation: 提供安装在芯片封装上的芯片封装（101）和透镜模块（103）。 芯片封装包括基板（20），第一芯片（40），第二芯片（70）和盖（80）。 第一芯片安装在基板上，并且经由第一多根导线（50a）与基板电连接。 所述第二芯片安装在所述第一芯片上方并且与所述第一芯片连接的导线上方并且经由第二多个导线（50b）与所述基板电连接。 盖被安装在第二芯片上方，并且电线与第二芯片连接。

公开(公告)号：US08059155B2

公开(公告)日：2011-11-15

申请号：US11626723

申请日：2007-01-24

Applicant: Ching-Lung Jao ,  Kuo-Liang Tai

Inventor： Ching-Lung Jao ,  Kuo-Liang Tai

IPC: H04N17/00

CPC classification number: H04N17/002

Abstract: A measuring system (200) for measuring a FOV of a digital camera module (52) includes a measuring chart (22), a parameter inputting module (32), and a processing module (42). The measuring chart defines a colored portion. The parameter inputting module is used to input relative parameters. The processing module is connected to the parameter inputting module and receives electronic image signals converted from images of the colored portion and of the measuring chart screened by the lens module. The processing module is configured for calculating the FOV θ of the digital camera module. A measuring method for measuring the FOV θ of the digital camera module is also provided.

Abstract translation: 用于测量数字照相机模块（52）的FOV的测量系统（200）包括测量图（22），参数输入模块（32）和处理模块（42）。 测量图定义了彩色部分。 参数输入模块用于输入相关参数。 处理模块连接到参数输入模块，并接收从彩色部分和由镜头模块屏蔽的测量图的图像转换的电子图像信号。 处理模块被配置为用于计算FOV＆amp; 的数码相机模块。 测量FOV和测量的测量方法; 还提供了数码相机模块。

公开(公告)号：US07540672B2

公开(公告)日：2009-06-02

申请号：US11262592

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: G03B17/00

CPC classification number: H04N5/2254 ,  G02B7/025 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H04N5/2253 ,  H01L2924/00014

Abstract: A digital still camera module includes an image sensor package (2) and a lens barrel (30) mounted on the image sensor package. The image sensor package includes a substrate (20), an image sensor chip (22), and a cover (28). The substrate defines a receiving chamber (203) therein. The image sensor chip mounted in the receiving chamber of the substrate. The cover, which is transparent and has a smaller profile than that of the substrate, is secured to the top portion of the substrate thereby sealing the receiving chamber. The top portion of the substrate has an uncovered section (29) at a periphery of the cover. The lens barrel includes at least one lens (31) received therein. The lens barrel is securely attached to the uncovered section of the top portion of the substrate.

Abstract translation: 数字静态照相机模块包括安装在图像传感器封装上的图像传感器封装（2）和透镜镜筒（30）。 图像传感器封装包括基板（20），图像传感器芯片（22）和盖子（28）。 衬底在其中限定接收室（203）。 图像传感器芯片安装在基板的接收室中。 透明并且具有比基板更小的轮廓的盖被固定到基板的顶部，从而密封接收室。 衬底的顶部在盖的周边具有未覆盖部分（29）。 镜筒包括容纳在其中的至少一个透镜（31）。 透镜筒牢固地附接到基板的顶部的未覆盖部分。

公开(公告)号：US07417810B2

公开(公告)日：2008-08-26

申请号：US11617135

申请日：2006-12-28

Applicant: Chen Feng ,  Ming Lee

Inventor： Chen Feng ,  Ming Lee

IPC: G02B7/02

CPC classification number: G02B7/02 ,  G02B7/023

Abstract: A lens module (200) includes a barrel (20), a lens (30) and a shielding layer (51). The barrel includes a screening end (21) and a mounting end (22) positioned opposite to the screening end, and defines an aperture (23) in the screening end. A diameter of the aperture reduces in a direction from the screening end to the mounting end so that the aperture has a large diameter and a small diameter. The lens is received in the barrel. The shielding layer made of an opaque film is mounted on the screening end and defines a receiving hole (511) aligned with the aperture. The receiving hole has a diameter being in a range of the large diameter and the small diameter.

