公开(公告)号：US12242136B2

公开(公告)日：2025-03-04

申请号：US18428134

申请日：2024-01-31

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Hyuk Huh ,  Jae Hyun Baik ,  Yong Joo Jo

IPC: G02B9/64 ,  G02B13/00 ,  G02B27/00 ,  H04N23/54

Abstract: An optical imaging system includes an optical system including at least six lenses, sequentially disposed from an object side toward an image side, an image sensor configured to convert light incident through the optical system into an electronic signal, and a variable stop configured to change an incident hole diameter and disposed toward the object side of a lens of the optical system closest to the object side, wherein TTL is a distance to an imaging plane of the image sensor from an object-side surface of the lens closest to the object side and 4.7 mm

公开(公告)号：US12242039B2

公开(公告)日：2025-03-04

申请号：US18354020

申请日：2023-07-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung Hui Ko ,  Ju Hwa Son ,  Ju Sung Park ,  Yong Joo Jo

IPC: G02B13/00 ,  G02B9/62 ,  G02B13/02

Abstract: An optical imaging system includes a first lens which has refractive power, a second lens which has refractive power, a third lens which has a convex object-side surface, and an inflection point is formed on an image-side surface thereof, a fourth lens which has refractive power, a fifth lens which has a convex object-side surface, and a sixth lens which has refractive power and an inflection point is formed on an image-side surface thereof, and wherein the first to sixth lens are sequentially disposed from an object side.

公开(公告)号：US12242032B2

公开(公告)日：2025-03-04

申请号：US17406298

申请日：2021-08-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hag Chul Kim ,  Eun Chong Lee ,  Yong Joo Jo ,  Ga Young An

IPC: G02B3/02 ,  G02B9/64 ,  G02B13/00 ,  G02B15/14 ,  G02B21/02

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the first to seventh lenses are spaced apart from each other along the optical axis, and the optical imaging system satisfies 0.4

公开(公告)号：US20250071902A1

公开(公告)日：2025-02-27

申请号：US18625488

申请日：2024-04-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Eun LEE ,  Ki Hwan KIM

IPC: H05K1/16 ,  H05K1/03 ,  H05K1/11

Abstract: The present disclosure relates to a printed circuit board including: a glass layer; a plurality of blind cavities respectively penetrating through a portion of the glass layer from an upper surface or a lower surface of the glass layer; a plurality of passive elements respectively disposed in the plurality of blind cavities; and an insulating layer covering at least a portion of each of the glass layer and the plurality of passive elements and disposed in at least a portion of each of the plurality of blind cavities. At least two of the plurality of blind cavities have different depths.

公开(公告)号：US12230445B2

公开(公告)日：2025-02-18

申请号：US18136418

申请日：2023-04-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bon Hyeong Koo ,  Seok Hyun Yoon ,  In Ho Jeon ,  Byung Kil Yun ,  Se Yong Kim ,  Min Jung Jang ,  Geon Hoi Kim

IPC: H01G4/12 ,  C04B35/626 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and an external electrode disposed on the body, wherein the dielectric layer includes dielectric grains, wherein at least one of the dielectric grains includes a twin boundary, and wherein the dielectric layer includes a region in which a sum of lengths of the twin boundaries included in a 2 μm×2 μm region is 1.49 μm or more.

公开(公告)号：US20250056713A1

公开(公告)日：2025-02-13

申请号：US18667629

申请日：2024-05-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ho-Jae LEE ,  Bongbu JUNG ,  Yeook JEON

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11

Abstract: A circuit board is provided. The circuit board includes a substrate portion including at least one circuit wire, an adhesive layer disposed on a first side of the substrate portion, and a metal reinforcing layer disposed opposite to the substrate portion with respect to the adhesive layer, wherein the metal reinforcing layer includes a first surface which has a convex portion, and a second surface disposed opposite to the first surface.

公开(公告)号：US20250054693A1

公开(公告)日：2025-02-13

申请号：US18776807

申请日：2024-07-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dongseuk KIM

IPC: H01G4/012 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including a dielectric layer, a first internal electrode layer, and a second internal electrode layer alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on the body, perpendicular to the first direction; and a second external electrode disposed on the body, wherein the first internal electrode layer includes a first internal electrode connected to the first external electrode, and the second internal electrode layer includes a second internal electrode connected to the second external electrode, wherein, when the shortest distance between the first internal electrode and a second internal electrode, most adjacent to the first internal electrode is defined as a, and the maximum size of the first internal electrode in the first direction is defined as te, 0.01≤(a/te)≤1.37 is satisfied.

公开(公告)号：US12225307B2

公开(公告)日：2025-02-11

申请号：US17987914

申请日：2022-11-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Viatcheslav Smirnov

IPC: H04N25/75 ,  H04N25/76 ,  H04N25/77

Abstract: A reflective module assembly is provided. The reflective module assembly includes a fixed body, a moving body configured to rotate with respect to the fixed body, a reflective member disposed in the moving body, the reflective member configured to change a direction of a path of light incident in a first optical axis direction to a second optical axis direction, three ball members spaced apart from a rotational axis of the moving body, the three ball members configured to rotatably support the moving body, and a groove arrangement disposed on at least one of the moving body and the fixed body, and configured to contact with the three ball members. The three ball members and the groove arrangement form six contact points.

公开(公告)号：US12224127B2

公开(公告)日：2025-02-11

申请号：US17973132

申请日：2022-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chung Yeol Lee ,  Yoo Jeong Lee ,  Hyung Jong Choi ,  Kwang Yeun Won ,  So Jung An ,  Woo Kyung Sung ,  Kang Ha Lee ,  Myung Jun Park ,  Jong Ho Lee ,  Jun Hyeong Kim

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

公开(公告)号：US20250048534A1

公开(公告)日：2025-02-06

申请号：US18666110

申请日：2024-05-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Myong Keun JUNG ,  Young Hun YOU

IPC: H05K1/02 ,  H05K1/11

Abstract: The present disclosure relates to a printed circuit board, including: an interconnect bridge including an insulating material, a plurality of conductive pattern layers respectively disposed on or in the insulating material, and a conductive post disposed on the insulating material; a first insulating layer embedding the interconnect bridge and having a recess portion exposing a portion of the conductive post; and a first wiring layer disposed on the first insulating layer and including a first pad pattern connected to the exposed portion of the conductive post on the recess portion.