公开(公告)号：US10041185B2

公开(公告)日：2018-08-07

申请号：US15125314

申请日：2015-02-26

Applicant: THINK LABORATORY CO., LTD.

Inventor： Kazuhiro Sukenari

IPC: C25D17/12 ,  C25D7/04 ,  C25D7/00 ,  C25D3/04 ,  C25D3/38 ,  C25D5/04 ,  C25D17/06

Abstract: Provided are a cylinder plating apparatus and a cylinder plating method, in which the distance between an insoluble electrode and a cylinder to be processed can be kept constant regardless of the diameter of the cylinder to be processed, and the surface area of the insoluble electrode is increased to reduce the current density of the insoluble electrode, thereby being capable of reducing burden on the insoluble electrode. The cylinder plating apparatus is configured to plate an outer peripheral surface of the cylinder to be processed in such a manner that a pair of the insoluble electrodes each having a shape in which at least a lower part thereof is curved inward and being constructed such that at least the lower part has a comb-like portion are brought close to both side surfaces of the cylinder to be processed with predetermined intervals. The insoluble electrodes face each other in a staggered pattern so that projections of the comb-like portion of one of the insoluble electrodes are located at positions of recesses of the comb-like portion of another one of the insoluble electrodes. The insoluble electrode is configured to rotate about an upper end of the insoluble electrode so that the distance of closeness of the insoluble electrode to the outer peripheral surface of the cylinder to be processed is adjustable depending on the diameter of the cylinder to be processed.

公开(公告)号：US20180133839A1

公开(公告)日：2018-05-17

申请号：US15577040

申请日：2016-05-10

Applicant: THINK LABORATORY CO., LTD.

Inventor： Tatsuo SHIGETA

IPC: B23K26/34 ,  B21B27/02 ,  B23K26/354 ,  B33Y10/00 ,  B33Y50/00

CPC classification number: B23K26/34 ,  B21B27/021 ,  B21H8/005 ,  B22F3/105 ,  B22F3/16 ,  B23K26/354 ,  B29C33/38 ,  B29C67/00 ,  B31F1/07 ,  B31F2201/0717 ,  B31F2201/072 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y80/00 ,  Y02P10/295

Abstract: Provided are a manufacturing method for an embossing roll which is capable of being manufactured in a wide variety in small quantities and has uneven patterns formed uniformly and precisely without irregularities, and the embossing roll. The manufacturing method for the embossing roll comprises: a step of preparing a cylindrical base material; and a modeling step of modeling embossing onto a surface of the cylindrical base material with a three-dimensional printer based on three-dimensional processing data. It is preferred that the three-dimensional processing data is created by subjecting an embossing roll model to three-dimensional scanning.

公开(公告)号：US20180093467A1

公开(公告)日：2018-04-05

申请号：US15559262

申请日：2016-03-29

Applicant: THINK LABORATORY CO., LTD.

Inventor： Shintaro SUGAWARA ,  Yoshinobu SATO

IPC: B41F13/11 ,  B41C1/18 ,  B41F9/00 ,  B41N1/06 ,  B41N1/20

CPC classification number: B41F13/11 ,  B41C1/18 ,  B41F9/00 ,  B41M3/14 ,  B41N1/06 ,  B41N1/20 ,  B41N3/00 ,  B41N3/003

Abstract: Provided are a gravure cylinder, which has satisfactory wear resistance as the gravure cylinder and includes a surface reinforcing coating layer having wear resistance equal to or more than that of chromium plating using hexavalent chromium, a method of manufacturing the gravure cylinder, and a method of manufacturing a printed matter using the gravure cylinder. The gravure cylinder includes: a plate base material; a recess layer, which is formed on a surface of the plate base material and includes a large number of recesses formed on the surface; and a surface reinforcing coating layer configured to cover the recess layer with chromium nitride or carbon nitride, in which the surface reinforcing coating layer is formed by reactive sputtering.

公开(公告)号：US20140192383A1

公开(公告)日：2014-07-10

申请号：US14241546

申请日：2012-12-05

Applicant: THINK LABORATORY CO., LTD.

Inventor： Tatsuo Shigeta

IPC: B41C1/04

CPC classification number: B41C1/04 ,  B41C1/18 ,  C25D7/00 ,  C25D17/06 ,  G03F7/24 ,  G03F7/3021

Abstract: Provided is a single-motor-driven gravure cylinder chuck mechanism that is enhanced in contact tightness of chuck cones with respect to an unprocessed plate-making roll in each processing unit of a fully automatic plate-making system. The gravure cylinder chuck mechanism is to be used for a processing unit of the fully automatic gravure plate-making processing system for manufacturing a plate-making roll by performing a series of processes on an unprocessed plate-making roll. The gravure cylinder chuck mechanism includes: a pair of chuck cones provided to be opposed to each other, for chucking both end surfaces of the unprocessed plate-making roll; chuck cone moving means for allowing the pair of chuck cones to be freely brought into contact with and separated away from both the end surfaces of the unprocessed plate-making roll; and a single motor for driving the chuck cone moving means. The single motor allows the pair of chuck cones to be freely brought into contact with and separated away from both the end surfaces of the unprocessed plate-making roll so that the pair of chuck cones chuck the unprocessed plate-making roll.

Abstract translation: 提供了一种单电机驱动的凹印缸卡盘机构，其在全自动制版系统的每个处理单元中相对于未加工的制版辊增强了卡盘锥的接触紧密度。 凹版滚筒卡盘机构用于通过在未加工的制版辊上执行一系列工艺来制造制版辊的全自动凹版印刷制版处理系统的处理单元。 凹版滚筒卡盘机构包括：一对夹持锥体，彼此相对设置，用于卡住未加工的制版辊的两个端面; 卡盘锥形移动装置，用于允许一对卡盘锥体与未加工的制版辊的两个端面自由地接触并分离; 以及用于驱动卡盘锥移动装置的单个马达。 单个电动机允许一对卡盘锥体自由地与未加工的制版辊的两个端面接触并分离，使得一对卡盘锥卡盘未加工的制版辊。