公开(公告)号：US20220166533A1

公开(公告)日：2022-05-26

申请号：US17527483

申请日：2021-11-16

Applicant: Ayar Labs, Inc.

Inventor： Vladimir Stojanovic ,  Hugo Saleh ,  Roy Edward Meade

IPC: H04J14/02 ,  H04L12/931 ,  H04Q11/00

Abstract: A network switch system-in-package includes a carrier substrate with a network switch chip and a plurality of photonic input/output modules disposed on the carrier substrate. Each of the plurality of photonic input/output modules includes a module substrate and a plurality of photonic chip pods disposed on the module substrate. Each photonic chip pod includes a pod substrate with a photonic input/output chiplet and a gearbox chiplet attached to the pod substrate. The photonic input/output chiplet includes a parallel electrical interface, a photonic interface, and a plurality of optical macros implemented between the photonic interface and the parallel electrical interface. The gearbox chiplet electrically connects with the parallel electrical interface of the photonic input/output chiplet and a serial electrical interface of the network switch chip. The gearbox chiplet converts between the parallel electrical interface of the photonic input/output chiplet and the serial electrical interface of the network switch chip.

公开(公告)号：US20220107463A1

公开(公告)日：2022-04-07

申请号：US17516602

申请日：2021-11-01

Applicant: Ayar Labs, Inc.

Inventor： Shahab Ardalan ,  Michael Davenport ,  Roy Edward Meade

IPC: G02B6/30 ,  H01L21/56 ,  G02B6/122

Abstract: A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

公开(公告)号：US11280970B2

公开(公告)日：2022-03-22

申请号：US16440903

申请日：2019-06-13

Applicant: Ayar Labs, Inc.

Inventor： John Fini ,  Roy Edward Meade ,  Derek Van Orden ,  Mark Wade

IPC: G02B6/42

Abstract: A beam steering structure includes an alignment structure shaped to receive and align an optical fiber such that an axis of a core of the optical fiber is oriented in a first direction. The beam steering structure includes an end portion having an angled optical surface oriented at a non-zero angle relative to the first direction. The end portion is shaped and positioned so that light propagating along the first direction from the optical fiber passes through the end portion to reach the angled optical surface. A reflecting system is positioned on the angled optical surface across the first direction. The reflecting system is configured to reflect incident light propagating along the first direction into a first reflected beam of a first polarization and a second reflected beam of a second polarization. The first and second reflected beams are directed into first and second optical communication channels, respectively.

公开(公告)号：US11233580B2

公开(公告)日：2022-01-25

申请号：US17175678

申请日：2021-02-14

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC: G11C5/04 ,  G11C5/06 ,  G11C11/42 ,  H04B10/80 ,  H04B10/516

Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

公开(公告)号：US11156773B2

公开(公告)日：2021-10-26

申请号：US17019158

申请日：2020-09-11

Applicant: Ayar Labs, Inc.

Inventor： Haiwei Lu ,  Chen Li ,  John Fini ,  Chong Zhang ,  Roy Edward Meade

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/293 ,  G02F1/313

Abstract: A handle-integrated composite wafer assembly includes a handle wafer attached to a device wafer. The device wafer includes a device layer formed on a buried oxide layer. The device layer includes an optical resonator structure. The handle wafer includes a base layer and a layer of anti-reflective material disposed on a top side of the base layer. The base layer has a cavity extending into the base layer from the top side of the base layer. The cavity has at least one side surface and a bottom surface. The layer of anti-reflective material is substantially conformally disposed within the cavity on the at least one side surface and bottom surface of the cavity. The handle wafer is attached to the device wafer with the layer of anti-reflective material affixed to the buried oxide layer, and with the cavity substantially aligned with the optical resonator structure in the device layer.

公开(公告)号：US20210124107A1

公开(公告)日：2021-04-29

申请号：US17079357

申请日：2020-10-23

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Anatol Khilo ,  Forrest Sedgwick ,  Alexandra Wright

IPC: F21V8/00 ,  G02B6/12 ,  H04B10/073 ,  H04B10/50

Abstract: A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.

公开(公告)号：US20200021384A1

公开(公告)日：2020-01-16

申请号：US16510824

申请日：2019-07-12

Applicant: Ayar Labs, Inc.

Inventor： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

IPC: H04J14/02 ,  H04Q11/00 ,  H04B10/50

Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

公开(公告)号：US20190384020A1

公开(公告)日：2019-12-19

申请号：US16440903

申请日：2019-06-13

Applicant: Ayar Labs, Inc.

Inventor： John Fini ,  Roy Edward Meade ,  Derek Van Orden ,  Mark Wade

IPC: G02B6/42

Abstract: A beam steering structure includes an alignment structure shaped to receive and align an optical fiber such that an axis of a core of the optical fiber is oriented in a first direction. The beam steering structure includes an end portion having an angled optical surface oriented at a non-zero angle relative to the first direction. The end portion is shaped and positioned so that light propagating along the first direction from the optical fiber passes through the end portion to reach the angled optical surface. A reflecting system is positioned on the angled optical surface across the first direction. The reflecting system is configured to reflect incident light propagating along the first direction into a first reflected beam of a first polarization and a second reflected beam of a second polarization. The first and second reflected beams are directed into first and second optical communication channels, respectively.

公开(公告)号：US20180019820A1

公开(公告)日：2018-01-18

申请号：US15650586

申请日：2017-07-14

Applicant: Ayar Labs, Inc.

Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden

IPC: H04B10/50 ,  H04J14/02 ,  H01S4/00

Abstract: A laser module includes a laser source and an optical marshalling module. The laser source is configured to generate and output a plurality of laser beams. The plurality of laser beams have different wavelengths relative to each other. The different wavelengths are distinguishable to an optical data communication system. The optical marshalling module is configured to receive the plurality of laser beams from the laser source and distribute a portion of each of the plurality of laser beams to each of a plurality of optical output ports of the optical marshalling module, such that all of the different wavelengths of the plurality of laser beams are provided to each of the plurality of optical output ports of the optical marshalling module. An optical amplifying module can be included to amplify laser light output from the optical marshalling module and provide the amplified laser light as output from the laser module.

公开(公告)号：US20250012982A1

公开(公告)日：2025-01-09

申请号：US18887396

申请日：2024-09-17

Applicant: Ayar Labs, Inc.

Inventor： John Fini ,  Roy Edward Meade ,  Derek Van Orden ,  Mark Wade

IPC: G02B6/42

Abstract: A beam steering structure includes an alignment structure shaped to receive and align an optical fiber such that an axis of a core of the optical fiber is oriented in a first direction. The beam steering structure includes an end portion having an angled optical surface oriented at a non-zero angle relative to the first direction. The end portion is shaped and positioned so that light propagating along the first direction from the optical fiber passes through the end portion to reach the angled optical surface. A reflecting system is positioned on the angled optical surface across the first direction. The reflecting system is configured to reflect incident light propagating along the first direction into a first reflected beam of a first polarization and a second reflected beam of a second polarization. The first and second reflected beams are directed into first and second optical communication channels, respectively.