Abstract translation: 透镜模块（200）包括镜筒（20），透镜（30）和屏蔽层（51）。 枪管包括一个屏蔽端（21）和一个与屏蔽端相对定位的安装端（22），并在屏蔽端限定一个孔（23）。 孔的直径在从遮蔽端到安装端的方向上减小，使得孔具有大直径和小直径。 镜头接收在镜筒中。 由不透明膜制成的屏蔽层安装在屏蔽端上，并且限定与孔对准的接收孔（511）。 接收孔的直径在大直径和小直径的范围内。

公开(公告)号：US20080129833A1

公开(公告)日：2008-06-05

申请号：US11626723

申请日：2007-01-24

Applicant: CHING-LUNG JAO ,  KUO-LIANG TAI

Inventor： CHING-LUNG JAO ,  KUO-LIANG TAI

IPC: H04N5/228

CPC classification number: H04N17/002

Abstract: A measuring system (200) for measuring a FOV of a digital camera module (52) includes a measuring chart (22), a parameter inputting module (32), and a processing module (42). The measuring chart defines a colored portion. The parameter inputting module is used to input relative parameters. The processing module is connected to the parameter inputting module and receives electronic image signals converted from images of the colored portion and of the measuring chart screened by the lens module. The processing module is configured for calculating the FOV θ of the digital camera module. A measuring method for measuring the FOV θ of the digital camera module is also provided.

Abstract translation: 用于测量数字照相机模块（52）的FOV的测量系统（200）包括测量图（22），参数输入模块（32）和处理模块（42）。 测量图定义了彩色部分。 参数输入模块用于输入相关参数。 处理模块连接到参数输入模块，并接收从彩色部分和由镜头模块屏蔽的测量图的图像转换的电子图像信号。 处理模块被配置为计算数字照相机模块的FOVθ。 还提供了用于测量数字照相机模块的FOVθ的测量方法。

公开(公告)号：US07374431B2

公开(公告)日：2008-05-20

申请号：US11472966

申请日：2006-06-21

Applicant: Ying-Tang Su

Inventor： Ying-Tang Su

IPC: H01R12/00

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.

Abstract translation: 用于夹紧数字照相机模块（300）的夹紧装置（100）包括基部（12）和两个腿部（14）。 两条腿从底座的两侧延伸。 每条腿至少有一只脚（18）。 所述至少一个脚限定弓形表面（180）。 弧形表面协同地限定用于接收数字照相机模块的空间。

公开(公告)号：US07361880B2

公开(公告)日：2008-04-22

申请号：US11478503

申请日：2006-06-28

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L27/00 ,  H01L27/14 ,  H01L23/02 ,  H01L23/52

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16151 ,  H05K1/118 ,  H05K3/326 ,  H01L2924/00014

Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.

Abstract translation: 数字照相机模块（100）包括保持器，图像传感器芯片封装（30），多个导电元件（24）和电路板（40）。 保持器限定接收部分。 保持器安装在图像传感器芯片封装上。 图像传感器芯片封装具有多个外部焊盘。 外垫位于保持器的接收部分中。 导电元件被接收在接收部分中。 每个导电元件的一端连接到内部焊盘，每个导电元件的另一端连接到电路板。

公开(公告)号：US20080074763A1

公开(公告)日：2008-03-27

申请号：US11618002

申请日：2006-12-29

Applicant: CHING-LUNG JAO ,  YU-CHIEH CHENG

Inventor： CHING-LUNG JAO ,  YU-CHIEH CHENG

IPC: G02B7/02

CPC classification number: G02B7/021 ,  G02B7/022 ,  H04N5/2254 ,  H04N5/2257

Abstract: A camera module (100) includes a lens module (10) and an image sensor (20), wherein the lens module includes a barrel (12), a plurality of lenses (14) and at least one spacer between each two neighboring lenses. The barrel includes an inner wall (122), the lenses and the spacer both are received in the barrel; the image sensor is located on an imaging plane of the plurality of lenses. At least one through slot (18) is defined in at least one item selected from the group consisting of lenses, spacer, and between the lenses and spacer. At least one groove (124) is defined between the inner wall of the barrel and the group consisting of the lenses, spacer and the image sensor. The at least one through slot communicates with at least one groove.

