公开(公告)号：US20110109170A1

公开(公告)日：2011-05-12

申请号：US12624971

申请日：2009-11-24

Applicant: Wen-Yu Chen ,  Ching-Feng Hsieh

Inventor： Wen-Yu Chen ,  Ching-Feng Hsieh

IPC: H01H35/14

CPC classification number: G11B19/043 ,  H02J9/061 ,  Y10T307/799

Abstract: The hand-held electronic device includes a central processing unit, a memory unit, a state-detecting unit, a state-determining unit, a main power supply unit, a standby power supply unit, and a power supply switching unit. After determining the presence of a fall state, the state-determining unit will output a fall prevention instruction and which causes the central processing unit to enter a low-potential current mode; meanwhile, the power supply switching unit monitors power output and continues to supply low-potential power. In case of a fall of the hand-held electronic device, the device and method protect operation data and reduce the otherwise power-consuming current. The less power-consuming current is conducive to the reduction of capacitance required for a backup battery. The low-potential current mode is effective in reducing the time taken to recover the operation mode of the electronic device.

Abstract translation: 手持式电子设备包括中央处理单元，存储单元，状态检测单元，状态确定单元，主电源单元，备用电源单元和电源切换单元。 在确定了下降状态的存在之后，状态确定单元将输出防坠落指令，并使中央处理单元进入低电位电流模式; 同时，电源开关单元监控电源输出，并继续提供低电位功率。 在手持式电子设备坠落的情况下，该装置和方法保护操作数据并减少另外的功耗电流。 耗电量较小的电流有助于减少备用电池所需的电容。 低电位电流模式有效地减少恢复电子设备的操作模式所需的时间。

公开(公告)号：USD621359S1

公开(公告)日：2010-08-10

申请号：US29333490

申请日：2009-03-10

Applicant: Yi-Chang Hsu ,  Ching-Feng Hsieh

Designer： Yi-Chang Hsu ,  Ching-Feng Hsieh

公开(公告)号：US20100091471A1

公开(公告)日：2010-04-15

申请号：US12341560

申请日：2008-12-22

Applicant: Chung-Shao HUANG ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai ,  Kuo-Ching Chen

Inventor： Chung-Shao HUANG ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai ,  Kuo-Ching Chen

IPC: H05K7/02 ,  H05K9/00 ,  H05K7/00 ,  H05K3/00

CPC classification number: H05K9/0026 ,  Y10T29/49124

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

Abstract translation: 本发明提供一种具有隔离罩及其组装方法的电路板。 本发明的电路板包括设置在电路板主体上的主体和隔离盖。 主体和隔离盖具有多个对应的第一和第二定位部分，并且接地部分设置在每个第一定位部分的至少一侧上。 隔离盖设置在主体的第一表面上，并且每个第二定位部分穿过主体的第二表面和每个第一定位部分。 每个第二定位部分的端部连接到每个接地部分。

公开(公告)号：US20100089619A1

公开(公告)日：2010-04-15

申请号：US12341448

申请日：2008-12-22

Applicant: Kuo-Ching CHEN ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai

Inventor： Kuo-Ching CHEN ,  Chung-Shao Huang ,  Ching-Feng Hsieh ,  Jen-Huan Yu ,  Cheng-Wen Dai

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K9/0028 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/341 ,  Y10T29/49124

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.

Abstract translation: 本发明提供通信产品的电路板及其制造方法。 电路板包括电路板的主体和隔离盖。 电路基板的主体的表面具有功率晶体管，绝缘层，间隔设置在绝缘层上并在功率晶体管周围的多个第一开口，以及分别从第一开口露出的多个焊接部。 隔离盖包括盖体和在盖体的侧面上等距开口的多个第二开口。 隔离盖设置在电路板的主体的表面上，并通过局部点焊工艺焊接到焊接部分。

公开(公告)号：USD601139S1

公开(公告)日：2009-09-29

申请号：US29335740

申请日：2009-04-21

Applicant: Chih-Hua Huang ,  Ching-Feng Hsieh

Designer： Chih-Hua Huang ,  Ching-Feng Hsieh

公开(公告)号：US07341488B2

公开(公告)日：2008-03-11

申请号：US11515772

申请日：2006-09-06

Applicant: Bor-Ching Yang ,  Ping-Hui Chen ,  Jui-Chuan Huang

Inventor： Bor-Ching Yang ,  Ping-Hui Chen ,  Jui-Chuan Huang

IPC: H01R13/648

CPC classification number: H05K1/144 ,  H05K9/0024 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An EMI-resistant circuit board assembly includes a plurality of circuit boards arranged in a stack and a metal shielding frame respectively sandwiched in between each two adjacent circuit boards. One of the circuit boards has at least one high-speed device producing high-frequency noises to the ambient, which result in EMI effect. The metal shielding frame is electrically connected to the ground potential of the circuit boards and shields the high-speed device on the circuit board to guide the high-frequency noises to the ground potential.

