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公开(公告)号：US20100091471A1
公开(公告)日：2010-04-15
申请号：US12341560
申请日：2008-12-22
CPC分类号： H05K9/0026 , Y10T29/49124
摘要： The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.
摘要翻译： 本发明提供一种具有隔离罩及其组装方法的电路板。 本发明的电路板包括设置在电路板主体上的主体和隔离盖。 主体和隔离盖具有多个对应的第一和第二定位部分，并且接地部分设置在每个第一定位部分的至少一侧上。 隔离盖设置在主体的第一表面上，并且每个第二定位部分穿过主体的第二表面和每个第一定位部分。 每个第二定位部分的端部连接到每个接地部分。
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公开(公告)号：US07999195B2
公开(公告)日：2011-08-16
申请号：US12341560
申请日：2008-12-22
IPC分类号： H05K9/00
CPC分类号： H05K9/0026 , Y10T29/49124
摘要： The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.
摘要翻译： 本发明提供一种具有隔离罩及其组装方法的电路板。 本发明的电路板包括设置在电路板主体上的主体和隔离盖。 主体和隔离盖具有多个对应的第一和第二定位部分，并且接地部分设置在每个第一定位部分的至少一侧上。 隔离盖设置在主体的第一表面上，并且每个第二定位部分穿过主体的第二表面和每个第一定位部分。 每个第二定位部分的端部连接到每个接地部分。
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公开(公告)号：US07958625B2
公开(公告)日：2011-06-14
申请号：US12365969
申请日：2009-02-05
申请人： Chia-Hung Lee , Jen-Huan Yu , Chung-Shao Huang , Ching-Feng Hsieh , Cheng-Wen Dai , Kuo-Ching Chen
发明人： Chia-Hung Lee , Jen-Huan Yu , Chung-Shao Huang , Ching-Feng Hsieh , Cheng-Wen Dai , Kuo-Ching Chen
CPC分类号： H05K9/0022 , H05K13/0447 , H05K13/0473 , Y10T29/49126 , Y10T29/5313 , Y10T29/53174 , Y10T29/53252 , Y10T29/5327
摘要： An assembly device includes a base having a supporting portion upon which an isolation cover and a main body are disposed. A press-fitting mechanism is movably connected to the base, and includes a press-fitting portion facing the supporting portion and disposed corresponding in position to the supporting portion, and further portions for guiding and bending second positioning portions. The further portions are movably disposed on external side faces of the press-fitting portion. The press-fitting mechanism also has first portions for holding the further portions to the external side faces of the press-fitting portion, and has second portions passing through upper ends of the further portions. A drive mechanism is disposed at the base and has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion via the drive portion, so as to bend and fasten ends of second positioning portions.
摘要翻译： 组装装置包括具有支撑部分的基部，隔离盖和主体设置在该支撑部分上。 压入机构可移动地连接到基座，并且包括面向支撑部分并且相对于支撑部分位置设置的压配部分，以及用于引导和弯曲第二定位部分的另外的部分。 另外的部分可移动地设置在压配部分的外侧面上。 压入机构还具有用于将另外的部分保持在压配部的外侧面的第一部分，并且具有穿过其它部分的上端的第二部分。 驱动机构设置在基座上，具有与压配机构连接的驱动部，驱动压配机构经由驱动部向支撑部移动，从而弯曲并固定第二定位部的端部 。
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公开(公告)号：US08106302B2
公开(公告)日：2012-01-31
申请号：US12341448
申请日：2008-12-22
CPC分类号： H05K9/0028 , H05K1/0256 , H05K3/301 , H05K3/341 , Y10T29/49124
摘要： The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.
