公开(公告)号：US12278056B2

公开(公告)日：2025-04-15

申请号：US18085037

申请日：2022-12-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： So Jung An ,  Yoo Jeong Lee ,  Hyung Jong Choi ,  Chung Yeol Lee ,  Kwang Yeun Won ,  Woo Kyung Sung ,  Myung Jun Park ,  Jong Ho Lee

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/12

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.

公开(公告)号：US12224127B2

公开(公告)日：2025-02-11

申请号：US17973132

申请日：2022-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chung Yeol Lee ,  Yoo Jeong Lee ,  Hyung Jong Choi ,  Kwang Yeun Won ,  So Jung An ,  Woo Kyung Sung ,  Kang Ha Lee ,  Myung Jun Park ,  Jong Ho Lee ,  Jun Hyeong Kim

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

公开(公告)号：US20220199331A1

公开(公告)日：2022-06-23

申请号：US17496659

申请日：2021-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kong Joo Jeon ,  So Jung An ,  Kwang Yeun Won ,  Woo Kyung Sung ,  Kyu Sik Park ,  Myung Jun Park

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/10 ,  H01G13/00

Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.

公开(公告)号：US12224126B2

公开(公告)日：2025-02-11

申请号：US17961490

申请日：2022-10-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jong Choi ,  Yoo Jeong Lee ,  Chung Yeol Lee ,  Kwang Yeun Won ,  So Jung An ,  Woo Kyung Sung ,  Myung Jun Park ,  Jong Ho Lee

IPC: H01G4/30 ,  H01G4/232

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction.

公开(公告)号：US20240222032A1

公开(公告)日：2024-07-04

申请号：US18540134

申请日：2023-12-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： So Jung An ,  Hyung Jong Choi ,  Jung Won Park ,  Yoo Jeong Lee ,  Kwang Yeun Won ,  Woo Kyung Sung ,  Byung Jun Jeon ,  Chul Seung Lee

IPC: H01G4/30 ,  H01G2/12 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/30 ,  H01G2/12 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.

公开(公告)号：US20230260709A1

公开(公告)日：2023-08-17

申请号：US18087435

申请日：2022-12-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yoo Jeong Lee ,  Hyung Jong Choi ,  Chung Yeol Lee ,  Kwang Yeun Won ,  So Jung An ,  Woo Kyung Sung ,  Myung Jun Park ,  Jong Ho Lee

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G4/2325

Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.

公开(公告)号：US12249461B2

公开(公告)日：2025-03-11

申请号：US17901051

申请日：2022-09-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： So Jung An ,  Hyung Jong Choi ,  Yoo Jeong Lee ,  Chung Yeol Lee ,  Kwang Yeun Won ,  Woo Kyung Sung ,  Myung Jun Park ,  Jong Ho Lee

IPC: H01G4/224 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.

公开(公告)号：US11996240B2

公开(公告)日：2024-05-28

申请号：US17496659

申请日：2021-10-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kong Joo Jeon ,  So Jung An ,  Kwang Yeun Won ,  Woo Kyung Sung ,  Kyu Sik Park ,  Myung Jun Park

IPC: H01G4/30 ,  H01G2/10 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G13/00

CPC classification number: H01G4/30 ,  H01G2/103 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G13/00

Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.

公开(公告)号：US11842853B2

公开(公告)日：2023-12-12

申请号：US17470251

申请日：2021-09-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jong Choi ,  Yoo Jeong Lee ,  Kwan Young Son ,  Woo Kyung Sung ,  Kyu Sik Park ,  Myung Jun Park ,  Kwang Yeun Won

IPC: H01G4/30 ,  H01G4/224 ,  H01G4/248

CPC classification number: H01G4/224 ,  H01G4/248 ,  H01G4/30

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.

公开(公告)号：US12255022B2

公开(公告)日：2025-03-18

申请号：US17948499

申请日：2022-09-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Yeun Won ,  Jong Ho Lee ,  Yoo Jeong Lee ,  Hyung Jong Choi ,  Chung Yeol Lee ,  So Jung An ,  Woo Kyung Sung ,  Myung Jun Park

IPC: H01G4/232 ,  H01G4/224 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.