Abstract translation: EMI电阻电路板组件包括分别堆叠在堆叠中的多个电路板和分别夹在每个两个相邻电路板之间的金属屏蔽框架。 其中一个电路板至少有一个高速器件产生对环境的高频噪声，从而产生EMI效应。 金属屏蔽框架电连接到电路板的接地电位，并屏蔽电路板上的高速器件，以将高频噪声引导到地电位。

公开(公告)号：US20030135866A1

公开(公告)日：2003-07-17

申请号：US10047187

申请日：2002-01-17

Applicant: ASKEY COMPUTER CORP.

Inventor： Chi-Tung Hsu

IPC: H04N007/173

CPC classification number: H04L12/2801 ,  H03J1/0075 ,  H03J2200/28

Abstract: A downstream power calibration method comprises the following procedures. First, select base sampling frequencies and sampling power levels, thereby generating base sampling signals. Next, input base sampling signals into a modem such that obtaining each sum of the feedback signals responding to the tuner and the IF amplifier of the modem by the modem chip corresponding each said base sampling signal, thereby setting up a sampling data table. Third, repeat the procedure mention above for a plurality of modems to get a plurality of sampling data tables respectively, and then obtain a mean data table. Fourth, select spot frequencies and spot power levels from the base sampling frequencies and the base sampling power levels to generate spot sampling signals. Thereafter, input the spot sampling signals into a cable modem and set up a skeleton data table. Finally, expand skeleton data table and obtain an individual default data table for the modem, thereby providing the basis of the calculation of power levels when the cable modem is receiving downstream signals.

Abstract translation: 下游功率校准方法包括以下步骤。 首先，选择基本采样频率和采样功率电平，从而生成基本采样信号。 接下来，将输入基本采样信号转换成调制解调器，使得通过调制解调器芯片获得响应调谐器的调谐器和IF放大器的每个所述基本采样信号的每个和的反馈信号，从而建立采样数据表。 第三，对于多个调制解调器重复上述步骤以分别获得多个采样数据表，然后获得平均数据表。 第四，从基本采样频率和基本采样功率电平中选择频点和点功率电平，以产生点采样信号。 此后，将采样信号输入电缆调制解调器，并设置骨架数据表。 最后，扩展骨架数据表，并获得调制解调器的单个默认数据表，从而为电缆调制解调器接收下行信号提供功率电平计算的基础。

公开(公告)号：USD430549S

公开(公告)日：2000-09-05

申请号：US118673

申请日：2000-02-15

Applicant: Sing-Long Du

Designer： Sing-Long Du

公开(公告)号：US11128060B2

公开(公告)日：2021-09-21

申请号：US16716517

申请日：2019-12-17

Applicant: ASKEY COMPUTER CORP. ,  ASKEY TECHNOLOGY (JIANGSU) LTD.

Inventor： Chien-Sheng Liu

IPC: H01Q1/24 ,  H01Q21/30 ,  H01Q5/314 ,  H01Q1/42

Abstract: A multi-band antenna module is adapted to be disposed on a casing. The multi-band antenna module includes a main radiator, and a first, a second, a third and a fourth radiator. The main radiator has a feed-in terminal and a first ground terminal. The first radiator is connected to the main radiator and configured to couple a first frequency band. The second radiator is connected to the main radiator and configured to couple a second frequency band. The third radiator is connected to the main radiator and configured to couple a third frequency band. The fourth radiator is located beside the main radiator and configured to couple a fourth frequency band and has a second ground terminal. The main radiator, the first radiator, the second radiator, the third radiator and the fourth radiator are adapted to form a 3D structure along an outline of the casing.

公开(公告)号：US20210200994A1

公开(公告)日：2021-07-01

申请号：US17100587

申请日：2020-11-20

Applicant: ASKEY COMPUTER CORP.

Inventor： Chien-Fang CHEN ,  Setya Widyawan PRAKOSA ,  Huan-Ruei SHIU ,  Chien-Ming LEE

IPC: G06K9/00 ,  G06K9/62 ,  G06F16/51

Abstract: A processing method of face recognition includes steps of: extracting embedding feature information from a face image; outputting a recognition result of face recognition according to the embedding feature information, wherein the recognition result includes a recognized name and embedding feature distance information; determining whether the recognized name is in a list or not; if the recognized name is in the list, performing a removal checking step for determining whether to remove the recognition result based on the embedding feature distance information; if determining that the recognition result is not to be removed, displaying the recognized name; if determining that the recognition result is to be removed, displaying a negative prompt; and dynamically and instantly providing a feedback and updating a recognition method for the face recognition.