摘要翻译： 本发明提供通信产品的电路板及其制造方法。 电路板包括电路板的主体和隔离盖。 电路基板的主体的表面具有功率晶体管，绝缘层，间隔设置在绝缘层上并在功率晶体管周围的多个第一开口，以及分别从第一开口露出的多个焊接部。 隔离盖包括盖体和在盖体的侧面上等距开口的多个第二开口。 隔离盖设置在电路板的主体的表面上，并通过局部点焊工艺焊接到焊接部分。
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5.发明授权公开(公告)号：US07233468B2
公开(公告)日：2007-06-19
申请号：US11162652
申请日：2005-09-19
申请人： Chyh-Yih Chang , Kuo-Ching Chen
发明人： Chyh-Yih Chang , Kuo-Ching Chen
IPC分类号： H02H9/00
CPC分类号： H02H9/046
摘要： A level shifter ESD protection circuit with power-on-sequence consideration used for receiving a first signal and outputting a second signal is provided. The level shifter circuit includes an inverter, a first switch, a second switch, a voltage level shifting circuit, a first ESD clamp and a second ESD clamp circuits. When the first power supply has been powered on and the second power supply is off, the first and second switches will remain off resulting from the power-off of the second power supply. Therefore, the second power source would not be affected by the first power supply because of passing through the ESD protection circuit.
摘要翻译： 提供了一种具有上电顺序考虑的电平移位器ESD保护电路，用于接收第一信号并输出第二信号。 电平移位器电路包括逆变器，第一开关，第二开关，电压电平移位电路，第一ESD钳位电路和第二ESD钳位电路。 当第一电源通电并且第二电源关闭时，由于第二电源的断电，第一和第二开关将保持关闭。 因此，由于通过ESD保护电路，第二电源不会受到第一电源的影响。
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6.发明申请PACKAGE SUBSTRATE WITH A CAVITY, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF 有权具有空穴的封装衬底，半导体封装及其制造方法公开(公告)号：US20100236817A1
公开(公告)日：2010-09-23
申请号：US12408719
申请日：2009-03-22
申请人： Kuo-Ching Chen , Tsung-Yuan Chen , Cheng-Pin Chien
发明人： Kuo-Ching Chen , Tsung-Yuan Chen , Cheng-Pin Chien
CPC分类号： H01L23/3128 , H01L21/4857 , H01L21/56 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15331 , H01L2924/181 , H05K1/183 , H05K1/186 , H05K3/06 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4697 , H05K2201/0361 , H05K2201/10674 , H05K2201/10734 , H05K2203/308 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401
摘要： A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby forming a metal island body; laminating a first copper clad on the cladding sheet comprising a first copper foil and a first insulating layer; patterning the first copper foil to form a first circuit trace; patterning the second metal layer to form a second circuit trace; removing the metal island body to form a cavity in the first insulating layer; and removing the intermediate layer from bottom of the cavity.
摘要翻译： 制造封装衬底的方法包括提供包括第一金属层，第二金属层和第一和第二金属层之间的中间层的覆层片; 蚀刻掉第一金属层的一部分以暴露中间层的一部分，从而形成金属岛体; 在包括第一铜箔和第一绝缘层的包层片上层叠第一铜包层; 图案化第一铜箔以形成第一电路迹线; 图案化第二金属层以形成第二电路迹线; 去除所述金属岛体以在所述第一绝缘层中形成空腔; 以及从腔的底部去除中间层。
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公开(公告)号：US20100206619A1
公开(公告)日：2010-08-19
申请号：US12485889
申请日：2009-06-16
申请人： Kuo-Ching Chen , Tsung-Yuan Chen , Cheng-Pin Chien
发明人： Kuo-Ching Chen , Tsung-Yuan Chen , Cheng-Pin Chien
CPC分类号： H05K1/183 , H01L23/13 , H01L23/49827 , H01L24/48 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H05K1/0206 , H05K3/4602 , H05K3/4697 , H05K2201/0361 , H05K2201/10545 , H05K2203/308 , Y10T29/4913 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package substrate structure includes a substrate with a first side and a second side opposite to the first side, a via connecting the first side and the second side, a cavity in the substrate and on the first side, and a patterned conductive layer disposed on at least one of the first side and the second side, filling the cavity and the via, and including a first conductive layer, a second conductive layer and a third conductive layer. The second conductive layer is different from at least one of the first conductive layer and the third conductive layer.
