公开(公告)号：US20070151845A1

公开(公告)日：2007-07-05

申请号：US11430948

申请日：2006-05-10

Applicant: Chieh-Kai Chang ,  Chao-Kai Cheng ,  Ming-Huan Yang ,  Chung-Wei Wang ,  Fu-Kang Cheng ,  Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Chih-Ming Chang ,  Cheng-Po Yu

Inventor： Chieh-Kai Chang ,  Chao-Kai Cheng ,  Ming-Huan Yang ,  Chung-Wei Wang ,  Fu-Kang Cheng ,  Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Chih-Ming Chang ,  Cheng-Po Yu

IPC: C25C7/00

CPC classification number: C25D17/00 ,  C25D5/003 ,  C25D5/08 ,  C25D17/004 ,  C25D17/02 ,  C25D21/12 ,  H05K3/423 ,  H05K2203/074 ,  H05K2203/1518

Abstract: An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes.

Abstract translation: 用于在具有通孔的基板上进行金属电镀的设备包括：室，其设置在室内，以分成两部分。 压力发生器和压力控制器分别连接到基板的两侧。 压力发生器用于将平行于衬底的表面流动的电解质泵入室中。 压力控制器用于将电解质引出室，并控制衬底两侧之间的压力差。 使得平行于基板表面流动的电解质被压力发生器泵送，并且通过几个通孔以控制通孔的内壁和内壁上的金属镀层的厚度。