公开(公告)号：US20150312488A1

公开(公告)日：2015-10-29

申请号：US14749886

申请日：2015-06-25

Applicant: FLIR Systems, Inc.

Inventor： Joseph Kostrzewa ,  Vu L. Nguyen ,  Theodore R. Hoelter ,  Nicholas Högasten ,  Mark Nussmeier ,  Eric A. Kurth ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/225 ,  H04N5/217 ,  H04N5/365

CPC classification number: H04N5/351 ,  H04N5/2176 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/2351 ,  H04N5/33 ,  H04N5/332 ,  H04N5/335 ,  H04N5/3656 ,  H04N5/3658 ,  H04N5/378 ,  H04N17/002 ,  H04N2101/00

Abstract: Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken. Such snapshots may be utilized to provide useful NUC data when the infrared imaging device starts up or is otherwise reactivated, so that the SBNUC or other NUC methods may produce effective results soon after the start-up. Such snapshots may also be utilized to update ineffective calibration terms.

Abstract translation: 提供各种技术来补偿和/或更新由于红外成像装置中的校准漂移而导致的无效（例如，陈旧）校准项。 例如，当检测到适当的触发事件和/或条件时，可以发起虚拟快门非均匀性校正（NUC）过程以产生NUC项以校正不均匀性，并且可以指示存在目标或场景作为 快门（例如，虚拟快门）。 例如，当虚拟快门场景不可用时，可以在红外成像设备的图像捕获操作期间执行基于场景的不均匀性校正（SBNUC）。 此外，可以采用在虚拟快门NUC过程，SBNUC过程和/或其他NUC过程期间产生的校准数据（例如，NUC项）的快照。 当红外成像装置启动或以其他方式重新启动时，这样的快照可以用于提供有用的NUC数据，使得SBNUC或其他NUC方法可以在启动之后不久产生有效的结果。 这样的快照也可以用于更新无效的校准项。

公开(公告)号：US20150296146A1

公开(公告)日：2015-10-15

申请号：US14748542

申请日：2015-06-24

Applicant: FLIR Systems, Inc.

Inventor： Thomas J. Scanlon ,  Michael Fox ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp ,  Mark Nussmeier ,  Eric A. Kurth

IPC: H04N5/247 ,  H04N7/18 ,  H04N5/265 ,  H04N5/33 ,  H04N5/232

CPC classification number: H04N5/247 ,  H04N5/23241 ,  H04N5/265 ,  H04N5/332 ,  H04N7/181

Abstract: Various techniques are provided to monitor electrical equipment. In some implementations, a monitoring system for a cabinet may include an infrared camera and a non-thermal camera. The infrared camera may be configured to capture one or more thermal images of at least a portion of electrical equipment positioned in an interior cavity of the cabinet. The non-thermal camera may be configured to capture one or more non-thermal images such as visible light images of the portion of electrical equipment. In some implementations, combined images may be generated that include characteristics of the thermal images and the non-thermal images for viewing by a user. In some implementations, the cameras may receive electrical power through a physical coupling to an electrical connector within the cabinet and/or through electromagnetic energy harvesting techniques. Other implementations are also provided.

Abstract translation: 提供各种技术来监测电气设备。 在一些实施方案中，用于机柜的监控系统可以包括红外相机和非热摄像机。 红外摄像机可以被配置为捕获位于机柜的内腔中的电气设备的至少一部分的一个或多个热图像。 非热摄像机可以被配置为捕获一个或多个非热图像，例如电气设备的该部分的可见光图像。 在一些实现中，可以生成包括热图像和非热图像的特征以供用户观看的组合图像。 在一些实施方案中，相机可以通过物理耦合到机柜内的电连接器和/或通过电磁能量收集技术来接收电力。 还提供了其他实现。

公开(公告)号：US20150288892A1

公开(公告)日：2015-10-08

申请号：US14747202

申请日：2015-06-23

Applicant: FLIR Systems, Inc.

Inventor： Jeffrey D. Frank ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp ,  Andrew C. Telch ,  Dwight Dumpert ,  Mark Nussmeier ,  Eric A. Kurth

IPC: H04N5/33 ,  H04N5/232 ,  H04N5/225

CPC classification number: H04N5/33 ,  H04N5/2252 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/23229 ,  H04N5/23241 ,  H04N5/3651

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Abstract translation: 公开了用于提供被配置为可释放地附接到移动电话或其他便携式电子设备并向其提供红外成像功能的设备附件的各种技术。 例如，装置附件可以包括在其后表面上具有桶以至少部分地接收用户装置的壳体，设置在壳体内并被配置为捕获热红外图像数据的红外传感器组件，以及通信地处理模块 耦合到红外传感器组件并且被配置为将热红外图像数据传输到用户设备。 热红外图像数据可以由红外传感器组件捕获，并且响应于由应用程序或在用户设备上运行的其他软件/硬件例程发送的请求，由处理模块传送到用户设备。

公开(公告)号：US20140092256A1

公开(公告)日：2014-04-03

申请号：US14092794

申请日：2013-11-27

Applicant: FLIR Systems, Inc.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Steve Barskey ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H01L27/146 ,  H04N5/359

CPC classification number: H04N5/33 ,  H01L27/1469 ,  H04N5/359 ,  H04N5/365

Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.

Abstract translation: 提供了使用集成电路实现，操作和制造红外成像装置的各种技术。 在一个示例中，系统包括焦平面阵列（FPA）集成电路，其包括适于对场景进行成像的红外传感器阵列，多个有源电路部件，设置在电路部件上方并连接到电路部件的第一金属层，第二 金属层，设置在第一金属层上方并连接到第一金属层，以及第三金属层，设置在第二金属层的上方和红外传感器的下方。 第三金属层连接到第二金属层和红外传感器。 第一，第二和第三金属层是红外传感器和电路部件之间的FPA的唯一金属层。 第一，第二和第三金属层适于在电路部件和红外传感器之间路由信号。