公开(公告)号：US20090323347A1

公开(公告)日：2009-12-31

申请号：US12274358

申请日：2008-11-20

申请人： YI ZHANG ,  JIN-SONG FENG ,  CHENG-TIEN LAI

发明人： YI ZHANG ,  JIN-SONG FENG ,  CHENG-TIEN LAI

IPC分类号： F21V29/00 ,  H01J7/24

CPC分类号： F21V29/004 ,  F21S2/005 ,  F21V19/001 ,  F21V29/713 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

摘要翻译： LED灯包括散热器，安装在散热器上的多个散热片阵列和安装在散热片阵列上的多个LED模块。 散热器包括基部和从基部延伸的多个散热翅片。 翅片阵列安装在散热器底座的顶表面上。 每个翅片阵列由互锁在一起的多个翅片组成。 每个翅片阵列具有与基部的顶表面接触的底部安装表面和相对于基部的顶部表面以锐角限定的顶部接合表面。 LED模块分别通过吸热板安装在翅片阵列的接合表面上。

公开(公告)号：US20090147521A1

公开(公告)日：2009-06-11

申请号：US12036300

申请日：2008-02-25

申请人： WEN-XIANG ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

发明人： WEN-XIANG ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V29/00

CPC分类号： F21V23/02 ,  F21S8/088 ,  F21V7/0008 ,  F21V15/01 ,  F21V27/00 ,  F21V29/75 ,  F21V29/763 ,  F21V31/00 ,  F21V31/005 ,  F21W2131/00 ,  F21W2131/103 ,  F21W2131/105 ,  F21W2131/109 ,  F21Y2115/10

摘要： An LED lamp includes a housing having a base, a frame at a top end of the housing and a plurality of stanchions interconnecting the base and the frame. A heat sink is mounted on the frame. An LED module is received in the housing and attached on a bottom surface of the heat sink. A printed circuit board is arranged on the base of the housing, and a reflector is located on the printed circuit board. A transparent envelope is received in the housing and covers windows defined between the stanchions. A light generated by the LED module is reflected by the reflector to transmit outwardly through the envelope to illuminate a surrounding environment.

摘要翻译： LED灯包括壳体，壳体具有底座，在壳体的顶端处的框架和将底座和框架互连的多个支柱。 散热器安装在框架上。 LED模块被容纳在壳体中并且附接在散热器的底表面上。 印刷电路板布置在外壳的底部，反射器位于印刷电路板上。 透明的信封被容纳在壳体中并且覆盖在支柱之间限定的窗口。 由LED模块产生的光被反射器反射，通过外壳向外透射以照亮周围的环境。

公开(公告)号：US20090059604A1

公开(公告)日：2009-03-05

申请号：US11845742

申请日：2007-08-27

申请人： GUANG YU ,  CHENG-TIEN LAI

发明人： GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V29/00 ,  H05K7/20

CPC分类号： F21V29/74 ,  F21K9/00 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10

摘要： A heat dissipation device for a light emitting diode (LED) module includes a heat sink, a plurality of heat pipes received in the heat sink and a heat-absorbing plate thermally attached to the heat pipes and the LED module and located therebetween. The heat sink includes a base and a plurality of fins mounted on the base. The base defines a plurality of grooves for accommodating the heat pipes therein. Top surfaces of the heat pipes are coplanar with a top face of the base of the heat sink so that the heat-absorbing plate has an intimate contacting with the top face of the base of the heat sink and the top surfaces of the heat pipes, whereby the heat pipes can quickly transfer heat from the LED module to the heat sink via the heat-absorbing plate.

摘要翻译： 用于发光二极管（LED）模块的散热装置包括散热器，容纳在散热器中的多个热管和热连接到热管和LED模块并位于其间的吸热板。 散热器包括底座和安装在基座上的多个翅片。 基座限定多个槽，用于在其中容纳热管。 热管的上表面与散热器底部的顶面共面，使得吸热板与散热器的底部的顶面和热管的顶面紧密接触， 由此热管能够通过吸热板将热量从LED模块快速传递到散热器。

