摘要:
A method of characterizing mechanical and thermal growth of a rotor tip clearance arrangement and a method of controlling such an arrangement. The characterization method comprising constructing a finite element model and calibration cases; run the model for the calibration cases to obtain displacements; and calculating component growth therefrom. The growth is characterized and scaled for the operating conditions. The clearance is calculated in a time step from the growths and input to a control arrangement for subsequent time steps.
摘要:
Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.
摘要:
A thermal displacement correction device for a machine tool is provided with detection result determination unit configured to determine, based on an actual position and a reference position detected by position detection unit, whether or not the actual position is based on correct detection, correction error calculation unit configured to calculate a correction error in the actual position if it is determined that the result of detection is based on correct detection, and correction amount modification unit configured to modify a thermal displacement correction amount based on the correction error.
摘要:
A system includes a wafer stage adapted to hold a semiconductor wafer thereon. A moveable temperature sensor array is configured to move to a plurality of different positions over a surface of the wafer stage and to take a plurality of temperature measurements at the plurality of positions, respectively. Based on the plurality of temperature measurements, a controller is adapted to determine an expected thermal deformation for the semiconductor wafer or for a reticle arranged over the semiconductor wafer.
摘要:
The present invention includes the following steps: setting the thickness of an interposer to an initial value; determining the axial force of the interposer and the radius of curvature of the warpage caused by the difference in the thermal expansion coefficients of the supporting substrate, the joined layer and the interposer at the set thickness; determining the absolute value of the stress on the chip-connecting surface of the interposer from the stress due to the axial force of the interposer and the stress due to the warpage using the determined axial force and the radius of curvature; determining whether or not the absolute value of the stress is within a tolerance; changing the thickness of the interposer by a predetermined value; and confirming the set thickness as the thickness of the interposer when the determined absolute value of the stress is within the tolerance.
摘要:
An ultrasensitive ratiometric capacitance dilatometer and related methods are described. The dilatometer provides a capacitance measurement based on a ratiometric capacitance, or the capacitance ratio measured between two or more parallel plate capacitors of the dilatometer. In this regard, an absolute capacity bridge is not required, and even more advantageously, the effects of adsorbed gas are greatly reduced compared to conventional dilatometers. The ratiometric capacitance dilatometer provides a symmetrical configuration, which reduces the effects of temperature gradients. Moreover, certain embodiments provide a “v-groove design”, wherein a first parallel plate capacitor forms an angle with a second parallel plate capacitor of the dilatometer along a key centerline of the dilatometer cell, which improves manufacturability due to simpler grinding, metalizing and assembly.
摘要:
In order to determine a volume thermal expansion coefficient of a liquid, a sample of the liquid is placed inside a cell of a calorimeter followed by an incremental increase of pressure inside the cell containing the liquid. After each pressure increase heat flow into the cell and volume of the liquid are measured. Based on results of the measurements of the heat flow and accounting for initially evaluated cell volume, the volume thermal expansion of the liquid is determined.
摘要:
A method of measuring the coefficient of thermal expansion of a ceramic material, including the steps of applying a glaze to a substantially densified refractory body, wherein the coefficient of thermal expansion of either the glaze or the body is known, bonding the glaze to the body, putting the glaze insufficient tension to induce crazing, measuring the average distance between cracks in the crazed glaze; and determining the unknown coefficient of thermal expansion of the glaze or body.
摘要:
A method for predicting the drop impact resistance of a stretch-blow moulded polypropylene container which comprises the steps of measuring the initial size of the container, placing it in an oven, remeasuring its size after removing it from the oven, calculating the percentage difference in size of the container and determining its drop impact resistance, which is proportional to said difference.
摘要:
A furnace for performing dilatometric assays includes a closable sample chamber on which windows for the passage of beams are provided, a sample carrier having a horizontal contact surface for receiving samples situated in the sample chamber and the sample chamber being heatable via one or more heating elements. The heating elements are implemented as essentially flat on the side facing toward the sample carrier and delimit the sample chamber on the top side and the bottom side, the heating elements extending on all sides beyond the sample carrier in the horizontal direction. An especially uniform temperature distribution on the sample is thus ensured.