摘要翻译： 封装衬底结构包括具有第一侧和与第一侧相对的第二侧的衬底，连接第一侧和第二侧的通孔，在衬底中和第一侧上的空腔，以及设置在第一侧上的图案化导电层 第一侧和第二侧中的至少一个，填充空腔和通孔，并且包括第一导电层，第二导电层和第三导电层。 第二导电层与第一导电层和第三导电层中的至少一个不同。
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8.发明申请公开(公告)号：US20070014061A1
公开(公告)日：2007-01-18
申请号：US11162652
申请日：2005-09-19
申请人： Chyh-Yih Chang , Kuo-Ching Chen
发明人： Chyh-Yih Chang , Kuo-Ching Chen
IPC分类号： H02H9/00
CPC分类号： H02H9/046
摘要： A level shifter ESD protection circuit with power-on-sequence consideration used for receiving a first signal and outputting a second signal is provided. The level shifter circuit includes an inverter, a first switch, a second switch, a voltage level shifting circuit, a first ESD clamp and a second ESD clamp circuits. When the first power supply has been powered on and the second power supply is off, the first and second switches will remain off resulting from the power-off of the second power supply. Therefore, the second power source would not be affected by the first power supply because of passing through the ESD protection circuit.
摘要翻译： 提供了一种具有上电顺序考虑的电平移位器ESD保护电路，用于接收第一信号并输出第二信号。 电平移位器电路包括逆变器，第一开关，第二开关，电压电平移位电路，第一ESD钳位电路和第二ESD钳位电路。 当第一电源通电并且第二电源关闭时，由于第二电源的断电，第一和第二开关将保持关闭。 因此，由于通过ESD保护电路，第二电源不会受到第一电源的影响。
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公开(公告)号：USD687788S1
公开(公告)日：2013-08-13
申请号：US29425804
申请日：2012-06-27
申请人： Kuo-Ching Chen , Chien-Hsuan Chien
设计人： Kuo-Ching Chen , Chien-Hsuan Chien
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10.发明授权Method for improving flexibility of arbitration of direct memory access (DMA) engines requesting access to shared DMA channels 有权用于提高请求访问共享DMA通道的直接存储器访问（DMA）引擎的仲裁的灵活性的方法公开(公告)号：US07689732B2
公开(公告)日：2010-03-30
申请号：US11361737
申请日：2006-02-24
申请人： Kuo-Ching Chen , Tai-Cheng Chen , Ming-Yih Duh , Li-Hsiang Wang
发明人： Kuo-Ching Chen , Tai-Cheng Chen , Ming-Yih Duh , Li-Hsiang Wang
CPC分类号： G06F13/28
摘要： The invention provides a method improving flexibility of at least one direct memory access (DMA) channel. The at least one DMA channel is used by a plurality of DMA engines of a first device to direct data transmission between the plurality of DMA engines of the first device and a second device. An explanatory embodiment of the method comprises: allowing any of a plurality of DMA engines to use any of the at least one DMA channels, and enabling some of the plurality of DMA engines to share a target channel if some of the plurality of DMA engines simultaneously compete for the target channel, one of the at least one DMA channel.
摘要翻译： 本发明提供了一种提高至少一个直接存储器存取（DMA）通道的灵活性的方法。 所述至少一个DMA通道由第一设备的多个DMA引擎使用以指导第一设备的多个DMA引擎与第二设备之间的数据传输。 所述方法的说明性实施例包括：允许多个DMA引擎中的任何一个使用所述至少一个DMA通道中的任何一个，以及如果所述多个DMA引擎中的一些同时地使得所述多个DMA引擎中的一些可以共享目标通道 竞争目标频道，至少一个DMA频道之一。
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