公开(公告)号：US20090059536A1

公开(公告)日：2009-03-05

申请号：US12269858

申请日：2008-11-12

申请人： CHENG-TIEN LAI ,  JIN-SONG FENG

发明人： CHENG-TIEN LAI ,  JIN-SONG FENG

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

摘要翻译： 散热组件包括散热器，围绕散热器的保持模块以及可枢转地连接到保持模块的一对线夹，以将散热器压靠在印刷电路板上的电子部件上。 保持模块包括围绕矩形开口的三个壁，散热器通过该壁与电子部件接触。 在三面墙上形成两个倒钩和两个支撑构件。 每个夹具包括保持在一个支撑构件中的枢转部分，将热沉朝向电子部件按压的邻接部分，以及一个锁定在一个倒钩上的锁定部分，连接该邻接部分与枢转部分的连接部分以及由 锁定部分。 每个夹子完全位于散热器的相应侧。

公开(公告)号：US20100061092A1

公开(公告)日：2010-03-11

申请号：US12206738

申请日：2008-09-09

申请人： RI-LANG YANG ,  GUANG YU ,  CHENG-TIEN LAI

发明人： RI-LANG YANG ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V33/00

CPC分类号： F21V19/0055 ,  F21V15/01 ,  F21V29/70 ,  F21V29/75 ,  F21V29/763 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An LED lamp includes an LED module, a heat sink having a base to which the LED module is mounted, a plurality of screws extending through the LED module and into the base of the heat sink to secure the LED module on the base of the heat sink, and a plurality of elastic members mounted on the screws and positioned between the base and the LED module. The elastic members are expanded by the screws to generate a force engaging with the screws to thereby combine the screws and the LED module together beforehand.

摘要翻译： LED灯包括LED模块，散热器，其具有安装LED模块的基座，多个螺钉，其延伸穿过LED模块并进入散热器的基座，以将LED模块固定在热源的底部 并且安装在螺钉上并位于基座和LED模块之间的多个弹性构件。 弹性构件通过螺钉膨胀以产生与螺钉啮合的力，从而预先将螺钉和LED模块组合在一起。

公开(公告)号：US20090316403A1

公开(公告)日：2009-12-24

申请号：US12200880

申请日：2008-08-28

申请人： YU ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

发明人： YU ZHANG ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： F21V21/00 ,  B60Q1/06

CPC分类号： F21V29/74 ,  F21S8/086 ,  F21V19/001 ,  F21V29/75 ,  F21V29/76 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED lamp includes a lamp frame, a plurality of LED modules, an envelope and a heat sink made of metal. The envelope and the heat sink are mounted on top and bottom sides of the lamp frame. A frame body of the lamp frame is attached to a top face of a base of the heat sink. A heat absorbing member made of metal and provided with a plurality of heat absorbing portions is attached on the top face of the base. The LED modules are attached on top boards of the heat absorbing portions. The envelope engages with the lamp frame and receives the heat absorbing member and the LED modules therein. The top boards are inclined downwards from a middle toward an outside of the heat absorbing member.

摘要翻译： LED灯包括灯框架，多个LED模块，外壳和由金属制成的散热器。 信封和散热器安装在灯架的顶部和底部。 灯架的框体连接到散热器的基座的顶面。 由金属制成并具有多个吸热部分的吸热件安装在基座的顶面上。 LED模块附接在吸热部分的顶板上。 信封与灯框架接合，并在其中容纳吸热件和LED组件。 顶板从吸热件的中间向外倾斜。

公开(公告)号：US20090236262A1

公开(公告)日：2009-09-24

申请号：US12200872

申请日：2008-08-28

申请人： CHUN-JIANG SHUAI ,  GUANG YU ,  CHENG-TIEN LAI

发明人： CHUN-JIANG SHUAI ,  GUANG YU ,  CHENG-TIEN LAI

IPC分类号： B65D85/00

CPC分类号： F21V17/007 ,  B65D43/12 ,  B65D2585/86 ,  F21S4/20 ,  F21Y2115/10

摘要： A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.

摘要翻译： 用于保护LED模块在运输过程中不被损坏的保护性包装包括其中包含LED模块的壳体和可滑动地固定在壳体中以覆盖壳体的顶部开口的盖子。 壳体定义了在其中接收LED模块的房间。 壳体的底部凹陷以形成容纳结合在LED模块上的热界面材料的空间。 壳体的端部被封闭以抵靠盖的端部，并且壳体的相对端部分地打开以容纳盖的相对端。 保护性包装由防静电塑料制成，壁厚大于0.5mm。