公开(公告)号：US20080170370A1

公开(公告)日：2008-07-17

申请号：US12055263

申请日：2008-03-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.

Abstract translation: 一种信息处理系统，包括：处理器; 记忆 输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。 该系统还包括用于冷却处理器的冷却结构。 冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。

公开(公告)号：US20080144288A1

公开(公告)日：2008-06-19

申请号：US12037067

申请日：2008-02-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

公开(公告)号：US07345353B2

公开(公告)日：2008-03-18

申请号：US11323568

申请日：2005-12-30

Applicant: Bucknell C. Webb

Inventor： Bucknell C. Webb

IPC: H01L23/58

CPC classification number: H01L21/481 ,  H01L23/13 ,  H01L23/147 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/81 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/15159 ,  H01L2924/3511 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage.

Abstract translation: 一种为硅芯片载体提供灵活性的装置和方法，该芯片载体在至少一个实施例中包括多个芯片，以及在一些相邻芯片之间具有薄化区域的硅芯片载体，从而允许增加灵活性并减少封装翘曲。

公开(公告)号：US06611395B1

公开(公告)日：2003-08-26

申请号：US09432950

申请日：1999-11-03

Applicant: Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B2102

CPC classification number: G11B5/59633

Abstract: A method for writing tracks on a rotating disk media data storage device comprising the steps of: receiving a set of component parameters; and adjusting track pitch for each of the tracks to be written in each disk according to the component parameters. According to another embodiment a disk drive includes at least one disk comprising a two or more of tracks in which the track pitch between each pair of adjacent tracks is set based on component parameters such as the recording head widths. According to another embodiment a servowriter is adapted to perform the method discussed above.

Abstract translation: 一种用于在旋转盘介质数据存储设备上写入轨迹的方法，包括以下步骤：接收一组分量参数; 以及根据组件参数调整要写入每个磁盘的每个磁道的磁道间距。 根据另一实施例，盘驱动器包括至少一个盘，其包括两个或更多个轨道，其中基于诸如记录头宽度的分量参数设置每对相邻轨道之间的轨道间距。 根据另一实施例，伺服驱动器适于执行上述方法。

公开(公告)号：US06429989B1

公开(公告)日：2002-08-06

申请号：US09592740

申请日：2000-06-13

Applicant: Mark D. Schultz ,  Bucknell C. Webb

Inventor： Mark D. Schultz ,  Bucknell C. Webb

IPC: G11B509

CPC classification number: G11B27/30 ,  G11B5/59633 ,  G11B2220/20

Abstract: A method for writing timing marks on a rotatable storage medium, such as on a disk in a disk drive, includes the steps of: 1) during a rotation of the disk, detecting the passage of at least a portion of a first timing mark located at a radial trajectory at a first radius of the disk, and 2) during the same rotation of the disk, writing a second timing mark at a second radius of the disk. The second timing mark is located at least one of a) where at least a portion of the second timing mark overlaps at least a portion of the radial trajectory of the first timing mark, and b) where the second timing mark is in close proximity to the radial trajectory of the first timing mark. The second timing mark is written based on different parameters such as a measured time interval, a calculated time interval, and a predetermined delay.

Abstract translation: 在诸如盘驱动器中的盘上的可旋转存储介质上写入定时标记的方法包括以下步骤：1）在盘的旋转期间，检测位于第一定时标记的至少一部分的通过 在盘的第一半径处的径向轨迹处，以及2）在盘的相同旋转期间，在盘的第二半径处写入第二定时标记。 第二定时标记位于以下中的至少一个中：a）第二定时标记的至少一部分与第一定时标记的径向轨迹的至少一部分重叠，以及b）第二定时标记紧邻 第一定时标记的径向轨迹。 基于不同的参数（例如测量的时间间隔，计算的时间间隔和预定的延迟）写入第二定时标记。

公开(公告)号：US5907447A

公开(公告)日：1999-05-25

申请号：US893316

申请日：1997-07-16

Applicant: Edward John Yarmchuk ,  Mark Delorman Schultz ,  Bucknell C. Webb ,  Timothy Joseph Chainer

Inventor： Edward John Yarmchuk ,  Mark Delorman Schultz ,  Bucknell C. Webb ,  Timothy Joseph Chainer

IPC: G11B5/596 ,  G11B21/10 ,  G11B5/012

CPC classification number: G11B21/106 ,  G11B21/10 ,  G11B5/59633 ,  G11B5/59644

Abstract: A mechanism for servowriting on a storage medium of a storage device. The storage device has a transducer and a servo loop for positioning the transducer with respect to the storage medium. At least one transition is written on a track of the storage medium, while servoing on other transitions previously recorded on the storage medium. A reference waveform is derived as a function of a closed loop response of the servo loop and a position error waveform. The position error waveform corresponds to one or more position errors of the transducer relative to the previously recorded transitions. The reference waveform is usable in writing subsequent tracks on the storage medium. Using the reference waveform for writing subsequent tracks provides a substantial rejection of mechanical disturbances by the servo loop.

Abstract translation: 一种用于在存储设备的存储介质上进行伺服驱动的机制。 存储装置具有用于相对于存储介质定位换能器的换能器和伺服回路。 至少一个转换被写在存储介质的轨道上，同时伺服在先前记录在存储介质上的其它转换。 作为伺服环路的闭环响应和位置误差波形的函数导出参考波形。 位置误差波形对应于传感器相对于先前记录的转换的一个或多个位置误差。 参考波形可用于将后续轨道写入存储介质上。 使用参考波形写入后续轨道可以显着抑制伺服回路的机械扰动。

公开(公告)号：US5142426A

公开(公告)日：1992-08-25

申请号：US542288

申请日：1990-06-21

Applicant: Mark E. Re ,  Michael A. Russak ,  Bucknell C. Webb

Inventor： Mark E. Re ,  Michael A. Russak ,  Bucknell C. Webb

IPC: G11B5/33 ,  G11B5/31

CPC classification number: G11B5/3143

Abstract: A thin film magnetic head, having a predetermined cut-off frequency is constructed of alternating first and second layers, the first layers include a magnetic material and the second layers include a resistive material. The resistivity of the second layers is chosen so that the head's cut-off frequency exceeds the head's required frequency response. The resistivity of the second layers is chosen to be considerably less than any level of resistivity which falls within the insulation regime.