Abstract translation: 相机模块（100）包括透镜模块（10）和图像传感器（20），其中透镜模块包括镜筒（12），多个透镜（14）和每两个相邻透镜之间的至少一个间隔物。 桶包括内壁（122），透镜和间隔件都被容纳在桶中; 图像传感器位于多个透镜的成像平面上。 至少一个通孔（18）被限定在从由透镜，间隔物以及透镜和间隔物之间​​的组中选出的至少一个项目中。 在筒的内壁和由透镜，间隔物和图像传感器组成的组之间限定至少一个凹槽（124）。 所述至少一个通槽与至少一个凹槽连通。

公开(公告)号：US20080055696A1

公开(公告)日：2008-03-06

申请号：US11556513

申请日：2006-11-03

Applicant: HAI-HUNG WEN ,  WEN-SHIU LIN

Inventor： HAI-HUNG WEN ,  WEN-SHIU LIN

IPC: G02B26/00

CPC classification number: G02B7/365

Abstract: An exemplary focusing mechanism (100) for focusing a lens module includes a testing apparatus (10) and a processor (20), the testing apparatus includes a first testing chart (12) and a second testing chart (14), the first testing chart and the second testing chart are movably placed in an incident light path of the lens module, the processor is connected to the testing apparatus. Two exemplary focusing methods for focusing a lens module are also provided, each method using the focusing system.

Abstract translation: 用于聚焦透镜模块的示例性聚焦机构（100）包括测试装置（10）和处理器（20），测试装置包括第一测试图（12）和第二测试图（14），第一测试图 并且第二测试图可移动地放置在透镜模块的入射光路中，处理器连接到测试装置。 还提供了用于聚焦透镜模块的两种示例性聚焦方法，每种使用聚焦系统的方法。

公开(公告)号：US20080023809A1

公开(公告)日：2008-01-31

申请号：US11616837

申请日：2006-12-27

Applicant: CHIH-CHENG WU ,  CHANG-KUO YANG

Inventor： CHIH-CHENG WU ,  CHANG-KUO YANG

IPC: H01L23/02

CPC classification number: H01L27/14618 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A digital camera module (10) includes a chip package (20) and a lens module (50) mounted to the chip package. The package includes a carrier (21), a chip (23), a plurality of wires (24), an adhesive (26) and a cover (28). The carrier has a top surface (211), and a plurality of top contacts (215) arranged on the top surface around the opening. The chip is mounted to the top surface of the carrier, and includes an active area (231) and a plurality of pads (233) disposed on a top surface thereof. The wires electrically connect each of the pads to a corresponding top contact of the carrier. The adhesive is applied to a peripheral circumference of the top surface of the chip, around the active area. The cover is adhered to the adhesive, and encloses the active area of the chip cooperatively with the adhesive.

Abstract translation: 数字照相机模块（10）包括芯片封装（20）和安装到芯片封装的透镜模块（50）。 该包装包括载体（21），芯片（23），多个电线（24），粘合剂（26）和盖子（28）。 载体具有顶表面（211）和布置在开口周围的顶表面上的多个顶部触点（215）。 芯片被安装到载体的顶表面，并且包括有效区域（231）和设置在其顶表面上的多个焊盘（233）。 电线将每个焊盘电连接到载体的对应的顶部触点。 粘合剂被施加到芯片的顶表面的周围，围绕有源区域。 盖子粘附到粘合剂上，并且与粘合剂一起包围芯片的有效区域。